KR950010028A - 액체를 함유한 마이크로전자 장치 패키지 및 그 제조방법 - Google Patents
액체를 함유한 마이크로전자 장치 패키지 및 그 제조방법 Download PDFInfo
- Publication number
- KR950010028A KR950010028A KR1019940022884A KR19940022884A KR950010028A KR 950010028 A KR950010028 A KR 950010028A KR 1019940022884 A KR1019940022884 A KR 1019940022884A KR 19940022884 A KR19940022884 A KR 19940022884A KR 950010028 A KR950010028 A KR 950010028A
- Authority
- KR
- South Korea
- Prior art keywords
- base
- liquid
- lid
- sealant
- block
- Prior art date
Links
- 239000007788 liquid Substances 0.000 title claims abstract description 20
- 238000004377 microelectronic Methods 0.000 title claims abstract description 12
- 238000004519 manufacturing process Methods 0.000 title claims abstract 4
- 239000000565 sealant Substances 0.000 claims abstract 13
- 238000000034 method Methods 0.000 claims abstract 5
- 238000007789 sealing Methods 0.000 claims abstract 3
- 239000003795 chemical substances by application Substances 0.000 claims abstract 2
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/22—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device liquid at the normal operating temperature of the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/54—Providing fillings in containers, e.g. gas fillings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Micromachines (AREA)
Abstract
본 발명은 액체 함유 마이크로전자 장치 패키지 제조 방법에 관한 것이다. 이 방법은 마이크로전자 장치(22)를 포함한 패키지 기부(16)와 패키지 기부(16)에 대해 외주면에 배치된 시일 영역을 제공하는 단계(블럭 32)와, 뚜껑(12)을 제공하는 단계(34)와, 기부(16)와 뚜껑(12)사이에 배치된 밀페제(14)를 제공하는 단계(블럭 34)를 포함한다. 이 방법은 밀폐제(14)의 활성 온도 이상의 온도를 가진 액체(24)내에 패키지 기부(16), 밀폐제(14) 및 뚜껑(12)을 침수시키는 단계(블럭 36)와, 패키지 기부(16)와 뚜껑(12) 사이의 패키지에 액체(24)를 들어가게 하고 밀폐제(14)가 작동하도록 가열시키기에 충분한 시간동안 액체(24)내에서 패키지 기부(16), 밀폐제(14) 및 뚜껑(12)을 유지하는 단계(블럭 38)를 또한 포함한다. 더욱이, 이 방법은 액체를 함유한 밀폐 마이크로전자 장치 패키지(10)를 제공하도록 액체로부터 패키지 기부(16), 뚜껑(12) 및 밀폐제(14)를 제거하는 단계(블럭 40)를 포함한다.
Description
제1도는 본 발명에 따른 액체 함유 마이크로전자 장치 패키지(microelectronic device package)의 등각도,
제2도는 제1도의 선(2-2)을 따라 취한 측단면도,
제3도는 본 발명에 제2실시예의 측단면도.
Claims (3)
- 액체(24)를 함유한 마이크로전자 장치(microelectronic device) 패키지(10)제조 방법에 있어서, 마이크로전자 장치(22)를 포함한 기부(16)와, 이 기부(16)의 주변에 배치된 시일 영역을 제공하는 단계(블럭 34)와, 뚜껑(12)을 기부(16)상에 위치시키는 단계와, 활성온도를 가진 밀폐제(14;sealant)를 기부(16)와 뚜껑(12)사이에 배치하는 단계(블럭 34)와, 활성 온도 이상의 온도를 가진 액체(24)내에 기부(16), 밀폐제(14) 및 뚜껑(12)을 침수 시키는 단계(블럭 36)와, 기부(16)와 뚜껑(12)사이에 액체(24)가 들어가고 밀폐제(14)를 활성화시키도록 밀폐제(14)를 가열하기에 충분한 시간동안 액체(24)내에 기부(16), 밀페제(14) 및 뚜껑(12)을 유지하는 단계(블럭 38)와, 액체(24)를 함유한 밀봉한 마이크로전자 장치 패키지(10)를 제공하도록 기부(16), 뚜껑(12) 및 밀폐제(14)를 액체(24)로부터 제거하는 단계(블럭40)를 폼함하는 것을 특징으로 하는 마이크로전자 장치 패키지 제조 방법.
