KR960015086A - 중합체 - Google Patents
중합체 Download PDFInfo
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- KR960015086A KR960015086A KR1019950038037A KR19950038037A KR960015086A KR 960015086 A KR960015086 A KR 960015086A KR 1019950038037 A KR1019950038037 A KR 1019950038037A KR 19950038037 A KR19950038037 A KR 19950038037A KR 960015086 A KR960015086 A KR 960015086A
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- South Korea
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- formula
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
- C08F212/02—Monomers containing only one unsaturated aliphatic radical
- C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
- C08F212/14—Monomers containing only one unsaturated aliphatic radical containing one ring substituted by heteroatoms or groups containing heteroatoms
- C08F212/22—Oxygen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F216/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical
- C08F216/12—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical by an ether radical
- C08F216/14—Monomers containing only one unsaturated aliphatic radical
- C08F216/1408—Monomers containing halogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/34—Esters containing nitrogen, e.g. N,N-dimethylaminoethyl (meth)acrylate
- C08F220/36—Esters containing nitrogen, e.g. N,N-dimethylaminoethyl (meth)acrylate containing oxygen in addition to the carboxy oxygen, e.g. 2-N-morpholinoethyl (meth)acrylate or 2-isocyanatoethyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/52—Amides or imides
- C08F220/54—Amides, e.g. N,N-dimethylacrylamide or N-isopropylacrylamide
- C08F220/58—Amides, e.g. N,N-dimethylacrylamide or N-isopropylacrylamide containing oxygen in addition to the carbonamido oxygen, e.g. N-methylolacrylamide, N-(meth)acryloylmorpholine
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/52—Amides or imides
- C08F220/54—Amides, e.g. N,N-dimethylacrylamide or N-isopropylacrylamide
- C08F220/60—Amides, e.g. N,N-dimethylacrylamide or N-isopropylacrylamide containing nitrogen in addition to the carbonamido nitrogen
- C08F220/603—Amides, e.g. N,N-dimethylacrylamide or N-isopropylacrylamide containing nitrogen in addition to the carbonamido nitrogen and containing oxygen in addition to the carbonamido oxygen and nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F230/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal
- C08F230/04—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal
- C08F230/08—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal containing silicon
- C08F230/085—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal containing silicon the monomer being a polymerisable silane, e.g. (meth)acryloyloxy trialkoxy silanes or vinyl trialkoxysilanes
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Emergency Medicine (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Materials For Photolithography (AREA)
Abstract
청구범위 제1항에 따른 신규한 조성물은 인쇄 기판 및 회로 기판의 제조, 특히 집적 회로의 제조를 위한 레지스트 제재로 사용될 수 있다. 화합물의 자동촉매 분해는 일어나지 않고 여기서 수득된 레지시트 필름은 우수한 접착성을 가진다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
Claims (10)
- 중합체에 존재하는 구조 단위체의 총량을 기준으로 하기 일반식(Ia)의 구조 반복 단위 90 내지 10몰%, 하기 일반식(Ib)의 구조 반복 단위 90 내지 10몰% 및 하기 일반식(Ic)의 구조 반복 단위 0 내지 40몰%를 퍼센트의 합이 항상 100%가 되도록 포함하는 겔 투과 크로마토 크로마토그래피에 의해 결정된 분자량 103내지 106의 신규한 중합체 :상기 식에서, R1은 H, C1-C4알킬, 할로-C1-C4알킬, 할로겐 또는 CN이고, R2는 독립적으로 H, C1-C4알킬, C1-C4알콕시 또는 할로겐이며, R3은 H 또는 CH3이고, R4는 산-제거성 O-C- 또는 O-Si결합을 포함하는 기이며, R5는 H 또는 CH3이고, R6은 H, COOH 또는 CN이며, R7은 H 또는 CH3이고, R8은 H, CN, COOH, COOR10또는 아릴이며, R10은 C1-C6알킬이고, n은 1,2 또는 3이며, m은 0,1,2 또는 3이다.
- 제1항에 있어서, 중합체에 존재하는 구조 단위체의 총량을 기준으로 일반식(Ia)의 구조 반복 단위 90 내지 20몰%, 일반식(Ib)의 구조 반복 단위 80 내지 10몰% 및 일반식(Ic)의 구조 반복 단위 0 내지 30몰%를 퍼센트의 합이 항상 100%가 되도록 포함하는 중합체.
