KR940018947A - 웨이퍼 감지 및 클램핑 모니터 - Google Patents
웨이퍼 감지 및 클램핑 모니터 Download PDFInfo
- Publication number
- KR940018947A KR940018947A KR1019940000410A KR19940000410A KR940018947A KR 940018947 A KR940018947 A KR 940018947A KR 1019940000410 A KR1019940000410 A KR 1019940000410A KR 19940000410 A KR19940000410 A KR 19940000410A KR 940018947 A KR940018947 A KR 940018947A
- Authority
- KR
- South Korea
- Prior art keywords
- wafer
- capacitance
- support
- electrodes
- sensing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Measurement Of Resistance Or Impedance (AREA)
- Jigs For Machine Tools (AREA)
- Machine Tool Sensing Apparatuses (AREA)
Abstract
본 발명은 웨이퍼 위치 및 클램프 센서에 관한 것이다. 회로(114)는 웨이퍼 지지대(14),(16),(18),(20)안의 두개의 전극(22),(24)사이의 정전용량을 감지한다. 웨이퍼 (12)가 지지대에 없으면, 정전용량이 제1범위에 있게 되고, 웨이퍼가 지지대에 위치하지만 클램프가 되지 않은 경우 정전용량이 제2범위에 위치하며, 웨이퍼가 정전 흡입력에 의해 위치할때, 정전용량이 제3범위에 있게 된다. 감지된 정전용량은 주파수 다음 DC 전압레벨(164)로 변환하며, 이 DC 전압레벨은 웨이퍼 위치를 확인한 다음 웨이퍼 클램핑을 확인하기 위해 쉽게 감지되고 이용된다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 전원, 정전 클램프 장치 및 정전용량 측정회로를 도시한 개략도, 제2도는 이온주입기에 이용된 웨이퍼 지지대의 평면도.
Claims (9)
- (가) 지지대에 부착된 두 전극(22),(24)사이의 정전용량을 측정하므로서 웨이퍼 지지대(14),(16),(18),(20) 위에 반도체 웨이퍼 (12)의 존재를 감지하는 단계와, (나) 두 전극 (22),(24)사이의 측정된 정전용량이 지지대(14),(16),(18),(20)에 위치하였던 웨이퍼(12)를 나타내는 값에 도달할때, 웨이퍼와 지지대 사이에 정전 흡입력을 발생시켜 웨이퍼를 지지대에 고정시키는 단계와; (다) 정전 흡입력이 정전 흡입력에 의해 지지대에 고정되었던 웨이퍼(12)를 지지하기 위해 발생할때, 두 전극(22),(24)사이의 정전용량 변화를 감지하는 단계를 특징으로 하는 반도체 웨이퍼(12)를 웨이퍼 지지대(14),(16),(18),(20)에 고정시키는 방법.
- 제1항에 있어서, 웨이퍼를 고정시키는 단계는 직류전류전압(44)를 두 전극(22),(24)사이에 인가하는 것을 특징으로 하는 반도체 웨이퍼를 웨이퍼 지지대에 고정시키는 방법.
- 제1항에 있어서, 감지단계는 웨이퍼의 적당한 클램핑이 감지되지 않으면, 웨이퍼 지지대의 경고 메세지와 정지운동을 주입위치에 발생시키는 부속단계를 특징으로 하는 반도체 웨이퍼를 웨이퍼 지지대에 고정시키는 방법.
- 정전 흡입력에 의해 웨이퍼를 웨이퍼 지지대에 흡입하는 두개의 전극을 포함하는 반도체 웨이퍼(12)를 웨이퍼 지지대(14),(16),(18),(20)에 고정시키는 장치는 (가) 전극(22),(24)에 연결되고, 두 전극 사이의 정전용량을 감지하는 정전용량 감지회로(114)와;(나) 두 전극(22),(24)을 통전시키는 동력원(250)과; (다) 동력원으로 부터의 통전신호를 두 전극에 가하므로서, 웨이퍼가 웨이퍼 지지대에 위치할때, 웨이퍼를 웨이퍼 지지대에 흡입하는 제어기(250)와; (라) 웨이퍼 지지대 위에 웨이퍼가 있다는 것을 나타내는 감지된 정전용량에 해당하는 정전 용량 감지회로로 부터의 출력에 연결된 입력을 포함하는 상기 제어기를 특징으로 하는 반도체 웨이퍼를 웨이퍼 지지대에 고정하는 장치.
