KR940022819A - 성형 패키지 배열용 리드프레임 구조체 - Google Patents

성형 패키지 배열용 리드프레임 구조체 Download PDF

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Publication number
KR940022819A
KR940022819A KR1019940006324A KR19940006324A KR940022819A KR 940022819 A KR940022819 A KR 940022819A KR 1019940006324 A KR1019940006324 A KR 1019940006324A KR 19940006324 A KR19940006324 A KR 19940006324A KR 940022819 A KR940022819 A KR 940022819A
Authority
KR
South Korea
Prior art keywords
wire bond
leadframe
molding
protective layer
contact material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1019940006324A
Other languages
English (en)
Korean (ko)
Inventor
마이클 벤조니 앨버트
Original Assignee
마가레트 에이.버키
아메리칸 텔리폰 앤드 텔레그라프 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 마가레트 에이.버키, 아메리칸 텔리폰 앤드 텔레그라프 캄파니 filed Critical 마가레트 에이.버키
Publication of KR940022819A publication Critical patent/KR940022819A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/045—Cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/451—Multilayered leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials
    • H10W70/457—Materials of metallic layers on leadframes

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
KR1019940006324A 1993-03-30 1994-03-29 성형 패키지 배열용 리드프레임 구조체 Withdrawn KR940022819A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US4023693A 1993-03-30 1993-03-30
US040,236 1993-03-30

Publications (1)

Publication Number Publication Date
KR940022819A true KR940022819A (ko) 1994-10-21

Family

ID=21909897

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940006324A Withdrawn KR940022819A (ko) 1993-03-30 1994-03-29 성형 패키지 배열용 리드프레임 구조체

Country Status (4)

Country Link
EP (1) EP0620589A1 (cg-RX-API-DMAC7.html)
JP (1) JPH06310638A (cg-RX-API-DMAC7.html)
KR (1) KR940022819A (cg-RX-API-DMAC7.html)
TW (1) TW256946B (cg-RX-API-DMAC7.html)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6396947A (ja) * 1986-10-13 1988-04-27 Mitsubishi Electric Corp 半導体装置用リ−ドフレ−ム
US5070041A (en) * 1988-08-12 1991-12-03 Mitsui Petrochemical Industries, Ltd. Method of removing flash from a semiconductor leadframe using coated leadframe and solvent
US4968397A (en) * 1989-11-27 1990-11-06 Asher Reginald K Non-cyanide electrode cleaning process
JPH0451531A (ja) * 1990-06-19 1992-02-20 Mitsubishi Electric Corp 絶縁封止型半導体装置の製造方法

Also Published As

Publication number Publication date
EP0620589A1 (en) 1994-10-19
TW256946B (cg-RX-API-DMAC7.html) 1995-09-11
JPH06310638A (ja) 1994-11-04

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Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000