- 제1항에 있어서, 하기를 만족하는 중합체 R1은 CH3이고, R2는 H, CH3, OCH3, Cl 또는 Br이며, R3은 H이고, R4는 일반식-OC(CH3)2-OCH3또는 -OCH(CH3)-OC2H5의 산-제거성 O-C 또는 O-Si를 포함하는 기, 아르알콕시, 알릴옥시, C3-C6알콕시 또는 일반식 -O-Si(R11)3(R11은 C1-C4알킬)의 기 또는 R4는 일반식또는이며, R9는 산-제거성 보호기, 예컨대 아르알킬, 알릴 또는 측쇄 C3-C6알킬이고, R6은 H이며, R7은 H이고, R7은 CH3이며, R8은 COOH이고, R′은 H 또는 CH3이며, p은 0 또는 1이고, n은 1이며, m은 0이다.
- 제3항에 있어서, R4는 일반식-OC(CH3)2OCH3또는 -OCH(CH3)OC2H5의 기인 중합체.
- 제1항에 있어서, 하기를 만족하는 중합체 : R1은 CH3이고, R3은 H이며, R5는 H이고 R6은 H이며, R7은 CH3이고, R8은 COOH이며, n은 1이고 m은 0이며, R4는 일반식또는 -OCH(CH3)OC2H5이다.
- 하기 일반식(II)의 단량체 10-90%, 일반식(III)의 단량체 10-90%, 및 일반식(IV)의 단량체 5-40%의 라디칼성 또는 이온성 중합화에 의해 제조되는 제1항에 다른 중합체의 제조방법 :상기식에서, R1, R2, R3, R4, R5, R6, R7, R8, m 및 n은 상술한 바와 같다.
- 레지스트 제재에서 제1항에 따른 중합체의 용도.
- 수성알칼리를 용매로한 하기 일반식(III)의 화합물 용액을 유기 용매에의 일반식(V)의 화합물 동몰량 용액으로 처리하는 것을 포함하는 일반식(III)의 화합물의 순수한 이성질체의 제조방법 :상기 식에서, R1, R2, m 및 n은 일반식(Ia), (Ib) 및 (Ic)와 관련해서 제1항에서 정의된 바와 같고, Hal은 불소, 브롬 또는 바람직하게는 염소이다.
- 중량%는 레지스트 제재내의 하기 성분 a), b) 및 c)의 총 중량을 기준으로한 하기 성분을 포함하는 레지스트 제재; a)본 발명에 따른 중합체 45 내지 99.9중량%, b) 광활성 화합물(산 발생자) 0.1 내지 20중량%, c) 광학적 개질제 0.01 내지 40중량% 및 d) 유기 용매.
- 제9항에 있어서, 인쇄 기판 및 회로 기판의 제조, 특히 집적 회로의 제조를 위한 레지스트 제재의 용도.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH320294 | 1994-10-26 | ||
CH94/3202 | 1994-10-26 | ||
CH322094 | 1994-10-27 | ||
CH94/3220 | 1994-10-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR960015086A true KR960015086A (ko) | 1996-05-22 |
Family
ID=25692448
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950038037A KR960015086A (ko) | 1994-10-26 | 1995-10-26 | 중합체 |
Country Status (4)
Country | Link |
---|---|
US (2) | US5780566A (ko) |
EP (1) | EP0709410A3 (ko) |
JP (1) | JPH08225617A (ko) |
KR (1) | KR960015086A (ko) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6242153B1 (en) * | 1997-03-27 | 2001-06-05 | Fuji Photo Film Co., Ltd. | Positive photoresist composition for far ultraviolet ray exposure |
JPH1139728A (ja) * | 1997-07-11 | 1999-02-12 | Sony Corp | 光記録材料の露光記録方法 |
DE59808434D1 (de) * | 1997-11-28 | 2003-06-26 | Infineon Technologies Ag | Chemisch verstärkter Resist für die Elektronenstrahllithographie |
US6468712B1 (en) | 2000-02-25 | 2002-10-22 | Massachusetts Institute Of Technology | Resist materials for 157-nm lithography |
JP3779122B2 (ja) * | 2000-03-14 | 2006-05-24 | 松下電器産業株式会社 | パターン形成材料及びパターン形成方法 |
KR20030005177A (ko) * | 2000-04-04 | 2003-01-17 | 다이낑 고오교 가부시키가이샤 | 산반응성기를 갖는 신규 불소폴리머 및 이를 사용한화학증폭형 포토레지스트 조성물 |
US7270693B2 (en) * | 2000-09-05 | 2007-09-18 | Donaldson Company, Inc. | Polymer, polymer microfiber, polymer nanofiber and applications including filter structures |
US20020092423A1 (en) * | 2000-09-05 | 2002-07-18 | Gillingham Gary R. | Methods for filtering air for a gas turbine system |
US6800117B2 (en) | 2000-09-05 | 2004-10-05 | Donaldson Company, Inc. | Filtration arrangement utilizing pleated construction and method |
US6746517B2 (en) * | 2000-09-05 | 2004-06-08 | Donaldson Company, Inc. | Filter structure with two or more layers of fine fiber having extended useful service life |
