TW263610B - - Google Patents

Info

Publication number
TW263610B
TW263610B TW083107120A TW83107120A TW263610B TW 263610 B TW263610 B TW 263610B TW 083107120 A TW083107120 A TW 083107120A TW 83107120 A TW83107120 A TW 83107120A TW 263610 B TW263610 B TW 263610B
Authority
TW
Taiwan
Application number
TW083107120A
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Application granted granted Critical
Publication of TW263610B publication Critical patent/TW263610B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/22—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device liquid at the normal operating temperature of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/54—Providing fillings in containers, e.g. gas fillings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Micromachines (AREA)
TW083107120A 1993-09-13 1994-08-03 TW263610B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/119,555 US5413965A (en) 1993-09-13 1993-09-13 Method of making microelectronic device package containing a liquid

Publications (1)

Publication Number Publication Date
TW263610B true TW263610B (zh) 1995-11-21

Family

ID=22385036

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083107120A TW263610B (zh) 1993-09-13 1994-08-03

Country Status (6)

Country Link
US (2) US5413965A (zh)
EP (2) EP0952610A3 (zh)
JP (1) JPH07106468A (zh)
KR (1) KR950010028A (zh)
CN (1) CN1034702C (zh)
TW (1) TW263610B (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2699365B1 (fr) * 1992-12-16 1995-02-10 Alcatel Telspace Système de dissipation de l'énergie calorifique dégagée par un composant électronique.
US5716763A (en) * 1994-12-06 1998-02-10 International Business Machines Corporation Liquid immersion heating process for substrate temperature uniformity
US5625227A (en) * 1995-01-18 1997-04-29 Dell Usa, L.P. Circuit board-mounted IC package cooling apparatus
CN1103486C (zh) * 1995-08-21 2003-03-19 松下电器产业株式会社 能永久保持图象内容新鲜感的光盘的再生装置及再生方法
US6144157A (en) * 1998-05-18 2000-11-07 Motorola, Inc. Organic EL device with fluorocarbon liquid and UV epoxy layers and method
JP2000357766A (ja) * 1999-06-14 2000-12-26 Hitachi Ltd モジュール内への液体冷媒の封止方法
JP2001312213A (ja) 2000-04-26 2001-11-09 Internatl Business Mach Corp <Ibm> バックライトユニット、液晶表示装置、ならびに導光板の製造方法
US6525420B2 (en) * 2001-01-30 2003-02-25 Thermal Corp. Semiconductor package with lid heat spreader
US7581585B2 (en) 2004-10-29 2009-09-01 3M Innovative Properties Company Variable position cooling apparatus
US20080266801A1 (en) * 2007-04-30 2008-10-30 Rockwell Automation Technologies, Inc. Phase change cooled power electronic module
CN101417255B (zh) * 2007-10-24 2011-02-02 沈阳黎明航空发动机(集团)有限责任公司 一种金红石矿料加工工艺
US8324719B2 (en) * 2009-08-31 2012-12-04 General Electric Company Electronic package system

