KR950703207A - 다중칩 모듈 합체용 금속 전자 패키지(Metal electronic package incorparating a multi-chip module) - Google Patents

다중칩 모듈 합체용 금속 전자 패키지(Metal electronic package incorparating a multi-chip module) Download PDF

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Publication number
KR950703207A
KR950703207A KR1019950700681A KR19950700681A KR950703207A KR 950703207 A KR950703207 A KR 950703207A KR 1019950700681 A KR1019950700681 A KR 1019950700681A KR 19950700681 A KR19950700681 A KR 19950700681A KR 950703207 A KR950703207 A KR 950703207A
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South Korea
Prior art keywords
leadframe
semiconductor devices
base member
metal
assembly
Prior art date
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KR1019950700681A
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English (en)
Inventor
에스. 브래든 제프레이
클레인 자콥
마휴리카 디팩
Original Assignee
폴 와인스타인
오린 코포레이션(Olin Corporation)
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Publication of KR950703207A publication Critical patent/KR950703207A/ko

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Abstract

하이브리드 회로(42)를 지지하기 위한 리드프레임 조립체(40)를 제공한다. 이 하이브리드 회로(42)는 전자 패키지(70)의 베이스(12)나 다이부착 패클(20)에 의해 지지되며 와이머 본드(28)에 의해 리드프레임(16)에 전기적으로 접속된다. 복수의 반도체 장치(24)는 조립체(40)상에 장착되며 하이브리드 회로(42)상에 형성된 금속 피복 패드(46´), 하이브리드 회로(42)의 절연층(44), 다이부착 패클(20), 금속 패키지 베이스(12) 중 어느 하나에 의해 또는 이들의 결합에 의해 지지된다.(제4도)

Description

다중칩 모듈 합체용 금속 전자 패키지(Metal electronic package incorparating a multi-chip module)
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (23)

