KR950021299A - 화합물 반도체장치 - Google Patents
화합물 반도체장치 Download PDFInfo
- Publication number
- KR950021299A KR950021299A KR1019940037328A KR19940037328A KR950021299A KR 950021299 A KR950021299 A KR 950021299A KR 1019940037328 A KR1019940037328 A KR 1019940037328A KR 19940037328 A KR19940037328 A KR 19940037328A KR 950021299 A KR950021299 A KR 950021299A
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- South Korea
- Prior art keywords
- electrode
- layer
- semiconductor device
- compound semiconductor
- electrode pad
- Prior art date
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- 239000004065 semiconductor Substances 0.000 title claims description 13
- 150000001875 compounds Chemical class 0.000 title claims 8
- 239000000463 material Substances 0.000 claims abstract 3
- 239000000758 substrate Substances 0.000 claims abstract 2
- 229910000679 solder Inorganic materials 0.000 claims 4
- 229910052737 gold Inorganic materials 0.000 claims 2
- 229910052738 indium Inorganic materials 0.000 claims 2
- 239000010410 layer Substances 0.000 claims 2
- 229910052745 lead Inorganic materials 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- 229910052718 tin Inorganic materials 0.000 claims 2
- 239000004642 Polyimide Substances 0.000 claims 1
- 229910052581 Si3N4 Inorganic materials 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 229910052755 nonmetal Inorganic materials 0.000 claims 1
- 229910052763 palladium Inorganic materials 0.000 claims 1
- 229920001721 polyimide Polymers 0.000 claims 1
- 229910052703 rhodium Inorganic materials 0.000 claims 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 1
- 229910052814 silicon oxide Inorganic materials 0.000 claims 1
- 239000002356 single layer Substances 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 abstract 2
- 239000012535 impurity Substances 0.000 abstract 2
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 abstract 1
- 230000006866 deterioration Effects 0.000 abstract 1
- 230000031700 light absorption Effects 0.000 abstract 1
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- Condensed Matter Physics & Semiconductors (AREA)
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- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Light Receiving Elements (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
본 발명은, 장치의 신뢰성의 저하를 방지함과 동시에 마운트부재에 소자를 마운트 한 후의 소자의 박리강도를 크게 한다.
N+-InP기판(21)상에 N-InP버퍼층(22)을 퇴적하고, 버퍼층(22)상에 InGaAs광흡수층(23)을 퇴적하며, 광흡수층(23)상에 N-InP캡층(24)을 퇴적하고, 광흡수층(23)과, 캡층(24)내에 P형 불순물영역(25)을 형성한다. 다음, 캡층(24)상에 마스크를 형성하고, 마스크막을 마스크로서 캡층(24)과, 광흡수층(23)및, 버퍼층(22)을 에칭제거하며, P전극 형성영역(27)과 N전극 형성영역(28)을 형성한다. 다음, 캡층(24)의 P형 불순물영역(25)의 주변부상에 절연막(29)를 설치하고, P전극 형성영역(27), N전극 형성영역(28) 각각의 위에 적층도랑으로 이루어지는 전극패드(33,34)를 형성하고, 절연막(29)의 위, P전극의 전극패드(33)의 표면의 주위와 측면의 비금속물질(35)을 형성한다. 따라서, 장치의 신뢰성의 저하를 방지할 수 있다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 제1실시예에 따른 이면입사 플립치형 반도체 수광소자를 도시한 단면도이다.
제2도는 본 발명의 제2실시예에 의한 이면입사 플립칩형 반도체 수광소자를 도시한 단면도이다.
Claims (8)
- 반도체 기판의 위에 전극이 설치된 반도체 칩과, 상기 전극의 위에 설치된 전극패드, 상기 전극패드의 표면의 주위 및 측면에 설치된 비금속물질 및, 상기 반도체칩을 상기 전극패드의 상면을 접합면으로 땜납을 매개로 마운트 하는 마운트부재를 구비하여 이루어진 것을 특징으로 하는 화합물 반도체장치.
- 제1항에 있어서, 상기 전극의 표면상에 설치된 땜납돌기를 더 구비한 것을 특징으로 하는 화합물 반도체장치.
- 제1항 또는 제2항에 있어서, 상기 비금속물질은 산화실리콘과, 질화 실리콘 및, 폴리이미드로 이루어진 것을 특징으로 하는 화합물 반도체장치.
- 제1항 또는 제2항에 있어서, 상기 전극패드는 적어도 Ni와,Pd,Rh및,Ti중 하나로 이루어진 금속층을 갖춘 것을 특징으로 하는 화합물 반도체장치.
- 제1항 또는 제2항에 있어서, 상기 전극패드는 단층 또는 복수의 금속층으로 이루어진 것을 특징으로 하는 화합물 반도체장치.
- 제1항에 있어서, 상기 땜납은 적어도 Au와,Sn,Pb및,In중의 하나를 주성분으로 하는 것을 특징으로 하는 화합물 반도체장치.
- 제2항에 있어서, 상기 땜납돌기는 적어도 Au와,Sn,Pb및,In중의 하나를 주성분으로 하는 것을 특징으로 하는 화합물 반도체장치.
- ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5347237A JP3054021B2 (ja) | 1993-12-27 | 1993-12-27 | 化合物半導体装置 |
JP93-347237 | 1993-12-27 |
Publications (2)
Publication Number | Publication Date |
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KR950021299A true KR950021299A (ko) | 1995-07-26 |
KR0184025B1 KR0184025B1 (ko) | 1999-04-15 |
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Application Number | Title | Priority Date | Filing Date |
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KR1019940037328A KR0184025B1 (ko) | 1993-12-27 | 1994-12-27 | 화합물 반도체장치 |
Country Status (4)
Country | Link |
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US (1) | US5506451A (ko) |
EP (1) | EP0660403B1 (ko) |
JP (1) | JP3054021B2 (ko) |
KR (1) | KR0184025B1 (ko) |
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EP0815593B1 (en) | 1995-03-20 | 2001-12-12 | Unitive International Limited | Solder bump fabrication methods and structure including a titanium barrier layer |
US5760423A (en) * | 1996-11-08 | 1998-06-02 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device, electrode of the same device and method of manufacturing the same device |
US5825092A (en) * | 1996-05-20 | 1998-10-20 | Harris Corporation | Integrated circuit with an air bridge having a lid |
DE19702186C2 (de) * | 1997-01-23 | 2002-06-27 | Fraunhofer Ges Forschung | Verfahren zur Gehäusung von integrierten Schaltkreisen |
US6784463B2 (en) * | 1997-06-03 | 2004-08-31 | Lumileds Lighting U.S., Llc | III-Phospide and III-Arsenide flip chip light-emitting devices |
US6936859B1 (en) * | 1998-05-13 | 2005-08-30 | Toyoda Gosei Co., Ltd. | Light-emitting semiconductor device using group III nitride compound |
DE19945131A1 (de) * | 1999-09-21 | 2001-04-12 | Osram Opto Semiconductors Gmbh | Elektronisches Bauelement und Beschichtungs-Mittel |
US6407411B1 (en) * | 2000-04-13 | 2002-06-18 | General Electric Company | Led lead frame assembly |
KR100393057B1 (ko) * | 2000-10-20 | 2003-07-31 | 삼성전자주식회사 | 마이크로 렌즈 일체형 표면광 레이저 |
ATE551731T1 (de) * | 2001-04-23 | 2012-04-15 | Panasonic Corp | Lichtemittierende einrichtung mit einem leuchtdioden-chip |
US6747298B2 (en) | 2001-07-23 | 2004-06-08 | Cree, Inc. | Collets for bonding of light emitting diodes having shaped substrates |
US6888167B2 (en) * | 2001-07-23 | 2005-05-03 | Cree, Inc. | Flip-chip bonding of light emitting devices and light emitting devices suitable for flip-chip bonding |
JP2004140195A (ja) * | 2002-10-17 | 2004-05-13 | Nec Electronics Corp | 半導体装置及びその製造方法 |
US8916966B2 (en) * | 2004-09-28 | 2014-12-23 | Triquint Semiconductor, Inc. | Integrated circuit including a heat dissipation structure |
KR100750932B1 (ko) * | 2005-07-31 | 2007-08-22 | 삼성전자주식회사 | 기판 분해 방지막을 사용한 단결정 질화물계 반도체 성장및 이를 이용한 고품위 질화물계 발광소자 제작 |
US20150097290A1 (en) * | 2013-10-04 | 2015-04-09 | Raytheon Company | COMPOSITE METAL TRANSMISSION LINE BRIDGE STRUCTURE FOR MONOLITHIC MICROWAVE INTEGRATED CIRCUITS (MMICs) |
JP2017037871A (ja) * | 2015-08-06 | 2017-02-16 | 住友電気工業株式会社 | 受光装置、受光装置を作製する方法 |
CN110856375B (zh) * | 2018-08-21 | 2021-11-16 | 宏启胜精密电子(秦皇岛)有限公司 | 热压熔锡焊接电路板及其制作方法 |
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US3716907A (en) * | 1970-11-20 | 1973-02-20 | Harris Intertype Corp | Method of fabrication of semiconductor device package |
US4176443A (en) * | 1977-03-08 | 1979-12-04 | Sgs-Ates Componenti Elettronici S.P.A. | Method of connecting semiconductor structure to external circuits |
US4258382A (en) * | 1978-07-03 | 1981-03-24 | National Semiconductor Corporation | Expanded pad structure |
JPS5839047A (ja) * | 1981-09-02 | 1983-03-07 | Hitachi Ltd | 半導体装置およびその製法 |
US5260603A (en) * | 1990-01-25 | 1993-11-09 | Kabushiki Kaisha Toshiba | Electrode structure of semiconductor device for use in GaAs compound substrate |
US5247204A (en) * | 1990-06-05 | 1993-09-21 | Seiko Epson Corporation | Semiconductor device having multilayer interconnection structure |
US5239189A (en) * | 1991-06-07 | 1993-08-24 | Eastman Kodak Company | Integrated light emitting and light detecting device |
JP2861629B2 (ja) * | 1992-05-27 | 1999-02-24 | 日本電気株式会社 | 半導体装置 |
JP3115148B2 (ja) * | 1993-03-31 | 2000-12-04 | 株式会社東芝 | 半導体装置の製造方法 |
-
1993
- 1993-12-27 JP JP5347237A patent/JP3054021B2/ja not_active Expired - Fee Related
-
1994
- 1994-12-23 EP EP94120592A patent/EP0660403B1/en not_active Expired - Lifetime
- 1994-12-23 US US08/363,322 patent/US5506451A/en not_active Expired - Lifetime
- 1994-12-27 KR KR1019940037328A patent/KR0184025B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US5506451A (en) | 1996-04-09 |
EP0660403B1 (en) | 1999-06-16 |
JPH07193070A (ja) | 1995-07-28 |
JP3054021B2 (ja) | 2000-06-19 |
EP0660403A1 (en) | 1995-06-28 |
KR0184025B1 (ko) | 1999-04-15 |
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