- 제4항에 있어서, 전원전압이 전극에 인가될때, 전극 사이의 감지된 정전 용량에 따라 전원이 만든 흡입력을 감지하는 수단을 특징으로 하는 반도체 웨이퍼를 웨이퍼 지지대에 고정시키는 장치.
- 제5항에 있어서, 제어기(250)에 연결된 로버트수단(254)은 웨이퍼 지지대를 회전시키고, 상기 웨이퍼를 이온 주입 방위에 이동시키며, 만일 제어기가 감지된 정전용량에 따라, 웨이퍼와 웨이퍼 지지대 사이에서 부적당한 정전용량을 감지하면, 상기 제어기는 이 로버트 수단을 작동시키지 않는 수단을 포함하는 것을 특징으로 하는 반도체 웨이퍼를 웨이퍼 지지대에 고정시키는 장치.
- 제4항에 있어서, 웨이퍼가 제1유전체층과 접촉함에 따라 상기 정전용량의 변화를 감지하고, 웨이퍼가 정전 흡입력에 의해 제1유전층에 의해 유지될때, 상기 정전용량의 변화를 더 감지하는 수단을 특징으로 하는 반도체 웨이퍼를 웨이퍼 지지대에 고정시키는 장치.
- 제7항에 있어서, 정전용량 감지회로(114)는 상기 제1전극과 제2전극 사이의 정전용량이 변함에 따라 변하는 주파수를 지닌 오실레이터 회로(120)를 특징으로 하는 반도체 웨이퍼를 웨이퍼 지지대에 고정하는 장치.
- 제8항에 있어서, 감지수단은 주파수 신호를 전압레벨로 전환하는 오실레이터 회로에 연결된 집적회로(154)를 특징으로 하는 반도체 웨이퍼를 웨이퍼 지지대에 고정시키는 장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US005,030 | 1993-01-15 | ||
US08/005,030 US5436790A (en) | 1993-01-15 | 1993-01-15 | Wafer sensing and clamping monitor |
Publications (2)
Publication Number | Publication Date |
---|---|
KR940018947A true KR940018947A (ko) | 1994-08-19 |
KR100284663B1 KR100284663B1 (ko) | 2001-04-02 |
Family
ID=21713775
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019940000410A KR100284663B1 (ko) | 1993-01-15 | 1994-01-12 | 웨이퍼 감지 및 클램핑 모니터 |
Country Status (7)
Country | Link |
---|---|
US (1) | US5436790A (ko) |
EP (1) | EP0607043B1 (ko) |
JP (1) | JP3341221B2 (ko) |
KR (1) | KR100284663B1 (ko) |
CA (1) | CA2113290C (ko) |
DE (1) | DE69400113T2 (ko) |
TW (1) | TW231366B (ko) |
Families Citing this family (73)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5463525A (en) * | 1993-12-20 | 1995-10-31 | International Business Machines Corporation | Guard ring electrostatic chuck |
US5467249A (en) * | 1993-12-20 | 1995-11-14 | International Business Machines Corporation | Electrostatic chuck with reference electrode |
KR960012283A (ko) * | 1994-09-30 | 1996-04-20 | 가네꼬 히사시 | 정전척 및 그 제조방법 |
EP0871843B1 (en) * | 1994-10-17 | 2003-05-14 | Varian Semiconductor Equipment Associates Inc. | Mounting member and method for clamping a flat thin conductive workpiece |
US5671116A (en) * | 1995-03-10 | 1997-09-23 | Lam Research Corporation | Multilayered electrostatic chuck and method of manufacture thereof |
US5670066A (en) * | 1995-03-17 | 1997-09-23 | Lam Research Corporation | Vacuum plasma processing wherein workpiece position is detected prior to chuck being activated |
US5754391A (en) * | 1996-05-17 | 1998-05-19 | Saphikon Inc. | Electrostatic chuck |
US6298737B1 (en) * | 1996-05-29 | 2001-10-09 | Integrated Device Technology, Inc. | Ceramic ring undersize detection device |
US5812362A (en) * | 1996-06-14 | 1998-09-22 | Applied Materials, Inc. | Method and apparatus for the use of diamond films as dielectric coatings on electrostatic chucks |
US5952060A (en) * | 1996-06-14 | 1999-09-14 | Applied Materials, Inc. | Use of carbon-based films in extending the lifetime of substrate processing system components |
US5980194A (en) * | 1996-07-15 | 1999-11-09 | Applied Materials, Inc. | Wafer position error detection and correction system |
US5835334A (en) * | 1996-09-30 | 1998-11-10 | Lam Research | Variable high temperature chuck for high density plasma chemical vapor deposition |
