KR950003342A - 에폭시 아크릴레이트 - Google Patents
에폭시 아크릴레이트 Download PDFInfo
- Publication number
- KR950003342A KR950003342A KR1019940015947A KR19940015947A KR950003342A KR 950003342 A KR950003342 A KR 950003342A KR 1019940015947 A KR1019940015947 A KR 1019940015947A KR 19940015947 A KR19940015947 A KR 19940015947A KR 950003342 A KR950003342 A KR 950003342A
- Authority
- KR
- South Korea
- Prior art keywords
- general formula
- formula
- epoxy acrylate
- alkyl
- group
- Prior art date
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
- C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
- C08G59/1455—Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
- C08G59/1461—Unsaturated monoacids
- C08G59/1466—Acrylic or methacrylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/58—Epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
- C08G59/066—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0385—Macromolecular compounds which are rendered insoluble or differentially wettable using epoxidised novolak resin
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S525/00—Synthetic resins or natural rubbers -- part of the class 520 series
- Y10S525/922—Polyepoxide polymer having been reacted to yield terminal ethylenic unsaturation
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Emergency Medicine (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Epoxy Resins (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Diaphragms For Electromechanical Transducers (AREA)
- Preparation Of Compounds By Using Micro-Organisms (AREA)
- Materials For Photolithography (AREA)
- Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
Abstract
비교적 고분자량이며 화학적으로 가교가능한 일반식(Ⅱ) 및 (Ⅲ)의 신규 에폭시 아크릴레이트 및 카르복시기 함유 에폭시 아크릴레이트는 고도로 중합된 중합체 결합제를 부가적으로 사용하여 포토레지스트 배합물에서 사용될 수 있다. 이러한 레지스트 배합물은 특히 인쇄 배선판 및 인쇄판의 분야에서 사용되며 수성 매체로부터 도포가능하고 점착성이 거의 없어 특히 도전체상에서 매우 양호한 모서리 피복율을 갖는다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
Claims (9)
- 하기식(Ⅱ)의 에폭시 아크릴레이트;상기식에서, M은 일반식또는의 기이며, R1은 -H- 또는 -CH3이고, R2는 -H-, -CH3또는 페닐이며, R은 C1-C4알킬 또는 할로겐, 바람직하기로는 CH3또는 브롬이고, x는 0 내지 3, 바람직하기로는 0 또는 1의 정수이며, Y는 하기식의 결합기이고;R3및 R4는 각각 독립적으로 수소 또는 C1-C4알킬이거나, 또는 결합 탄소원자와 함께 5- 또는 6-원 탄화수소 고리를 형성하고, 결합기 Y의 방향족 라디칼은 비치환 또는 할로겐이나 C1-C4알킬로 치환되며, X는 -S-, -O- 또는 -SO2이고, n은 0 내지 300의 정수이며, 단, 라디칼 M의 10몰% 이상은 하기식의 구조를 갖는다;
- 제1항에 있어서, R이 -H 또는 -CH3이고, R1이 -H 또는 -CH3이며, R2는 -H이고, x는 0 또는 1이며, n이 0 내지 30의 정수이고, Y가 일반식의 결합기이며, R3및 R4가 -H 또는 C1-C4알킬이고 결합기의 방향족 라디칼이 비치환 또는 할로겐이나 C1-C4알킬로 치환된 일반식(Ⅱ)의 에폭시 아크릴레이트.
- 제1항에 있어서, Y가 하기식의 결합기인 일반식(Ⅱ)의 에폭시 아크릴레이트:
- 제1항에 있어서, R1이 -H 또는 -CH3이며 R2가 -H인 일반식(Ⅱ)의 에폭시 아크릴레이트.
- 승온에서, 촉매 및 중합반응 억제제의 임의 존재하에 에틸렌성 불포화 단일카르복시산과 하기식(Ⅰ)의 사슬 연장된 에폭시 노볼락을 반응시키는 것을 포함하는 제1항에 정의된 일반식(Ⅱ)의 에폭시 아크릴레이트 제조방법:상기식에서, R, Y, n 및 x는 제1항에 정의한 바와 같다.
- 하기식(Ⅲ)의 카르복시기 함유 에폭시 아크릴레이트:상기식에서, A는 수소 또는 일반식의 기이고, R1, R2, R, n, x 및 Y는 제1항에서 정의한 바와 같고, R5는 무수물 라디칼 제거 후의 다중카르복시산의 환형 무수물의 라디칼이며, 라디칼 A의 10몰% 이상은 일반식의 구조를 갖는다.