- 액체(24)를 함유한 마이크로전자 장치 패키지(10)에 있어서, 기부(16)와, 상기 기부(16)상에 정착된 마이크로전자장치(22)와, 마이크로전자 장치(22)를 커버하는 뚜껑(12)과, 기부(16)와 뚜껑(22) 사이에 배치되며, 이들 사이에 중공 밀폐 캐비티를 형성하도록 뚜껑(12)을 기부(16)에 고정하며, 활성 온도를 가진 밀폐제(14)와, 밀폐된 캐비티에 배치되고, 퍼플루오르카본(perflourocarbons)의 혼합물을 포함하고 활성 온도를 초과하는 끊는점을 가진 액체(24)를 포함하는 것을 특징으로 하는 마이크로전자 장치 패키지.
- 반도체 장치(22)를 에워싸는 패키지(10)내에서 캐비티를 충전하기 위한 방법에 있어서, 액체(24)를 제1온도로 가열하는 단계와, 뚜껑(12)과 기부(16)를 가지며, 제1온도보다 낮은 경화 온도를 가지고 뚜껑(12)을 기부(16)에 밀폐하도록 뚜껑(12)과 기부(16) 사이의 밀폐제(14)를 포함한 패키지를 액체(24)내에 위치시키는 단계(블럭 36)와, 캐비티가 액체(24)를 포함하고 밀폐제(14)가 경화될때까지 패키지를 액체(24)내에 유지하는 단계(블럭 38)를 포함하는 것을 특징으로 하는 캐비티 충전방법※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/119,555 US5413965A (en) | 1993-09-13 | 1993-09-13 | Method of making microelectronic device package containing a liquid |
US119,555 | 1993-09-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR950010028A true KR950010028A (ko) | 1995-04-26 |
Family
ID=22385036
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019940022884A KR950010028A (ko) | 1993-09-13 | 1994-09-12 | 액체를 함유한 마이크로전자 장치 패키지 및 그 제조방법 |
Country Status (6)
Country | Link |
---|---|
US (2) | US5413965A (ko) |
EP (2) | EP0952610A3 (ko) |
JP (1) | JPH07106468A (ko) |
KR (1) | KR950010028A (ko) |
CN (1) | CN1034702C (ko) |
TW (1) | TW263610B (ko) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2699365B1 (fr) * | 1992-12-16 | 1995-02-10 | Alcatel Telspace | Système de dissipation de l'énergie calorifique dégagée par un composant électronique. |
US5716763A (en) * | 1994-12-06 | 1998-02-10 | International Business Machines Corporation | Liquid immersion heating process for substrate temperature uniformity |
US5625227A (en) * | 1995-01-18 | 1997-04-29 | Dell Usa, L.P. | Circuit board-mounted IC package cooling apparatus |
EP0788104B1 (en) * | 1995-08-21 | 1999-02-24 | Matsushita Electric Industrial Co., Ltd. | Multimedia optical disk capable of preserving freshness of image content for long time and its reproduction apparatus and method |
US6144157A (en) * | 1998-05-18 | 2000-11-07 | Motorola, Inc. | Organic EL device with fluorocarbon liquid and UV epoxy layers and method |
JP2000357766A (ja) * | 1999-06-14 | 2000-12-26 | Hitachi Ltd | モジュール内への液体冷媒の封止方法 |
JP2001312213A (ja) | 2000-04-26 | 2001-11-09 | Internatl Business Mach Corp <Ibm> | バックライトユニット、液晶表示装置、ならびに導光板の製造方法 |
US6525420B2 (en) | 2001-01-30 | 2003-02-25 | Thermal Corp. | Semiconductor package with lid heat spreader |
US7581585B2 (en) | 2004-10-29 | 2009-09-01 | 3M Innovative Properties Company | Variable position cooling apparatus |
US20080266801A1 (en) * | 2007-04-30 | 2008-10-30 | Rockwell Automation Technologies, Inc. | Phase change cooled power electronic module |
CN101417255B (zh) * | 2007-10-24 | 2011-02-02 | 沈阳黎明航空发动机(集团)有限责任公司 | 一种金红石矿料加工工艺 |
US8324719B2 (en) * | 2009-08-31 | 2012-12-04 | General Electric Company | Electronic package system |
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JPS56164543A (en) * | 1980-05-23 | 1981-12-17 | Hitachi Ltd | Manufacture of semiconductor device |
