KR950003280A - 에폭시 아크릴레이트 - Google Patents

에폭시 아크릴레이트 Download PDF

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KR950003280A
KR950003280A KR1019940015452A KR19940015452A KR950003280A KR 950003280 A KR950003280 A KR 950003280A KR 1019940015452 A KR1019940015452 A KR 1019940015452A KR 19940015452 A KR19940015452 A KR 19940015452A KR 950003280 A KR950003280 A KR 950003280A
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hydrogen
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KR100341619B1 (ko
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로쓰 마틴
잘빈 로거
마이어 쿠르트
자일러 베른하르트
비젠당거 롤프
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에른스트 알테르
시바-가이기 아게
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    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
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    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/066—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • C08G59/1455—Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
    • C08G59/1461—Unsaturated monoacids
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    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
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    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4292—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof together with monocarboxylic acids
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    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
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    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
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    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable

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  • Materials For Photolithography (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
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Abstract

비교적 분자량이 크고 화학적으로 가교가능한 일반식(Ⅲ) 및 (Ⅳ)의 신규 에폭시 아크릴레이트 및 카르복시기 함유 에폭시 아크릴레이트는 고도로 중합된 중합체 결합체를 부가적으로 사용하여 포토레지스트 배합물에서 사용될 수 있다. 이러한 레지스트 배합물을 특히 인쇄 배선판 및 인쇄판의 분야에서 사용되며 수성매체로부터 도포가능하고 거의 점착성이 없어 특히 도전체상에서 매우 양호한 모서리 피복율을 갖는다.

Description

에폭시 아크릴레이트
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (8)

  1. 하기식(Ⅲ)의 신규 에폭시 아크릴레이트:
    상기식에서, Q는 수소 또는 하기식의 기이고;
    또는R1은 -H- 또는 -CH3이고, R2는 -H-, -CH3또는 페닐이며, T는 방향족 2관능성 화합물의 라디칼이고, M은 각각 독립적으로 수소 또는 하기식의 기이며,
    A는 방향족 2관능성 화합물의 라디칼이고, n은 0 내지 300의 정수이며, L은 하기식의 기이고;
    또는 -O-A-OM, 단, 일반식(Ⅲ)에서, 모든 라디칼 M이 동시에 수소 또는 일반식의 기인 것은 아니며 말단기 Q및 L에 존재하지 않는 라디칼 M의 10몰%이상, 바람직하기로는 20 내지 100몰%는 상기식의 기를 나타낸다.
  2. 제1항에 있어서, R1이 수소 또는 메틸이고 R2가 수소, 메틸 또는 페닐인 일반식(Ⅲ)의 에폭시 아크릴레이트.
  3. 제1항에 있어서, n이 0 내지 50의 정수이고 기호 A 및 T는 각각 독립적으로 하기식의 결합기인 일반식(Ⅲ)의 에폭시 아크릴레이트:
    상기식에서, R4및 R5는 각각 독립적으로 -H 또는 C1-C4알킬이고 결합기의 페닐 라디칼은 비치환 또는 브롬 치환된다.
  4. 승온에서, 촉매 및 중합반응 억제제의 존재하에 에틸렌성 불포화 단일카르복시산과 하기식(Ⅱ)의 후기 글리시딜화된 에폭시 수지를 반응시키는 것을 포함하는 일반식(Ⅲ)의 에폭시 아크릴레이트 제조 방법:
    상기식에서, E는 수소 또는 하기식의 기이고;
    F는 일반식 -O-A-OG 또는이고, G는 -H 또는 라디칼이며, 단, 일반식(Ⅱ)에서, 말단기 E 및 F에 존재하지 않는 라디칼 G의 10몰%이상은 일반식의 기를 나타내고, A,T 및 n은 제1항에 정의된 바와 같다.
  5. 하기식(Ⅳ)의 카르복시기 함유 에폭시 아크릴레이트:
    상기식에서, X는 수소 또는 하기식의 기이고;
    R3는 무수물 라디칼 제거 후의 다중카르복시산의 환형 무수물의 라디칼이며, W1은 수소 또는 하기식의 기이고;
    W2는 -H 또는기이며, Y는 일반식 -O-A-O-W1의 기 또는
    기이며, 기호 A,T,R1,R2,R3및 n은 제1항에 정의된 바와 같고, 단, 일반식(Ⅳ)에서 말단기 X 및 Y에 존재하지 않는 라디칼 W110몰%이상이 하기식의 기이고;
    R1및 R2는 제1항에 정의된 바와 같고 제3항은 제5항에 정의된 바와 같다.
  6. 승온에서, 촉매 및 중합반응 억제제의 임의 존재하에 다중카르복시산의 환형 무수물과 제1항에 정의된 바와 같은 일반식(Ⅲ)의 에폭시 아크릴레이트를 반응시키는 것을 포함하는, 제5항에 따른 일반식(Ⅳ)의 카르복시기 함유 에폭시 아크릴레이트 제조방법.
  7. 포토레지스트 배합물에서 아크릴레이트 성분으로서의 제1항에 정의된 바와 같은 일반식(Ⅲ)의 에폭시 아크릴레이트 용도.
  8. 포토레지스트 배합물에서 아크릴레이트 성분으로서의 제5항에 정의된 바와 같은 일반식(Ⅳ)의 카르복시기 함유 에폭시 아크릴레이트 용도.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019940015452A 1993-07-02 1994-06-30 에폭시아크릴레이트 KR100341619B1 (ko)