US7115150B2 (en) * | 2000-09-05 | 2006-10-03 | Donaldson Company, Inc. | Mist filtration arrangement utilizing fine fiber layer in contact with media having a pleated construction and floor filter method |
US6743273B2 (en) * | 2000-09-05 | 2004-06-01 | Donaldson Company, Inc. | Polymer, polymer microfiber, polymer nanofiber and applications including filter structures |
US6740142B2 (en) | 2000-09-05 | 2004-05-25 | Donaldson Company, Inc. | Industrial bag house elements |
US6673136B2 (en) * | 2000-09-05 | 2004-01-06 | Donaldson Company, Inc. | Air filtration arrangements having fluted media constructions and methods |
US6716274B2 (en) | 2000-09-05 | 2004-04-06 | Donaldson Company, Inc. | Air filter assembly for filtering an air stream to remove particulate matter entrained in the stream |
KR100760146B1 (ko) * | 2000-09-18 | 2007-09-18 | 제이에스알 가부시끼가이샤 | 감방사선성 수지 조성물 |
RU2300543C2 (ru) * | 2001-05-31 | 2007-06-10 | Дональдсон Компани, Инк. | Составы тонкого волокна, способы их получения, способ изготовления тонковолокнистого материала |
US7232478B2 (en) * | 2003-07-14 | 2007-06-19 | Enthone Inc. | Adhesion promotion in printed circuit boards |
JP4687651B2 (ja) * | 2004-05-26 | 2011-05-25 | Jsr株式会社 | 微細パターン形成用樹脂組成物および微細パターン形成方法 |
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JPS55118030A (en) | 1979-03-06 | 1980-09-10 | Fuji Photo Film Co Ltd | Photopolymerizable composition |
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US5204226A (en) | 1991-03-04 | 1993-04-20 | International Business Machines Corporation | Photosensitizers for polysilanes |
US5348838A (en) | 1991-07-31 | 1994-09-20 | Kabushiki Kaisha Toshiba | Photosensitive composition comprising alkali soluble binder and photoacid generator having sulfonyl group |
DE4126409A1 (de) * | 1991-08-09 | 1993-02-11 | Hoechst Ag | Strahlungsempfindliches gemisch mit einem polymeren bindemittel mit einheiten aus (alpha)-(beta)-ungesaettigten carbonsaeuren |
JP2655384B2 (ja) | 1991-11-08 | 1997-09-17 | 富士写真フイルム株式会社 | ポジ型レジスト組成物 |
DE69218393T2 (de) | 1991-12-16 | 1997-10-16 | Wako Pure Chem Ind Ltd | Resistmaterial |
TW304235B (ko) * | 1992-04-29 | 1997-05-01 | Ocg Microelectronic Materials | |
DE59309494D1 (de) | 1992-05-22 | 1999-05-12 | Ciba Geigy Ag | Hochauflösender I-Linien Photoresist mit höherer Empfindlichkeit |
-
1995
- 1995-10-18 EP EP95810648A patent/EP0709410A3/en not_active Ceased
- 1995-10-26 US US08/548,421 patent/US5780566A/en not_active Expired - Fee Related
- 1995-10-26 KR KR1019950038037A patent/KR960015086A/ko not_active Application Discontinuation
- 1995-10-26 JP JP7302133A patent/JPH08225617A/ja active Pending
-
1998
- 1998-05-05 US US09/072,541 patent/US5863701A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US5780566A (en) | 1998-07-14 |
EP0709410A2 (en) | 1996-05-01 |
US5863701A (en) | 1999-01-26 |
EP0709410A3 (en) | 1997-03-26 |
JPH08225617A (ja) | 1996-09-03 |
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