- 승온에서, 촉매 및 중합반응 억제제의 임의 존재하에 다중카르복시산의 환형 무수물과 제1항에 정의된 바와 같은 일반식(Ⅱ)의 에폭시 아크릴레이트를 반응시키는 것을 포함하는, 제6항에 정의된 일반식(Ⅲ)의 카르복시기 함유 에폭시 아크릴레이트 제조방법.
- 포토레지스트 배합물에서 아크릴레이트 성분으로서 제1항에 정의된 바와 같은 일반식(Ⅱ)의 에폭시 아크릴레이트의 용도.
- 포토레지스트 배합물에서 아크릴레이트 성분으로서 제6항에 정의된 바와 같은 일반식(Ⅲ)의 카르복시기 함유 에폭시 아크릴레이트의 용도.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH200493 | 1993-07-02 | ||
CH93-2/2004 | 1993-07-02 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR950003342A true KR950003342A (ko) | 1995-02-16 |
KR100305323B1 KR100305323B1 (ko) | 2001-11-22 |
Family
ID=4223656
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019940015947A KR100305323B1 (ko) | 1993-07-02 | 1994-07-01 | 에폭시아크릴레이트 |
Country Status (10)
Country | Link |
---|---|
US (2) | US5576399A (ko) |
EP (1) | EP0632079B1 (ko) |
JP (1) | JP3451383B2 (ko) |
KR (1) | KR100305323B1 (ko) |
CN (2) | CN1052245C (ko) |
AT (1) | ATE194848T1 (ko) |
CA (1) | CA2127232C (ko) |
DE (1) | DE59409454D1 (ko) |
HK (1) | HK1029581A1 (ko) |
TW (1) | TW270123B (ko) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB9708510D0 (en) * | 1997-04-25 | 1997-06-18 | Dow Deutschland Inc | Nitrogen containing epoxy resins for photocurable coating applications |
JPH1121333A (ja) * | 1997-07-04 | 1999-01-26 | Takeda Chem Ind Ltd | エポキシエステル樹脂の製造法およびそれを含む感光性樹脂組成物 |
DE60310055T2 (de) * | 2002-04-11 | 2007-04-12 | Si Group, Inc. | Wässrige beschichtungszusammensetzungen für leiterplatte |
DE10223313A1 (de) * | 2002-05-24 | 2003-12-11 | Bakelite Ag | Modifizierte Epoxyacrylate |
JP2004115673A (ja) * | 2002-09-26 | 2004-04-15 | Fuji Photo Film Co Ltd | 重合性組成物 |
WO2005015309A2 (en) * | 2003-07-17 | 2005-02-17 | Cytec Surface Specialties, S.A. | Alkali-developable radiation curable composition |
US20050075024A1 (en) * | 2003-10-01 | 2005-04-07 | Ranken Paul F. | Flame retardant epoxy prepregs, laminates, and printed wiring boards of enhanced thermal stability |
EP2168994A1 (en) * | 2008-09-25 | 2010-03-31 | Huntsman Advanced Materials (Switzerland) GmbH | Photocurable composition |
DE102012221446A1 (de) * | 2012-11-23 | 2014-05-28 | Hilti Aktiengesellschaft | Harzmischung auf Epoxy(meth)acrylatharz-Basis und deren Verwendung |
DE102012221441A1 (de) * | 2012-11-23 | 2014-05-28 | Hilti Aktiengesellschaft | Verfahren zur Herstellung von modifizierten Epoxy(meth)acrylatharzen und ihre Verwendung |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3373079A (en) * | 1964-09-18 | 1968-03-12 | Eastman | Pulp and fiber molding apparatus including resin application means |
DE1618729A1 (de) * | 1966-03-10 | 1972-03-30 | North American Aviation Inc | Verfahren zur Herstellung eines photopolymerisierbaren Epoxydharzes |
US3676524A (en) * | 1970-07-27 | 1972-07-11 | Showa Highpolymer | Vinyl ester resins prepared with an addition compound of a secondary amine-acid salt catalyst |
GB1512814A (en) * | 1975-08-13 | 1978-06-01 | Ciba Geigy Ag | Epoxide resins |
US4595734A (en) * | 1980-02-04 | 1986-06-17 | Interplastic Corporation | Molding compositions |
US4359370A (en) * | 1980-11-24 | 1982-11-16 | Shell Oil Company | Curable epoxy-vinyl ester compositions |
