JPS5688330A - Fixing method for lead wire - Google Patents

Fixing method for lead wire

Info

Publication number
JPS5688330A
JPS5688330A JP16617379A JP16617379A JPS5688330A JP S5688330 A JPS5688330 A JP S5688330A JP 16617379 A JP16617379 A JP 16617379A JP 16617379 A JP16617379 A JP 16617379A JP S5688330 A JPS5688330 A JP S5688330A
Authority
JP
Japan
Prior art keywords
silver
lead wire
roughness
layer
nail head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16617379A
Other languages
Japanese (ja)
Inventor
Tadao Abe
Akira Kazami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Original Assignee
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Sanyo Electric Co Ltd, Sanyo Electric Co Ltd filed Critical Tokyo Sanyo Electric Co Ltd
Priority to JP16617379A priority Critical patent/JPS5688330A/en
Publication of JPS5688330A publication Critical patent/JPS5688330A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
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    • H01L2224/4554—Coating
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    • H01L2224/48599—Principal constituent of the connecting portion of the wire connector being Gold (Au)
    • H01L2224/486—Principal constituent of the connecting portion of the wire connector being Gold (Au) with a principal constituent of the bonding area being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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    • H01L2924/15717—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400 C and less than 950 C
    • H01L2924/15724—Aluminium [Al] as principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To automate the nail head bonding of gold wire by providing a silver plated layer having specified roughness of the surface on a metal conducting wire on an insulating substrate. CONSTITUTION:A copper foil 3 is bonded to the insulating layer 2 of the substrate 10 having the thin insulating layer 2 on Al 1, and a silver plated layer 4 is selectively formed. The copper foil 3 is etched out with the silver layer 4 as a mask, and the conducting path is formed. In this case, if the roughness of the surface of the silver plating 4 is about 1.5-5mu, the anchor effect is yielded when the lead wire 6 is fixed, the fixed cross sectional area is increased, and the lead wire can be fixed to the uncontaminated surface whose tip of the convex portion is not deformed. Therefore, the excellent nail head bonding is realized only by the selection of the roughness of the surface of the silver plated layer, and the automation by the nail head bonding without directivity becomes possible.
JP16617379A 1979-12-19 1979-12-19 Fixing method for lead wire Pending JPS5688330A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16617379A JPS5688330A (en) 1979-12-19 1979-12-19 Fixing method for lead wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16617379A JPS5688330A (en) 1979-12-19 1979-12-19 Fixing method for lead wire

Publications (1)

Publication Number Publication Date
JPS5688330A true JPS5688330A (en) 1981-07-17

Family

ID=15826419

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16617379A Pending JPS5688330A (en) 1979-12-19 1979-12-19 Fixing method for lead wire

Country Status (1)

Country Link
JP (1) JPS5688330A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0964446A3 (en) * 1998-06-04 2001-02-07 Ford Motor Company An electronic circuit assembly
JP2015220429A (en) * 2014-05-21 2015-12-07 ローム株式会社 Semiconductor device
EP3246958A1 (en) * 2016-05-17 2017-11-22 Point Engineering Co., Ltd. Method for manufacturing chip-mounting substrate, and chip-mounting substrate
CN110731129A (en) * 2017-06-09 2020-01-24 电化株式会社 Ceramic circuit board

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0964446A3 (en) * 1998-06-04 2001-02-07 Ford Motor Company An electronic circuit assembly
JP2015220429A (en) * 2014-05-21 2015-12-07 ローム株式会社 Semiconductor device
EP3246958A1 (en) * 2016-05-17 2017-11-22 Point Engineering Co., Ltd. Method for manufacturing chip-mounting substrate, and chip-mounting substrate
US10868221B2 (en) 2016-05-17 2020-12-15 Point Engineering Co., Ltd. Method for manufacturing chip-mounting substrate, and chip-mounting substrate
CN110731129A (en) * 2017-06-09 2020-01-24 电化株式会社 Ceramic circuit board
CN110731129B (en) * 2017-06-09 2024-01-09 电化株式会社 Ceramic circuit board

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