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US (2) US6747101B2 (ko)
EP (2) EP1295900B1 (ko)
JP (2) JP3548969B2 (ko)
KR (1) KR100341619B1 (ko)
CN (1) CN1064055C (ko)
AT (1) ATE233287T1 (ko)
CA (1) CA2127203C (ko)
DE (2) DE59410248D1 (ko)
TW (1) TW268011B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100737723B1 (ko) * 2001-07-27 2007-07-10 주식회사 동진쎄미켐 감광성 수지 조성물

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3281473B2 (ja) † 1994-01-17 2002-05-13 日本化薬株式会社 フレキシブルプリント配線板用レジストインキ組成物及びその硬化物
JP3190251B2 (ja) * 1995-06-06 2001-07-23 太陽インキ製造株式会社 アルカリ現像型のフレキシブルプリント配線板用光硬化性・熱硬化性樹脂組成物
DE10223313A1 (de) * 2002-05-24 2003-12-11 Bakelite Ag Modifizierte Epoxyacrylate
WO2004034147A1 (ja) * 2002-10-08 2004-04-22 Hitachi Chemical Co., Ltd. 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板
KR100529371B1 (ko) * 2003-07-29 2005-11-21 주식회사 엘지화학 촉매전구체 수지조성물 및 이를 이용한 투광성 전자파차폐재 제조방법
DE602005022448D1 (de) * 2004-06-28 2010-09-02 Canon Kk Ekopfs und unter verwendung dieses verfahrens erhaltener flüssigkeitsausgabekopf
WO2006001530A2 (en) * 2004-06-28 2006-01-05 Canon Kabushiki Kaisha Liquid discharge head manufacturing method, and liquid discharge head obtained using this method
JP4632152B2 (ja) * 2004-08-25 2011-02-16 ナガセケムテックス株式会社 重合性組成物
US20060261267A1 (en) * 2005-05-20 2006-11-23 Agency For Science, Technology And Research Composite MALDI matrix material and methods of using it and kits thereof in MALDI
JP2007052120A (ja) * 2005-08-16 2007-03-01 Nec Corp 光導波路形成用感光性樹脂組成物、光導波路及び光導波路パターンの形成方法
US7635552B2 (en) * 2006-07-25 2009-12-22 Endicott Interconnect Technologies, Inc. Photoresist composition with antibacterial agent
CN101450992B (zh) * 2007-12-07 2010-12-22 比亚迪股份有限公司 一种聚合物及其制备方法和含有该聚合物的导电胶
GB0817795D0 (en) 2008-09-30 2008-11-05 3M Innovative Properties Co Fast curing oil-uptaking epozxy-based structural adhesives
US8434229B2 (en) * 2010-11-24 2013-05-07 Canon Kabushiki Kaisha Liquid ejection head manufacturing method
DE102012221441A1 (de) * 2012-11-23 2014-05-28 Hilti Aktiengesellschaft Verfahren zur Herstellung von modifizierten Epoxy(meth)acrylatharzen und ihre Verwendung
TWI559082B (zh) 2014-07-07 2016-11-21 財團法人工業技術研究院 生質材料與其形成方法與印刷電路板
CN104311511B (zh) * 2014-09-17 2017-02-15 济南圣泉集团股份有限公司 一种低水解氯衣康酸环氧树脂的制备方法
CN105330820B (zh) * 2015-11-27 2018-08-07 浙江瑞通光电材料有限公司 一种非对称结构改性环氧丙烯酸酯树脂及其连续法合成方法
KR102490181B1 (ko) * 2020-11-25 2023-01-19 오리온산업(주) 비흡수면 기재와 타일 간의 접착 향상용 친환경 수성 프라이머 조성물