  1. (정정) 복수의 반도체 장치(24)를 전기적으로 접속하기 위한 리드프레임 조립체(40)에 있어서, 무기 절연층(56)으로 적어도 부분적으로 피복된 금속 베이스부재(12); 중앙영역을 한정하는 내부 리드단부(34)를 가진 리드프레임; 상기 금속 베이스 부재(12)에 접합되어 있고 회로선(46)을 지지하고 있는 절연기판(44)을 포함하고 상기 회로선(46)의 적어도 일부분을 상기 내부리드 단부에 전기적으로 접속하기 위한 제1수단(28, 50)과 복수의 반도체 장치(24)를 지지하기 위한 제2수단(12, 20, 44, 46´)을 구비하고 있은 하이브리드 회로(42); 및 상기 리드프레임(34)과 상기 하이브리드 회로(42) 양자를 상기 금속 베이스 부재(12)에 개별적으로 접합하기 위한 제3수단(22)으로 이루어진 것을 특징으로 하는 리드프레임 조립체.
  2. (정정) 제1항에 있어서, 상기 제1수단(28, 50)은 금속 피복된 중재용 패드(46˝), 상기 절연기판에서 상기 내부 리드 단부로 연장하는 금속 박편(50) 및 상기 내부리드 단부(34)의 접합용 금속 패드(46′)로 이루어진 군에서 선택되는 것을 특징으로 하는 리드프레임 조립체.
  3. 제2항에 있어서, 상기 제1수단(50)은 서모소닉 접합, 열 압착 접합, 솔더링 및 전도성 접착제로 이루어진 군에서 선택된 수단으로 접합(52)되는, 상기 절연기판(44)에서 상기 내부 리드 단부(34)로 연장하는, 금속 박편(50)인 것을 특징으로 하는 리드프레임 조립체.
  4. 제3항에 있어서, 상기 금속박편은 금-주석 합금 및 납-주석 합금으로 이루어진 군에서 선택된 솔더로 상기 리드프레임에 접합되는 것을 특징으로 하는 리드프레임 조립체.
  5. 제3항에 있어서, 상기 제1수단(50)은 서모소닉 접합, 열압착접합, 솔더링 및 전도성 폴리머 접착제로 이루어진 군에서 선택된 수단으로 상기 내부 리드 단부(34)에 접합(52)된 금속 피복된 접합 패드(46´)인 것을 특징으로 하는 리드프레임 조립체.
  6. 제3항에 있어서, 상기 제1수단(50)은 금-주석 합금 및 납-주석 합금으로 이루어진 군에서 선택된 솔더로 솔더링(52)하는 것을 특징으로 하는 리드프레임 조립체.
  7. 제3항에 있어서, 상기 제2수단은 상기 절연기판(44)상에 형성된 금속피복된 패드(46´)에 대한 상기 복수의 분리된 반도체 장치(24)의 접합, 상기 절연기판(44)에 대한 상기 복수의 분리된 반도체 장치(24)의 직접 접합 및 이들의 결합으로 이루어진 군에서 선택되는 것을 특징으로 하는 리드프레임 조립체.
  8. 제7항에 있어서, 상기 복수의 분리된 반도체 장치(24)중 적어도 하나(24a)는 상기 절연기판(44)상에 형성된 금속피복된 패드(46´)에 접합되며, 상기 금속피복된 패드(46´)는 상기 리드프레임(34)이나 상기 복수의 분리된 반도체 장치(24)중 다른 것에 전기적으로 접속되는 것을 특징으로 하는 리드프레임 조립체.
  9. 제3항에 있어서, 상기 제3수단(22)은 폴리머 및 실링 글라스로 이루어진 군에서 선택되는 것을 특징으로 하는 리드프레임 조립체.
  10. 제9항에 있어서, 상기 제3수단(22)은 열전도성을 증가시키는 재료가 충전된 열경화 폴리머를 포함하는 것을 특징으로 하는 리드프레임 조립체.
  11. 제9항에 있어서, 무기 절연층(56)이 상기 금속 베이스 부재(12)와 상기 제3접합 수단(22) 사이에 배치되어 있는 것을 특징으로 하는 리드프레임 조립체.
  12. 제11항에 있어서, 상기 금속 베이스 부재(12)는 알루미늄 또는 알루미늄 기제 합금으로 형성되며 상기 무기 절연층(56)은 양극 산화층인 것을 특징으로 하는 리드프레임 조립체.
  13. 제11항에 있어서, 상기 금속 베이스 부재(12)는 약 2 내지 12%의 알루미늄을 함유하는 구리 기체 합금이며 상기 무기 절연층(56)은 자연위치에 형성된 내열성 산화물인 것을 특징으로 하는 리드프레임 조립체.
  14. 제11항에 있어서, 상기 금속 베이스 부재(12)는 니켈 및 알루미늄으로 이루어진 군에서 선택된 제2금속 또는 합금으로 피복된 구리 또는 구리기제 합금이며 상기 무기 절연층(56)은 상기 피복으로 형성된 내열성 산화물인 것을 특징으로 하는 리드프레임 조립체.
  15. 제2항에 있어서, 상기 제1수단은 상기 내부 리드 단부(34)를 상기 회로선(46)에 직접 접합하기 위한 금속 피복된 접합 패드(46´)이며 상기 접합 수단(52)는 솔더 및 전도성 접착제로 이루어진 군에서 선택되는 것을 특징으로 하는 리드프레임 조립체.
  16. 제15항에 있어서, 상기 제2수단(12, 44, 46´, 56)은 상기 절연기판(44)상에 형성된 금속 피복 패드(46´)에 대한 상기 복수의 반도체 장치(24)의 접합, 상기 절연기판(44)에 대한 상기 복수의 반도체 장치(24)의 접합, 상기 금속 베이스부재(12)에 대한 상기 복수의 반도체 장치(24)의 접합 및 이들의 결합으로 이루어진 군에서 선택되는 것을 특징으로 하는 리드프레임 조립체.
  17. 제16항에 있어서, 상기 복수의 반도체 장치(24)중 적어도 하나(24a)는 상기 절연기판(44)상에 형성된 금속 피복된 패드(46´)에 접합되어 있고 상기 금속 피복 패드(46´)는 상기 리드프레임(34)이나 다른 반도체 장치(24)에 전기적으로 접속되어 있는 것을 특징으로 하는 리드프레임 조립체.
  18. 복수의 반도체 장치(24)를 전기적으로 접속하기 위한 리드프레임 조립체(40)에 있어서, 금속 베이스 부재(12); 적어도 하나의 중앙영역을 한정하는 내부리드 단부(34)를 가지고 있는 리드프레임; 상기 적어도 하나의 중앙 영역내에 위치된 복수의 다이 부착 패들(20; 및 상기 리드 프레임(34)와 상기 복수의 다이부착 패들(20) 양자를 상기 금속 베이스 부재(12)에 접합하기 위한 절연 접합 수단(22)으로 이루어진 것을 특징으로 하는 리드프레임 조립체.
  19. 제18항에 있어서, 상기 절연 접합 수단(22)은 열경화 폴리머, 열가소성 폴리머 및 실링 글라스로 이루어진 군에서 선택되는 것을 특징으로 하는 리드프레임 조립체.
  20. 제19항에 있어서, 무기 절연층(56)이 상기 금속 베이스부재(12)와 상기 절연 접합 수단(22) 사이에 배치되어 있는 것을 특징으로 하는 리드프레임 조립체.
  21. 제19항에 있어서, 상기 리드프레임(34)은 와이어 본드(28) 및 TAB 본드(50)로 이루어진 군에서 선택된 수단으로 상기 복수의 반도체 장치(24)에 전기적으로 접속되어 있는 것을 특징으로 하는 리드프레임 조립체.
  22. 제21항에 있어서, 상기 리드프레임(34)으로부터 분리되어 있고 와이어 본드(28) 및 TAB 본드(50)로 이루어진 군에서 선택된 수단에 의해 복수의 반도체 장치(24)중 적어도 하나에 또는 상기 리드프레임(34)에 전기적으로 접속되거나 이들 양자(24, 34)에 전기적을 접속되어 있는 전기 전도성 부분(66)을 포함하는 것을 특징으로 하는 리드프레임 조립체.
  23. 복수의 집적회로 장치(24)를 수용하기 위한 전자 패키지(70)에 있어서, 무기 절연층(56)으로 적어도 부분적으로 피복된 금속 베이스 부재(12); 커버부재(14); 상기 금속 베이스 부재(12)와 상기 커버 부재(14) 사이에 배치되어 이들 양자에 접합(18)되고, 적어도 하나의 중앙 영역을 한정하는 내부 리드 단부(34)를 갖고 있는 리드프레임(16); 및 상기 중앙영역에 인접해 있고 상기 내부 리드 단부에 전기적으로 접속(28)되어 있는 회로 조립체(42)를 포함하는 것을 특징으로 하는 전자 패키지.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950700681A 1992-08-21 1993-08-02 다중칩 모듈 합체용 금속 전자 패키지(Metal electronic package incorparating a multi-chip module) KR950703207A (ko)

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US5504372A (en) 1996-04-02
JPH08500469A (ja) 1996-01-16
EP0656150A4 (en) 1995-11-29
WO1994005038A1 (en) 1994-03-03
US6300673B1 (en) 2001-10-09
AU4793893A (en) 1994-03-15
CA2142866A1 (en) 1994-03-03
TW238419B (ko) 1995-01-11
EP0656150A1 (en) 1995-06-07
MX9305074A (es) 1994-04-29

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