JP3245369B2 (ja) * | 1996-11-20 | 2002-01-15 | 東京エレクトロン株式会社 | 被処理体を静電チャックから離脱する方法及びプラズマ処理装置 |
US5886864A (en) * | 1996-12-02 | 1999-03-23 | Applied Materials, Inc. | Substrate support member for uniform heating of a substrate |
TW325148U (en) * | 1997-01-23 | 1998-01-11 | Taiwan Semiconductor Mfg Co Ltd | Temperature processing device |
GB9711273D0 (en) * | 1997-06-03 | 1997-07-30 | Trikon Equip Ltd | Electrostatic chucks |
US6075375A (en) | 1997-06-11 | 2000-06-13 | Applied Materials, Inc. | Apparatus for wafer detection |
US6205870B1 (en) | 1997-10-10 | 2001-03-27 | Applied Komatsu Technology, Inc. | Automated substrate processing systems and methods |
US5901030A (en) * | 1997-12-02 | 1999-05-04 | Dorsey Gage, Inc. | Electrostatic chuck employing thermoelectric cooling |
US5872694A (en) * | 1997-12-23 | 1999-02-16 | Siemens Aktiengesellschaft | Method and apparatus for determining wafer warpage for optimized electrostatic chuck clamping voltage |
US5948986A (en) * | 1997-12-26 | 1999-09-07 | Applied Materials, Inc. | Monitoring of wafer presence and position in semiconductor processing operations |
US5886865A (en) * | 1998-03-17 | 1999-03-23 | Applied Materials, Inc. | Method and apparatus for predicting failure of an eletrostatic chuck |
US5969934A (en) * | 1998-04-10 | 1999-10-19 | Varian Semiconductor Equipment Associats, Inc. | Electrostatic wafer clamp having low particulate contamination of wafers |
TW432580B (en) * | 1998-09-29 | 2001-05-01 | Applied Materials Inc | Piezoelectric method and apparatus for semiconductor wafer detection |
US6113165A (en) * | 1998-10-02 | 2000-09-05 | Taiwan Semiconductor Manufacturing Co., Ltd. | Self-sensing wafer holder and method of using |
US6454332B1 (en) | 1998-12-04 | 2002-09-24 | Applied Materials, Inc. | Apparatus and methods for handling a substrate |
US6215640B1 (en) | 1998-12-10 | 2001-04-10 | Applied Materials, Inc. | Apparatus and method for actively controlling surface potential of an electrostatic chuck |
US6430022B2 (en) * | 1999-04-19 | 2002-08-06 | Applied Materials, Inc. | Method and apparatus for controlling chucking force in an electrostatic |
US6248642B1 (en) | 1999-06-24 | 2001-06-19 | Ibis Technology Corporation | SIMOX using controlled water vapor for oxygen implants |
US6155436A (en) * | 1999-08-18 | 2000-12-05 | Ibis Technology Corporation | Arc inhibiting wafer holder assembly |
US6433342B1 (en) | 1999-08-18 | 2002-08-13 | Ibis Technology Corporation | Coated wafer holding pin |
US6423975B1 (en) | 1999-08-18 | 2002-07-23 | Ibis Technology, Inc. | Wafer holder for simox processing |
US6452195B1 (en) | 1999-08-18 | 2002-09-17 | Ibis Technology Corporation | Wafer holding pin |
US6257001B1 (en) * | 1999-08-24 | 2001-07-10 | Lucent Technologies, Inc. | Cryogenic vacuum pump temperature sensor |
US6740853B1 (en) * | 1999-09-29 | 2004-05-25 | Tokyo Electron Limited | Multi-zone resistance heater |
EP1219141B1 (en) * | 1999-09-29 | 2010-12-15 | Tokyo Electron Limited | Multi-zone resistance heater |
US6362946B1 (en) | 1999-11-02 | 2002-03-26 | Varian Semiconductor Equipment Associates, Inc. | Electrostatic wafer clamp having electrostatic seal for retaining gas |
US6538873B1 (en) | 1999-11-02 | 2003-03-25 | Varian Semiconductor Equipment Associates, Inc. | Active electrostatic seal and electrostatic vacuum pump |
US6307728B1 (en) * | 2000-01-21 | 2001-10-23 | Applied Materials, Inc. | Method and apparatus for dechucking a workpiece from an electrostatic chuck |
JP4615670B2 (ja) * | 2000-04-19 | 2011-01-19 | アプライド マテリアルズ インコーポレイテッド | 静電チャックにおけるチャッキング力を制御する方法及び装置 |
KR100344221B1 (ko) * | 2000-09-22 | 2002-07-20 | 삼성전자 주식회사 | 웨이퍼 클램프 텐션 측정 장치 |
US6403322B1 (en) * | 2001-03-27 | 2002-06-11 | Lam Research Corporation | Acoustic detection of dechucking and apparatus therefor |
US7073383B2 (en) * | 2001-06-07 | 2006-07-11 | Tokyo Electron Limited | Apparatus and method for determining clamping status of semiconductor wafer |
US6998353B2 (en) | 2001-11-05 | 2006-02-14 | Ibis Technology Corporation | Active wafer cooling during damage engineering implant to enhance buried oxide formation in SIMOX wafers |
US6710360B2 (en) | 2002-07-10 | 2004-03-23 | Axcelis Technologies, Inc. | Adjustable implantation angle workpiece support structure for an ion beam implanter |
US6774373B2 (en) * | 2002-07-29 | 2004-08-10 | Axcelis Technologies, Inc. | Adjustable implantation angle workpiece support structure for an ion beam implanter |
US6900444B2 (en) * | 2002-07-29 | 2005-05-31 | Axcelis Technologies, Inc. | Adjustable implantation angle workpiece support structure for an ion beam implanter |
US20040079289A1 (en) * | 2002-10-23 | 2004-04-29 | Kellerman Peter L. | Electrostatic chuck wafer port and top plate with edge shielding and gas scavenging |
US6740894B1 (en) | 2003-02-21 | 2004-05-25 | Axcelis Technologies, Inc. | Adjustable implantation angle workpiece support structure for an ion beam implanter utilizing a linear scan motor |
US20040187787A1 (en) * | 2003-03-31 | 2004-09-30 | Dawson Keith E. | Substrate support having temperature controlled substrate support surface |
US6828572B2 (en) * | 2003-04-01 | 2004-12-07 | Axcelis Technologies, Inc. | Ion beam incident angle detector for ion implant systems |
US6794664B1 (en) | 2003-12-04 | 2004-09-21 | Axcelis Technologies, Inc. | Umbilical cord facilities connection for an ion beam implanter |
US7245357B2 (en) * | 2003-12-15 | 2007-07-17 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US6987272B2 (en) * | 2004-03-05 | 2006-01-17 | Axcelis Technologies, Inc. | Work piece transfer system for an ion beam implanter |
US7697260B2 (en) * | 2004-03-31 | 2010-04-13 | Applied Materials, Inc. | Detachable electrostatic chuck |
US7030395B2 (en) * | 2004-08-06 | 2006-04-18 | Axcelis Technologies, Inc. | Workpiece support structure for an ion beam implanter featuring spherical sliding seal vacuum feedthrough |
US7982195B2 (en) * | 2004-09-14 | 2011-07-19 | Axcelis Technologies, Inc. | Controlled dose ion implantation |
US8226769B2 (en) * | 2006-04-27 | 2012-07-24 | Applied Materials, Inc. | Substrate support with electrostatic chuck having dual temperature zones |
US7629597B2 (en) * | 2006-08-18 | 2009-12-08 | Axcelis Technologies, Inc. | Deposition reduction system for an ion implanter |
US7993465B2 (en) * | 2006-09-07 | 2011-08-09 | Applied Materials, Inc. | Electrostatic chuck cleaning during semiconductor substrate processing |
US7986146B2 (en) * | 2006-11-29 | 2011-07-26 | Globalfoundries Inc. | Method and system for detecting existence of an undesirable particle during semiconductor fabrication |
US20090181475A1 (en) * | 2008-01-11 | 2009-07-16 | Novellus Systems, Inc. | Detecting the presence of a workpiece relative to a carrier head |
US7558045B1 (en) * | 2008-03-20 | 2009-07-07 | Novellus Systems, Inc. | Electrostatic chuck assembly with capacitive sense feature, and related operating method |
US7948734B2 (en) * | 2008-09-11 | 2011-05-24 | Tel Epion Inc. | Electrostatic chuck power supply |
US8169769B2 (en) * | 2008-09-11 | 2012-05-01 | Tel Epion Inc. | Electrostatic chuck power supply |
US8514544B2 (en) * | 2009-08-07 | 2013-08-20 | Trek, Inc. | Electrostatic clamp optimizer |
JP6151028B2 (ja) * | 2013-01-17 | 2017-06-21 | 株式会社日立ハイテクノロジーズ | 荷電粒子線装置 |
JP6066084B2 (ja) * | 2013-12-11 | 2017-01-25 | 日新イオン機器株式会社 | 基板保持装置、半導体製造装置及び基板吸着判別方法 |
US9543110B2 (en) | 2013-12-20 | 2017-01-10 | Axcelis Technologies, Inc. | Reduced trace metals contamination ion source for an ion implantation system |
US11282732B2 (en) | 2014-02-07 | 2022-03-22 | Trek, Inc. | System and method for clamping a work piece |
US20150357151A1 (en) | 2014-06-10 | 2015-12-10 | Axcelis Technologies, Inc. | Ion implantation source with textured interior surfaces |
JP6942936B2 (ja) * | 2017-08-25 | 2021-09-29 | 株式会社アルバック | 真空装置、吸着電源 |
CN113984788B (zh) * | 2021-12-24 | 2022-03-15 | 北京凯世通半导体有限公司 | 一种通过光学检测仪器对超低温离子注入设备监测的方法 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4184188A (en) * | 1978-01-16 | 1980-01-15 | Veeco Instruments Inc. | Substrate clamping technique in IC fabrication processes |
US4261762A (en) * | 1979-09-14 | 1981-04-14 | Eaton Corporation | Method for conducting heat to or from an article being treated under vacuum |
US4384918A (en) * | 1980-09-30 | 1983-05-24 | Fujitsu Limited | Method and apparatus for dry etching and electrostatic chucking device used therein |
GB2147459A (en) * | 1983-09-30 | 1985-05-09 | Philips Electronic Associated | Electrostatic chuck for semiconductor wafers |
US4692836A (en) * | 1983-10-31 | 1987-09-08 | Toshiba Kikai Kabushiki Kaisha | Electrostatic chucks |
JPS6216540A (ja) * | 1985-07-15 | 1987-01-24 | Canon Inc | ウエハ搬送装置 |
US4733632A (en) * | 1985-09-25 | 1988-03-29 | Tokyo Electron Limited | Wafer feeding apparatus |
US4864461A (en) * | 1987-04-14 | 1989-09-05 | Kabushiki Kaisha Abisare | Machine unit having retaining device using static electricity |
JPS63257481A (ja) * | 1987-04-14 | 1988-10-25 | Abisare:Kk | 静電保持装置 |
WO1988009054A1 (en) * | 1987-05-06 | 1988-11-17 | Labtam Limited | Electrostatic chuck using ac field excitation |
US4962441A (en) * | 1989-04-10 | 1990-10-09 | Applied Materials, Inc. | Isolated electrostatic wafer blade clamp |
US5173834A (en) * | 1989-06-02 | 1992-12-22 | Roland Dg Corporation | Electrostatic attraction apparatus |
DE69104128T2 (de) * | 1990-06-08 | 1995-01-19 | Varian Associates | Spannen eines Werkstücks. |
US5325261A (en) * | 1991-05-17 | 1994-06-28 | Unisearch Limited | Electrostatic chuck with improved release |
US5315473A (en) * | 1992-01-21 | 1994-05-24 | Applied Materials, Inc. | Isolated electrostatic chuck and excitation method |
-
1993
- 1993-01-15 US US08/005,030 patent/US5436790A/en not_active Expired - Lifetime
-
1994
- 1994-01-12 KR KR1019940000410A patent/KR100284663B1/ko not_active IP Right Cessation
- 1994-01-13 CA CA002113290A patent/CA2113290C/en not_active Expired - Fee Related
- 1994-01-13 EP EP94300237A patent/EP0607043B1/en not_active Expired - Lifetime
- 1994-01-13 DE DE69400113T patent/DE69400113T2/de not_active Expired - Fee Related
- 1994-01-17 JP JP1699894A patent/JP3341221B2/ja not_active Ceased
- 1994-01-20 TW TW083100477A patent/TW231366B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CA2113290C (en) | 1999-11-30 |
JP3341221B2 (ja) | 2002-11-05 |
EP0607043A1 (en) | 1994-07-20 |
JPH077073A (ja) | 1995-01-10 |
DE69400113T2 (de) | 1996-10-24 |
CA2113290A1 (en) | 1994-07-16 |
US5436790A (en) | 1995-07-25 |
TW231366B (ko) | 1994-10-01 |
DE69400113D1 (de) | 1996-05-02 |
EP0607043B1 (en) | 1996-03-27 |
KR100284663B1 (ko) | 2001-04-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR940018947A (ko) | 웨이퍼 감지 및 클램핑 모니터 | |
KR940022782A (ko) | 웨이퍼 방출방법 및 장치 | |
FI913472A (fi) | Anordning foer detektering av foeraendring i viskositeten hos en vaetskeformig elektrolyt medelst en depolariseringseffekt. | |
DK0895744T3 (da) | Detektionsindretning til filterindretninger i støvsugere | |
KR970051249A (ko) | 모오스(mos) 캐패시터의 누설전압 감지회로 | |
GB2006435A (en) | Contact Sensing Probe | |
CA2432771A1 (en) | Temperature measuring method, object detecting method and object detecting device with vibrating-type level sensor | |
JP2695436B2 (ja) | 静電チャックの劣化検出回路 | |
EP1303024A3 (en) | Power supply control device for an image forming apparatus | |
JPH06162889A (ja) | 非接触式スイッチ | |
KR980006001A (ko) | 웨이퍼 고정용 정전척의 전원공급장치 | |
JP2539430B2 (ja) | 静電気検出装置 | |
JPS57151829A (en) | External diagnosis of switch device | |
KR940019563A (ko) | 고주파 용착장치 및 이를 사용한 필름 포장장치 | |
JPS55110917A (en) | Detecting device for liquid condition | |
KR970062160A (ko) | 세탁기의 오버플로워 방지 장치 | |
JPS5847383Y2 (ja) | レベル検知器 | |
KR930002834A (ko) | 전기회로의 끊어짐 점검장치 | |
JPS6480416A (en) | Air cleaning device | |
JPS6446123A (en) | Drive sequence of a/d touch key | |
RU2104619C1 (ru) | Электростатический микрофон | |
SU1394067A2 (ru) | Сигнализатор температуры | |
JPH0669753U (ja) | 液面検出器 | |
KR960026325A (ko) | 반도체 기판의 세정장치 | |
JP2000180244A (ja) | 液面検出装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
N231 | Notification of change of applicant | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20121129 Year of fee payment: 13 |
|
FPAY | Annual fee payment |
Payment date: 20131129 Year of fee payment: 14 |
|
EXPY | Expiration of term |