KR950015830A - 트랜지스터 및 수직형 트랜지스터 - Google Patents
트랜지스터 및 수직형 트랜지스터 Download PDFInfo
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- KR950015830A KR950015830A KR1019940030710A KR19940030710A KR950015830A KR 950015830 A KR950015830 A KR 950015830A KR 1019940030710 A KR1019940030710 A KR 1019940030710A KR 19940030710 A KR19940030710 A KR 19940030710A KR 950015830 A KR950015830 A KR 950015830A
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- 229910021420 polycrystalline silicon Inorganic materials 0.000 abstract 1
- 229920005591 polysilicon Polymers 0.000 abstract 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0684—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape, relative sizes or dispositions of the semiconductor regions or junctions between the regions
- H01L29/0692—Surface layout
- H01L29/0696—Surface layout of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/1012—Base regions of thyristors
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- H—ELECTRICITY
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- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/1095—Body region, i.e. base region, of DMOS transistors or IGBTs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42372—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out
- H01L29/4238—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out characterised by the surface lay-out
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
- H01L29/41725—Source or drain electrodes for field effect devices
- H01L29/41741—Source or drain electrodes for field effect devices for vertical or pseudo-vertical devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42364—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the insulating layer, e.g. thickness or uniformity
- H01L29/42368—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the insulating layer, e.g. thickness or uniformity the thickness being non-uniform
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Electrodes Of Semiconductors (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Abstract
트랜지스터(200)는 단일 공통베이스 영역(202)을 포함한다. 하나이상의 소스영역(112)은 베이스 영역(202)에 형성된다. 하나이상의 게이트 영역(120)은 공통베이스(202) 및 소스영역(112)위에 놓인다. 다른 실시예에 있어서, 게이트 영역(320)은 분기된 중심부(321)를 갖는다. 또다른 실시예에 있어서, 소정의 소스영역(402)은 교차 접속된다. 따라서, 폴리실리콘 패턴(602)은 게이트 핑거 피트 네트워크(614, 616, 618)와, 가장 긴 다이 크기의 1/2 이하의 길이를 갖는 게이트 핑거(604, 606, 608, 620)를 제공하는데 사용된다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 일실시예에 따른 수직형 MOS 트랜지스터의 개략적인 횡단면도,
제2도는 본 발명의 일실시예에 따른 트랜지스터의 개략적인 평면도.
제3도는 본 발명에 따른 트랜지스터의 다른 실시예의 계략적인 횡단면도.
제4도는 본 발명에 따른 트랜지스터의 다른 실시예의 부분 평면도.
Claims (5)
- 트랜지스터가 제1 표면(118) 및 상기 제1 표면(118)에 평행한 제2 표면(122)과, 상기 제1 표면(118)에서 상기 제2표면(122)으로 전류를 전도하기 위해 구성된 트랜지스터를 구비하는 수직으로 적층된 반도체 구조(100)와, 단일 공통 베이스 영역(202) 및, 제1 재료를 구비하고, 단일 공통 베이스 영역(202)에 형성된 하나이상의 소스 영역을 포함하는데, 상기 하나 이상의 소스영역(112)중 소정 인접한 한 영역은 제1 재료와 교차 접속되는 것을 특징으로 하는 트랜지스터.
- 트랜지스터가 공통 베이스 영역(202)과, 상기 공통 베이스 영역(202)에 형성된 하나 이상의 소스영역(112) 및, 상기 공통 베이스 영역(202)과하나 이상의 소스영역(112)을 겹치는 하나 이상의 게이트 영역(120)을 포함하는데, 각각의 게이트 영역(120)이 횡단면을 갖는 연장된 게이트 핑거(32O)와 중심부(321)와 상기 엣지부(322)를 갖는 횡단면을 포함하고, 상기 중심부(321)는 엣지부(322)보다 더 두꺼운 것을 특징으로 하는 트랜지스터.
- 수직형 트랜지스터가 공통 스트라이프형 베이스 영역(202)과, 제1 도핑된 재료와, 공통 스트라이프형 베이스 영역(202)에 형성된 다수의 소스영역(510)과, 상기 제1 도핑된 재료와 교차 접속(512)되어지는 소스 영역중 소정인접 영역 및, 공통 스트라이프형 베이스영역(22) 및 하나 이상의 소스영역(510)을 겹치는 하나 이상의 게이트 핑거(120)를 포함하는 수직형 트랜지스터.