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JPS6037756A (ja) * | 1983-08-10 | 1985-02-27 | Mitsubishi Electric Corp | 半導体装置 |
JPS60183743A (ja) * | 1984-03-01 | 1985-09-19 | Hitachi Chem Co Ltd | 半導体類のパツケ−ジ成形方法 |
JPS61125057A (ja) * | 1984-11-22 | 1986-06-12 | Hitachi Ltd | 半導体装置 |
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US4721996A (en) * | 1986-10-14 | 1988-01-26 | Unisys Corporation | Spring loaded module for cooling integrated circuit packages directly with a liquid |
JPS6396945A (ja) * | 1986-10-14 | 1988-04-27 | Nippon Denso Co Ltd | 大電力用半導体装置 |
JPS63116461A (ja) * | 1986-11-05 | 1988-05-20 | Tomoegawa Paper Co Ltd | 固体撮像装置の気密封止方法 |
US4961106A (en) * | 1987-03-27 | 1990-10-02 | Olin Corporation | Metal packages having improved thermal dissipation |
JPS63284837A (ja) * | 1987-05-18 | 1988-11-22 | Hitachi Ltd | 半導体素子の冷却構造 |
US4897508A (en) * | 1988-02-10 | 1990-01-30 | Olin Corporation | Metal electronic package |
JPH01291452A (ja) * | 1988-05-19 | 1989-11-24 | Sanyo Electric Co Ltd | 半導体装置の製造方法 |
US5050036A (en) * | 1989-10-24 | 1991-09-17 | Amdahl Corporation | Liquid cooled integrated circuit assembly |
JPH03296237A (ja) * | 1990-04-16 | 1991-12-26 | Hitachi Ltd | 熱伝導用半導体チップの背面接合方法およびそれを用いた半導体装置 |
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JP2867753B2 (ja) * | 1991-02-25 | 1999-03-10 | 富士電機株式会社 | 半導体装置 |
JPH04312962A (ja) * | 1991-03-18 | 1992-11-04 | Mitsubishi Electric Corp | 液体封止半導体装置及びその組立方法 |
US5210440A (en) * | 1991-06-03 | 1993-05-11 | Vlsi Technology, Inc. | Semiconductor chip cooling apparatus |
JP2995590B2 (ja) * | 1991-06-26 | 1999-12-27 | 株式会社日立製作所 | 半導体冷却装置 |
JPH05251578A (ja) * | 1992-03-05 | 1993-09-28 | Hitachi Ltd | 接合方法および接合装置 |
US5305184A (en) * | 1992-12-16 | 1994-04-19 | Ibm Corporation | Method and apparatus for immersion cooling or an electronic board |
US5323294A (en) * | 1993-03-31 | 1994-06-21 | Unisys Corporation | Liquid metal heat conducting member and integrated circuit package incorporating same |
-
1993
- 1993-09-13 US US08/119,555 patent/US5413965A/en not_active Expired - Lifetime
-
1994
- 1994-08-03 TW TW083107120A patent/TW263610B/zh not_active IP Right Cessation
- 1994-09-02 JP JP6232428A patent/JPH07106468A/ja active Pending
- 1994-09-08 EP EP99113040A patent/EP0952610A3/en not_active Withdrawn
- 1994-09-08 EP EP94114086A patent/EP0644592A1/en not_active Withdrawn
- 1994-09-12 KR KR1019940022884A patent/KR950010028A/ko not_active Application Discontinuation
- 1994-09-12 CN CN94115277A patent/CN1034702C/zh not_active Expired - Fee Related
-
1995
- 1995-01-03 US US08/367,628 patent/US5477084A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
TW263610B (ko) | 1995-11-21 |
CN1109219A (zh) | 1995-09-27 |
CN1034702C (zh) | 1997-04-23 |
EP0644592A1 (en) | 1995-03-22 |
EP0952610A3 (en) | 2000-05-17 |
JPH07106468A (ja) | 1995-04-21 |
US5477084A (en) | 1995-12-19 |
EP0952610A2 (en) | 1999-10-27 |
US5413965A (en) | 1995-05-09 |
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A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application |