JPS61243869A (ja) * | 1985-04-19 | 1986-10-30 | Taiyo Ink Seizo Kk | レジストインキ組成物 |
US4789620A (en) * | 1986-03-03 | 1988-12-06 | Mitsubishi Rayon Co. Ltd. | Liquid photosensitive resin composition containing carboxylated epoxy acrylates or methacrylates |
JPS63258975A (ja) * | 1986-12-26 | 1988-10-26 | Toshiba Corp | ソルダーレジストインキ組成物 |
JPH01195056A (ja) * | 1988-01-30 | 1989-08-04 | Toshiba Corp | 印字ヘッドの製造方法およびその製造用治具 |
GB8804044D0 (en) * | 1988-02-22 | 1988-03-23 | Coates Brothers Plc | Coating compositions |
JPH0372578A (ja) * | 1989-05-30 | 1991-03-27 | Kansai Paint Co Ltd | 缶内面用複層塗膜 |
JPH0359022A (ja) * | 1989-07-27 | 1991-03-14 | Nippon Chibagaigii Kk | 熱硬化性樹脂 |
GB2235925B (en) * | 1989-09-12 | 1992-09-30 | Sericol Group Ltd | Photocurable compositions |
US5157078A (en) * | 1990-05-25 | 1992-10-20 | The Glidden Company | Glycidyl-epoxy-acrylic copolymers |
US5218061A (en) * | 1990-09-17 | 1993-06-08 | Nippon Kayaku Kabushiki Kaisha | Partially post-glycidylated epoxy resin, epoxy resin composition and cured product thereof |
CA2055833C (en) * | 1990-11-20 | 2001-04-24 | Katsue Nishikawa | Preparation of unsaturated epoxy ester resin and carboxylated unsaturated epoxy ester resin and photosensitive composition comprising the same |
JP2988736B2 (ja) * | 1991-03-11 | 1999-12-13 | 株式会社アサヒ化学研究所 | 一液型感光性熱硬化性樹脂組成物 |
JPH04294352A (ja) * | 1991-03-22 | 1992-10-19 | Tamura Kaken Kk | 感光性水性樹脂組成物 |
JP3059022B2 (ja) | 1993-06-07 | 2000-07-04 | シャープ株式会社 | 動画像表示装置 |
-
1994
- 1994-06-15 TW TW083105379A patent/TW270123B/zh not_active IP Right Cessation
- 1994-06-23 EP EP94810376A patent/EP0632079B1/de not_active Expired - Lifetime
- 1994-06-23 AT AT94810376T patent/ATE194848T1/de active
- 1994-06-23 DE DE59409454T patent/DE59409454D1/de not_active Expired - Lifetime
- 1994-06-28 US US08/268,095 patent/US5576399A/en not_active Expired - Lifetime
- 1994-06-30 CA CA002127232A patent/CA2127232C/en not_active Expired - Fee Related
- 1994-07-01 CN CN94108126A patent/CN1052245C/zh not_active Expired - Fee Related
- 1994-07-01 KR KR1019940015947A patent/KR100305323B1/ko not_active IP Right Cessation
- 1994-07-04 JP JP17482494A patent/JP3451383B2/ja not_active Ceased
-
1996
- 1996-05-23 US US08/652,394 patent/US6479596B1/en not_active Expired - Fee Related
-
1999
- 1999-09-07 CN CNB991185242A patent/CN1133631C/zh not_active Expired - Fee Related
-
2000
- 2000-10-23 HK HK00106718A patent/HK1029581A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CA2127232C (en) | 2006-11-21 |
ATE194848T1 (de) | 2000-08-15 |
CN1102838A (zh) | 1995-05-24 |
US5576399A (en) | 1996-11-19 |
JPH0770280A (ja) | 1995-03-14 |
CN1133631C (zh) | 2004-01-07 |
EP0632079A1 (de) | 1995-01-04 |
JP3451383B2 (ja) | 2003-09-29 |
TW270123B (ko) | 1996-02-11 |
CN1257866A (zh) | 2000-06-28 |
KR100305323B1 (ko) | 2001-11-22 |
DE59409454D1 (de) | 2000-08-24 |
CN1052245C (zh) | 2000-05-10 |
EP0632079B1 (de) | 2000-07-19 |
HK1029581A1 (en) | 2001-04-06 |
CA2127232A1 (en) | 1995-01-03 |
US6479596B1 (en) | 2002-11-12 |
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