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3373075A (en) * 1961-12-18 1968-03-12 Robertson Co H H Diacrylate compositions, heat resistant polymers containing the same and method of making electrical laminates therefrom
US3676524A (en) * 1970-07-27 1972-07-11 Showa Highpolymer Vinyl ester resins prepared with an addition compound of a secondary amine-acid salt catalyst
GB1443822A (en) * 1973-03-06 1976-07-28 Ciba Geigy Polymerisable compositions manufacture of compact bodies form ap
GB1512814A (en) * 1975-08-13 1978-06-01 Ciba Geigy Ag Epoxide resins
US4595734A (en) * 1980-02-04 1986-06-17 Interplastic Corporation Molding compositions
US4359370A (en) * 1980-11-24 1982-11-16 Shell Oil Company Curable epoxy-vinyl ester compositions
DE3565546D1 (en) 1984-06-29 1988-11-17 Siemens Ag Thermostable and irradiation-curable polymer system based on bisphenol and epichlorohydrine, and method for its preparation
US4623701A (en) * 1985-07-10 1986-11-18 The Dow Chemical Company Multifunctional epoxy resins
US4789620A (en) * 1986-03-03 1988-12-06 Mitsubishi Rayon Co. Ltd. Liquid photosensitive resin composition containing carboxylated epoxy acrylates or methacrylates
JPS63258975A (ja) * 1986-12-26 1988-10-26 Toshiba Corp ソルダーレジストインキ組成物
EP0292219A3 (en) * 1987-05-21 1989-10-11 AT&T Corp. Printed circuit board fabrication
EP0321824A3 (de) * 1987-12-23 1991-01-16 Siemens Aktiengesellschaft Flüssiges, strahlenhärtbares Harz zur Isolierung dünner Leitungen
JP2532119B2 (ja) * 1987-12-24 1996-09-11 旭チバ株式会社 多官能化エポキシ樹脂の製造方法
JPH01195056A (ja) 1988-01-30 1989-08-04 Toshiba Corp 印字ヘッドの製造方法およびその製造用治具
GB8804044D0 (en) * 1988-02-22 1988-03-23 Coates Brothers Plc Coating compositions
JPH0372578A (ja) * 1989-05-30 1991-03-27 Kansai Paint Co Ltd 缶内面用複層塗膜
JP2819157B2 (ja) * 1989-07-21 1998-10-30 大日本印刷株式会社 放射線重合可能な液晶性モノマー及びそのポリマー
GB2235925B (en) 1989-09-12 1992-09-30 Sericol Group Ltd Photocurable compositions
US5157078A (en) * 1990-05-25 1992-10-20 The Glidden Company Glycidyl-epoxy-acrylic copolymers
US5218061A (en) * 1990-09-17 1993-06-08 Nippon Kayaku Kabushiki Kaisha Partially post-glycidylated epoxy resin, epoxy resin composition and cured product thereof
CA2055833C (en) * 1990-11-20 2001-04-24 Katsue Nishikawa Preparation of unsaturated epoxy ester resin and carboxylated unsaturated epoxy ester resin and photosensitive composition comprising the same
JPH04294352A (ja) 1991-03-22 1992-10-19 Tamura Kaken Kk 感光性水性樹脂組成物
JP2868190B2 (ja) * 1991-07-29 1999-03-10 日本化薬株式会社 樹脂組成物、ソルダーレジスト樹脂組成物及びこれらの硬化物
TW268031B (ko) 1993-07-02 1996-01-11 Ciba Geigy

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100737723B1 (ko) * 2001-07-27 2007-07-10 주식회사 동진쎄미켐 감광성 수지 조성물

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US6747101B2 (en) 2004-06-08
CN1103073A (zh) 1995-05-31
EP1295900B1 (de) 2006-12-06
EP0632078A1 (de) 1995-01-04
US20040072969A1 (en) 2004-04-15
EP1295900A2 (de) 2003-03-26
JP3548969B2 (ja) 2004-08-04
DE59410446D1 (de) 2007-01-18
JP2004004813A (ja) 2004-01-08
EP0632078B1 (de) 2003-02-26
TW268011B (ko) 1996-01-11
CA2127203A1 (en) 1995-01-03
EP1295900A3 (de) 2004-01-28
CN1064055C (zh) 2001-04-04
KR100341619B1 (ko) 2002-11-23
JPH0770281A (ja) 1995-03-14
ATE233287T1 (de) 2003-03-15
US6784221B2 (en) 2004-08-31
DE59410248D1 (de) 2003-04-03
US20020019500A1 (en) 2002-02-14
CA2127203C (en) 2006-04-25

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