- 트랜지스터가 길이와 폭을 가진 반도체 다이(600)와, 다수의 게이트 핑거(604, 606, 608, 610)와 다수의 소스 접촉 영역(112)을 노출시키는 패턴 형성된 게이트 영역(602)과, 게이트 피드 네트워크(614, 616, 618)와, 게이트 핑거상의 가장 먼 지점으로부터 게이트 피드 네트워크(614, 616, 618)까지의 거리인 게이트 핑거 길이를 가진 다수의 각 게이트 핑거(604, 606, 608, 610)와 다수의 소스 접촉영역(112)으로부터 전기적으로 절연되는 게이트 피드(614, 616, 618)네트워크와 연속해서 전기적으로 결합되는 다수의 소스접촉 영역(112)과 접촉하는 단일금속 레벨(700))을 포함하는데, 최대 게이트 핑거길이는 비교적 큰 반도체 다이길이 및 폭의 1/2 이하인 것을 특징으로 하는 트랜지스터.
- 트랜지스터가 정열된 게이트 핑거(604, 606, 608, 610)이를 다수의 병혈로 분산시킨 다수의 소스영역(112)과 연속해서 전기적으로 결합되는 다수의 소스영역(112)과, 다수의 게이트 핑거(604, 606, 608, 610) 모두에 전기적 접촉을 제공하는 단일금속 레벨(700) 및, 단일 금속 레벨의 일부(704)를 통해 다수의 소스영역(112)에 접촉하는 단일외부 전기적 접촉부(710)를 포함하는 것을 특징으로 하는 트랜지스터.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15550493A | 1993-11-22 | 1993-11-22 | |
US155,504 | 1993-11-22 | ||
US272,899 | 1994-07-08 | ||
US08/272,899 US5396097A (en) | 1993-11-22 | 1994-07-08 | Transistor with common base region |
Publications (1)
Publication Number | Publication Date |
---|---|
KR950015830A true KR950015830A (ko) | 1995-06-17 |
Family
ID=26852373
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019940030710A KR950015830A (ko) | 1993-11-22 | 1994-11-22 | 트랜지스터 및 수직형 트랜지스터 |
Country Status (6)
Country | Link |
---|---|
US (1) | US5396097A (ko) |
EP (2) | EP0655787A3 (ko) |
JP (1) | JPH07193243A (ko) |
KR (1) | KR950015830A (ko) |
CN (1) | CN1034841C (ko) |
SG (1) | SG43005A1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1327246C (zh) * | 2002-12-26 | 2007-07-18 | 旭精工株式会社 | 一种硬币传感器 |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6603173B1 (en) | 1991-07-26 | 2003-08-05 | Denso Corporation | Vertical type MOSFET |
US5723890A (en) * | 1994-01-07 | 1998-03-03 | Fuji Electric Co., Ltd. | MOS type semiconductor device |
US5703389A (en) * | 1995-02-24 | 1997-12-30 | Motorola, Inc. | Vertical IGFET configuration having low on-resistance and method |
EP0823735A1 (en) * | 1996-08-05 | 1998-02-11 | Sgs-Thomson Microelectronics S.A. | MOS-technology power device |
AU1211301A (en) * | 1999-10-22 | 2001-05-08 | Semiconductor Components Industries, L.L.C. | Semiconductor device with a single base region and method therefor |
US6545543B2 (en) * | 2001-07-06 | 2003-04-08 | Remec, Inc. | Small aspect ratio MMIC power amplifier layout |
US6870221B2 (en) * | 2002-12-09 | 2005-03-22 | Semiconductor Components Industries, Llc | Power switching transistor with low drain to gate capacitance |
JP4802306B2 (ja) * | 2003-12-01 | 2011-10-26 | オンセミコンダクター・トレーディング・リミテッド | 半導体装置 |
KR100687108B1 (ko) * | 2005-05-31 | 2007-02-27 | 라이톤 세미컨덕터 코퍼레이션 | 기생 바이폴라 트랜지스터의 턴온을 억제할 수 있는 고전력반도체 소자 |
US7800135B2 (en) | 2005-07-25 | 2010-09-21 | Jean-Michel Reynes | Power semiconductor device and method of manufacturing a power semiconductor device |
US7595523B2 (en) * | 2007-02-16 | 2009-09-29 | Power Integrations, Inc. | Gate pullback at ends of high-voltage vertical transistor structure |
US8723177B2 (en) * | 2011-12-06 | 2014-05-13 | Globalfoundries Inc. | Electrical test structure for devices employing high-k dielectrics or metal gates |
US10325988B2 (en) | 2013-12-13 | 2019-06-18 | Power Integrations, Inc. | Vertical transistor device structure with cylindrically-shaped field plates |
US9543396B2 (en) | 2013-12-13 | 2017-01-10 | Power Integrations, Inc. | Vertical transistor device structure with cylindrically-shaped regions |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53128281A (en) * | 1977-04-15 | 1978-11-09 | Hitachi Ltd | Insulated gate field effect type semiconductor device for large power |
US4135289A (en) * | 1977-08-23 | 1979-01-23 | Bell Telephone Laboratories, Incorporated | Method for producing a buried junction memory device |
US4210465A (en) * | 1978-11-20 | 1980-07-01 | Ncr Corporation | CISFET Processing including simultaneous implantation of spaced polycrystalline silicon regions and non-memory FET channel |
US4212684A (en) * | 1978-11-20 | 1980-07-15 | Ncr Corporation | CISFET Processing including simultaneous doping of silicon components and FET channels |
US4236166A (en) * | 1979-07-05 | 1980-11-25 | Bell Telephone Laboratories, Incorporated | Vertical field effect transistor |
US4593302B1 (en) * | 1980-08-18 | 1998-02-03 | Int Rectifier Corp | Process for manufacture of high power mosfet laterally distributed high carrier density beneath the gate oxide |
DE3040775C2 (de) * | 1980-10-29 | 1987-01-15 | Siemens AG, 1000 Berlin und 8000 München | Steuerbares MIS-Halbleiterbauelement |
US4412242A (en) * | 1980-11-17 | 1983-10-25 | International Rectifier Corporation | Planar structure for high voltage semiconductor devices with gaps in glassy layer over high field regions |
JPS58171861A (ja) * | 1982-04-01 | 1983-10-08 | Toshiba Corp | 半導体装置 |
US4672407A (en) * | 1984-05-30 | 1987-06-09 | Kabushiki Kaisha Toshiba | Conductivity modulated MOSFET |
US4646117A (en) * | 1984-12-05 | 1987-02-24 | General Electric Company | Power semiconductor devices with increased turn-off current ratings and limited current density in peripheral portions |
US4809045A (en) * | 1985-09-30 | 1989-02-28 | General Electric Company | Insulated gate device |
US4860072A (en) * | 1986-03-05 | 1989-08-22 | Ixys Corporation | Monolithic semiconductor device and method of manufacturing same |
JPH0758782B2 (ja) * | 1986-03-19 | 1995-06-21 | 株式会社東芝 | 半導体装置 |
US5231474A (en) * | 1986-03-21 | 1993-07-27 | Advanced Power Technology, Inc. | Semiconductor device with doped electrical breakdown control region |
US4823176A (en) * | 1987-04-03 | 1989-04-18 | General Electric Company | Vertical double diffused metal oxide semiconductor (VDMOS) device including high voltage junction exhibiting increased safe operating area |
JPS6449273A (en) * | 1987-08-19 | 1989-02-23 | Mitsubishi Electric Corp | Semiconductor device and its manufacture |
JPH02133966A (ja) * | 1988-11-14 | 1990-05-23 | Fuji Electric Co Ltd | 電界効果トランジスタ |
JPH077750B2 (ja) * | 1989-05-15 | 1995-01-30 | 株式会社東芝 | 半導体装置の製造方法 |
US5208471A (en) * | 1989-06-12 | 1993-05-04 | Hitachi, Ltd. | Semiconductor device and manufacturing method therefor |
US5313088A (en) * | 1990-09-19 | 1994-05-17 | Nec Corporation | Vertical field effect transistor with diffused protection diode |
US5304831A (en) * | 1990-12-21 | 1994-04-19 | Siliconix Incorporated | Low on-resistance power MOS technology |
JPH05206470A (ja) * | 1991-11-20 | 1993-08-13 | Nec Corp | 絶縁ゲート型電界効果トランジスタ |
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1994
- 1994-07-08 US US08/272,899 patent/US5396097A/en not_active Expired - Lifetime
- 1994-11-14 SG SG1996002157A patent/SG43005A1/en unknown
- 1994-11-14 EP EP94117926A patent/EP0655787A3/en not_active Withdrawn
- 1994-11-14 EP EP97120065A patent/EP0827209A1/en not_active Withdrawn
- 1994-11-21 CN CN94118713A patent/CN1034841C/zh not_active Expired - Fee Related
- 1994-11-21 JP JP6309435A patent/JPH07193243A/ja active Pending
- 1994-11-22 KR KR1019940030710A patent/KR950015830A/ko not_active Application Discontinuation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1327246C (zh) * | 2002-12-26 | 2007-07-18 | 旭精工株式会社 | 一种硬币传感器 |
Also Published As
Publication number | Publication date |
---|---|
EP0655787A3 (en) | 1995-08-16 |
SG43005A1 (en) | 1997-10-17 |
CN1034841C (zh) | 1997-05-07 |
EP0655787A2 (en) | 1995-05-31 |
JPH07193243A (ja) | 1995-07-28 |
US5396097A (en) | 1995-03-07 |
CN1108814A (zh) | 1995-09-20 |
EP0827209A1 (en) | 1998-03-04 |
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