KR950003342A - 에폭시 아크릴레이트 - Google Patents

에폭시 아크릴레이트 Download PDF

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KR950003342A
KR950003342A KR1019940015947A KR19940015947A KR950003342A KR 950003342 A KR950003342 A KR 950003342A KR 1019940015947 A KR1019940015947 A KR 1019940015947A KR 19940015947 A KR19940015947 A KR 19940015947A KR 950003342 A KR950003342 A KR 950003342A
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general formula
formula
epoxy acrylate
alkyl
group
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KR1019940015947A
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KR100305323B1 (ko
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로쓰 마틴
잘빈 로거
마이어 쿠르트
자일러 베른하르트
비젠당거 롤프
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에른스트 알테르
시바-가이기 아게
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14Polycondensates modified by chemical after-treatment
    • C08G59/1433Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • C08G59/1455Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
    • C08G59/1461Unsaturated monoacids
    • C08G59/1466Acrylic or methacrylic acids
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40High-molecular-weight compounds
    • C08G18/58Epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02Polycondensates containing more than one epoxy group per molecule
    • C08G59/04Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/066Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32Epoxy compounds containing three or more epoxy groups
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0385Macromolecular compounds which are rendered insoluble or differentially wettable using epoxidised novolak resin
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S525/00Synthetic resins or natural rubbers -- part of the class 520 series
    • Y10S525/922Polyepoxide polymer having been reacted to yield terminal ethylenic unsaturation

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Emergency Medicine (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Epoxy Resins (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Preparation Of Compounds By Using Micro-Organisms (AREA)
  • Materials For Photolithography (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)

Abstract

비교적 고분자량이며 화학적으로 가교가능한 일반식(Ⅱ) 및 (Ⅲ)의 신규 에폭시 아크릴레이트 및 카르복시기 함유 에폭시 아크릴레이트는 고도로 중합된 중합체 결합제를 부가적으로 사용하여 포토레지스트 배합물에서 사용될 수 있다. 이러한 레지스트 배합물은 특히 인쇄 배선판 및 인쇄판의 분야에서 사용되며 수성 매체로부터 도포가능하고 점착성이 거의 없어 특히 도전체상에서 매우 양호한 모서리 피복율을 갖는다.

Description

에폭시 아크릴레이트
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (9)