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4092697A (en) * 1976-12-06 1978-05-30 International Business Machines Corporation Heat transfer mechanism for integrated circuit package
US4323914A (en) * 1979-02-01 1982-04-06 International Business Machines Corporation Heat transfer structure for integrated circuit package
JPS56164543A (en) * 1980-05-23 1981-12-17 Hitachi Ltd Manufacture of semiconductor device
JPS607739A (ja) * 1983-06-27 1985-01-16 Nec Corp 半導体装置の製造方法
US4612978A (en) * 1983-07-14 1986-09-23 Cutchaw John M Apparatus for cooling high-density integrated circuit packages
US4730665A (en) * 1983-07-14 1988-03-15 Technology Enterprises Company Apparatus for cooling high-density integrated circuit packages
JPS6037756A (ja) * 1983-08-10 1985-02-27 Mitsubishi Electric Corp 半導体装置
JPS60183743A (ja) * 1984-03-01 1985-09-19 Hitachi Chem Co Ltd 半導体類のパツケ−ジ成形方法
JPS61125057A (ja) * 1984-11-22 1986-06-12 Hitachi Ltd 半導体装置
US5126919A (en) * 1985-10-04 1992-06-30 Fujitsu Limited Cooling system for an electronic circuit device
US4721996A (en) * 1986-10-14 1988-01-26 Unisys Corporation Spring loaded module for cooling integrated circuit packages directly with a liquid
JPS6396945A (ja) * 1986-10-14 1988-04-27 Nippon Denso Co Ltd 大電力用半導体装置
JPS63116461A (ja) * 1986-11-05 1988-05-20 Tomoegawa Paper Co Ltd 固体撮像装置の気密封止方法
US4961106A (en) * 1987-03-27 1990-10-02 Olin Corporation Metal packages having improved thermal dissipation
JPS63284837A (ja) * 1987-05-18 1988-11-22 Hitachi Ltd 半導体素子の冷却構造
US4897508A (en) * 1988-02-10 1990-01-30 Olin Corporation Metal electronic package
JPH01291452A (ja) * 1988-05-19 1989-11-24 Sanyo Electric Co Ltd 半導体装置の製造方法
US5050036A (en) * 1989-10-24 1991-09-17 Amdahl Corporation Liquid cooled integrated circuit assembly
JPH03296237A (ja) * 1990-04-16 1991-12-26 Hitachi Ltd 熱伝導用半導体チップの背面接合方法およびそれを用いた半導体装置
US5097387A (en) * 1990-06-27 1992-03-17 Digital Equipment Corporation Circuit chip package employing low melting point solder for heat transfer
JP2515923B2 (ja) * 1990-11-15 1996-07-10 九州日本電気株式会社 半導体装置の封止方法
JP2867753B2 (ja) * 1991-02-25 1999-03-10 富士電機株式会社 半導体装置
JPH04312962A (ja) * 1991-03-18 1992-11-04 Mitsubishi Electric Corp 液体封止半導体装置及びその組立方法
US5210440A (en) * 1991-06-03 1993-05-11 Vlsi Technology, Inc. Semiconductor chip cooling apparatus
JP2995590B2 (ja) * 1991-06-26 1999-12-27 株式会社日立製作所 半導体冷却装置
JPH05251578A (ja) * 1992-03-05 1993-09-28 Hitachi Ltd 接合方法および接合装置
US5305184A (en) * 1992-12-16 1994-04-19 Ibm Corporation Method and apparatus for immersion cooling or an electronic board
US5323294A (en) * 1993-03-31 1994-06-21 Unisys Corporation Liquid metal heat conducting member and integrated circuit package incorporating same

Also Published As

Publication number Publication date
CN1034702C (zh) 1997-04-23
KR950010028A (ko) 1995-04-26
CN1109219A (zh) 1995-09-27
JPH07106468A (ja) 1995-04-21
EP0644592A1 (en) 1995-03-22
US5413965A (en) 1995-05-09
US5477084A (en) 1995-12-19
EP0952610A3 (en) 2000-05-17
EP0952610A2 (en) 1999-10-27

Similar Documents

Publication Publication Date Title
FR2702022B1 (zh)
FR2707024B1 (zh)
FR2712517B1 (zh)
FR2706747B1 (zh)
EP0779577A3 (zh)
FR2707058B1 (zh)
FR2706801B1 (zh)
FR2706803B1 (zh)
EP0661322A3 (zh)
FR2706945B1 (zh)
FR2706827B1 (zh)
EP0641839A3 (zh)
FR2706894B1 (zh)
FR2706865B1 (zh)
FR2707067B1 (zh)
IN178572B (zh)
FR2706940B1 (zh)
FR2716275B1 (zh)
IN176909B (zh)
IN175247B (zh)
IN178647B (zh)
IN178007B (zh)
IN178546B (zh)
IN178335B (zh)
IN178265B (zh)

Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent