KR960005795A - 반도체소자의 콘택 제조방법 - Google Patents

반도체소자의 콘택 제조방법 Download PDF

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Publication number
KR960005795A
KR960005795A KR1019940017552A KR19940017552A KR960005795A KR 960005795 A KR960005795 A KR 960005795A KR 1019940017552 A KR1019940017552 A KR 1019940017552A KR 19940017552 A KR19940017552 A KR 19940017552A KR 960005795 A KR960005795 A KR 960005795A
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South Korea
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semiconductor device
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KR1019940017552A
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KR0135690B1 (ko
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금동렬
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김주용
현대전자산업 주식회사
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Priority to KR1019940017552A priority Critical patent/KR0135690B1/ko
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Publication of KR0135690B1 publication Critical patent/KR0135690B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76829—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing characterised by the formation of thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers
    • H01L21/76831—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing characterised by the formation of thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers in via holes or trenches, e.g. non-conductive sidewall liners
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76829—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing characterised by the formation of thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers
    • H01L21/76832—Multiple layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76829—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing characterised by the formation of thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers
    • H01L21/76834—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing characterised by the formation of thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers formation of thin insulating films on the sidewalls or on top of conductors

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

본 발명은 반도체소자의 콘택 제조방법에 관한 것으로, 콘택홀 측벽에 이웃하는 도전층과 콘택용 도전층 사이에 절연불량이 발생하는 것을 방지하기 위해 콘택홀 측벽 상부에 선택적으로 다결정실리콘막을 성장시켜 콘택홀 측벽의 절연막 스페이서를 보호하도록하여 콘택용 도전층과 콘택홀 측벽에 있는 도전층과 단락이나 절연 불량이 발생되는 문제점을 극복할 수 있다.

Description

반도체소자의 콘택 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 2A도 내지 제 2F도는 본 발명에 의해 소오스/드레인영역에 콘택을 형성하는 단계를 도시한 단면도.

Claims (3)

  1. 반도체소자의 콘택 제조방법에 있어서, 반도체기판상부에 게이트산화막, 워드라인용 제1다결정실리콘막, 제1절연막 및 제2다결정실리콘막이 적층된 워드라인 패턴을 일정간격 이격시켜 형성하는 단계와, 상기 워드라인 패턴 측벽에 제2절연막 스페이서를 형성하고, 불순물을 주입하여 소오스/드레인영역을 형성하는 단계와, 예정된 콘택영역 상부와 이웃하는 워드라인 패턴의 일정상부까지 덮혀지는 패드마스크용 감광막패턴을 형성하는 단계와, 노출된 제2다결정실리콘막을 식각한 다음, 상기 감광막패턴을 제거하고, 남아있는 제2다결정실리콘막의 표면에 선택적으로 제3다결정실리콘막을 두껍게 성장시켜 상기 제2절연막 스페이서의 일정부분까지 오버랩되도록 하는 단계와, 전체적으로 평탄화용 절연막을 증착한 다음, 콘택마스크를 이용한 식각공정으로 소오스/드레인영역이 노출되는 콘택홀을 형성하는 단계와, 전체적으로 도전층을 증착하여 하부의 소오스/드레인영역에 콘택하는 단계를 포함하는 반도체소자의 콘택 제조방법.
  2. 제1항에 있어서, 상기 콘택홀을 형성할 때 콘택영역에 돌출된 상기 제3다결정실리콘막이 식각장벽층으로 이용되어 콘택홀 측벽의 상기 제2절연막 스페이서가 보호되도록 하는 것을 특징으로 하는 반도체소자의 콘택 제조방법.
  3. 제1항에 있어서, 상기 콘택마스크는 비트라인 콘택마스크 또는 저장전극 콘택마스크인 것을 특징으로 하는 반도체소자의 콘택 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019940017552A 1994-07-20 1994-07-20 반도체소자의 콘택 제조방법 KR0135690B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019940017552A KR0135690B1 (ko) 1994-07-20 1994-07-20 반도체소자의 콘택 제조방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019940017552A KR0135690B1 (ko) 1994-07-20 1994-07-20 반도체소자의 콘택 제조방법

Publications (2)

Publication Number Publication Date
KR960005795A true KR960005795A (ko) 1996-02-23
KR0135690B1 KR0135690B1 (ko) 1998-04-24

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KR1019940017552A KR0135690B1 (ko) 1994-07-20 1994-07-20 반도체소자의 콘택 제조방법

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100458464B1 (ko) * 1997-12-30 2005-02-05 주식회사 하이닉스반도체 반도체소자의콘택형성방법
KR100587036B1 (ko) * 1999-10-25 2006-06-07 주식회사 하이닉스반도체 반도체소자의 컨택 형성방법
KR100527545B1 (ko) * 2000-12-28 2005-11-09 주식회사 하이닉스반도체 반도체 소자의 제조 방법
KR100503519B1 (ko) * 2003-01-22 2005-07-22 삼성전자주식회사 반도체 장치 및 그 제조방법

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