  1. 하기식(Ⅱ)의 에폭시 아크릴레이트;
    상기식에서, M은 일반식또는의 기이며, R1은 -H- 또는 -CH3이고, R2는 -H-, -CH3또는 페닐이며, R은 C1-C4알킬 또는 할로겐, 바람직하기로는 CH3또는 브롬이고, x는 0 내지 3, 바람직하기로는 0 또는 1의 정수이며, Y는 하기식의 결합기이고;
    R3및 R4는 각각 독립적으로 수소 또는 C1-C4알킬이거나, 또는 결합 탄소원자와 함께 5- 또는 6-원 탄화수소 고리를 형성하고, 결합기 Y의 방향족 라디칼은 비치환 또는 할로겐이나 C1-C4알킬로 치환되며, X는 -S-, -O- 또는 -SO2이고, n은 0 내지 300의 정수이며, 단, 라디칼 M의 10몰% 이상은 하기식의 구조를 갖는다;
  2. 제1항에 있어서, R이 -H 또는 -CH3이고, R1이 -H 또는 -CH3이며, R2는 -H이고, x는 0 또는 1이며, n이 0 내지 30의 정수이고, Y가 일반식의 결합기이며, R3및 R4가 -H 또는 C1-C4알킬이고 결합기의 방향족 라디칼이 비치환 또는 할로겐이나 C1-C4알킬로 치환된 일반식(Ⅱ)의 에폭시 아크릴레이트.
  3. 제1항에 있어서, Y가 하기식의 결합기인 일반식(Ⅱ)의 에폭시 아크릴레이트:
  4. 제1항에 있어서, R1이 -H 또는 -CH3이며 R2가 -H인 일반식(Ⅱ)의 에폭시 아크릴레이트.
  5. 승온에서, 촉매 및 중합반응 억제제의 임의 존재하에 에틸렌성 불포화 단일카르복시산과 하기식(Ⅰ)의 사슬 연장된 에폭시 노볼락을 반응시키는 것을 포함하는 제1항에 정의된 일반식(Ⅱ)의 에폭시 아크릴레이트 제조방법:
    상기식에서, R, Y, n 및 x는 제1항에 정의한 바와 같다.
  6. 하기식(Ⅲ)의 카르복시기 함유 에폭시 아크릴레이트:
    상기식에서, A는 수소 또는 일반식의 기이고, R1, R2, R, n, x 및 Y는 제1항에서 정의한 바와 같고, R5는 무수물 라디칼 제거 후의 다중카르복시산의 환형 무수물의 라디칼이며, 라디칼 A의 10몰% 이상은 일반식의 구조를 갖는다.
  7. 승온에서, 촉매 및 중합반응 억제제의 임의 존재하에 다중카르복시산의 환형 무수물과 제1항에 정의된 바와 같은 일반식(Ⅱ)의 에폭시 아크릴레이트를 반응시키는 것을 포함하는, 제6항에 정의된 일반식(Ⅲ)의 카르복시기 함유 에폭시 아크릴레이트 제조방법.
  8. 포토레지스트 배합물에서 아크릴레이트 성분으로서 제1항에 정의된 바와 같은 일반식(Ⅱ)의 에폭시 아크릴레이트의 용도.
  9. 포토레지스트 배합물에서 아크릴레이트 성분으로서 제6항에 정의된 바와 같은 일반식(Ⅲ)의 카르복시기 함유 에폭시 아크릴레이트의 용도.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019940015947A 1993-07-02 1994-07-01 에폭시아크릴레이트 KR100305323B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH200493 1993-07-02
CH93-2/2004 1993-07-02

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KR950003342A true KR950003342A (ko) 1995-02-16
KR100305323B1 KR100305323B1 (ko) 2001-11-22

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US (2) US5576399A (ko)
EP (1) EP0632079B1 (ko)
JP (1) JP3451383B2 (ko)
KR (1) KR100305323B1 (ko)
CN (2) CN1052245C (ko)
AT (1) ATE194848T1 (ko)
CA (1) CA2127232C (ko)
DE (1) DE59409454D1 (ko)
HK (1) HK1029581A1 (ko)
TW (1) TW270123B (ko)

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DE60310055T2 (de) * 2002-04-11 2007-04-12 Si Group, Inc. Wässrige beschichtungszusammensetzungen für leiterplatte
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EP2168994A1 (en) * 2008-09-25 2010-03-31 Huntsman Advanced Materials (Switzerland) GmbH Photocurable composition
DE102012221446A1 (de) * 2012-11-23 2014-05-28 Hilti Aktiengesellschaft Harzmischung auf Epoxy(meth)acrylatharz-Basis und deren Verwendung
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JP3059022B2 (ja) 1993-06-07 2000-07-04 シャープ株式会社 動画像表示装置

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CA2127232C (en) 2006-11-21
ATE194848T1 (de) 2000-08-15
CN1102838A (zh) 1995-05-24
US5576399A (en) 1996-11-19
JPH0770280A (ja) 1995-03-14
CN1133631C (zh) 2004-01-07
EP0632079A1 (de) 1995-01-04
JP3451383B2 (ja) 2003-09-29
TW270123B (ko) 1996-02-11
CN1257866A (zh) 2000-06-28
KR100305323B1 (ko) 2001-11-22
DE59409454D1 (de) 2000-08-24
CN1052245C (zh) 2000-05-10
EP0632079B1 (de) 2000-07-19
HK1029581A1 (en) 2001-04-06
CA2127232A1 (en) 1995-01-03
US6479596B1 (en) 2002-11-12

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