TW231366B - - Google Patents

Info

Publication number
TW231366B
TW231366B TW083100477A TW83100477A TW231366B TW 231366 B TW231366 B TW 231366B TW 083100477 A TW083100477 A TW 083100477A TW 83100477 A TW83100477 A TW 83100477A TW 231366 B TW231366 B TW 231366B
Authority
TW
Taiwan
Application number
TW083100477A
Original Assignee
Eaton Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=21713775&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW231366(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Eaton Corp filed Critical Eaton Corp
Application granted granted Critical
Publication of TW231366B publication Critical patent/TW231366B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Measurement Of Resistance Or Impedance (AREA)
  • Jigs For Machine Tools (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
TW083100477A 1993-01-15 1994-01-20 TW231366B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/005,030 US5436790A (en) 1993-01-15 1993-01-15 Wafer sensing and clamping monitor

Publications (1)

Publication Number Publication Date
TW231366B true TW231366B (zh) 1994-10-01

Family

ID=21713775

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083100477A TW231366B (zh) 1993-01-15 1994-01-20

Country Status (7)

Country Link
US (1) US5436790A (zh)
EP (1) EP0607043B1 (zh)
JP (1) JP3341221B2 (zh)
KR (1) KR100284663B1 (zh)
CA (1) CA2113290C (zh)
DE (1) DE69400113T2 (zh)
TW (1) TW231366B (zh)

Families Citing this family (73)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5467249A (en) * 1993-12-20 1995-11-14 International Business Machines Corporation Electrostatic chuck with reference electrode
US5463525A (en) * 1993-12-20 1995-10-31 International Business Machines Corporation Guard ring electrostatic chuck
GB2293689A (en) * 1994-09-30 1996-04-03 Nec Corp Electrostatic chuck
JP4079992B2 (ja) * 1994-10-17 2008-04-23 バリアン・セミコンダクター・エクイップメント・アソシエイツ・インコーポレイテッド 導電性被処理体を載置部材に締め付けるための装置及び静電クランピング方法
US5671116A (en) * 1995-03-10 1997-09-23 Lam Research Corporation Multilayered electrostatic chuck and method of manufacture thereof
US5670066A (en) * 1995-03-17 1997-09-23 Lam Research Corporation Vacuum plasma processing wherein workpiece position is detected prior to chuck being activated
US5754391A (en) * 1996-05-17 1998-05-19 Saphikon Inc. Electrostatic chuck
US6298737B1 (en) * 1996-05-29 2001-10-09 Integrated Device Technology, Inc. Ceramic ring undersize detection device
US5812362A (en) * 1996-06-14 1998-09-22 Applied Materials, Inc. Method and apparatus for the use of diamond films as dielectric coatings on electrostatic chucks
US5952060A (en) * 1996-06-14 1999-09-14 Applied Materials, Inc. Use of carbon-based films in extending the lifetime of substrate processing system components
US5980194A (en) * 1996-07-15 1999-11-09 Applied Materials, Inc. Wafer position error detection and correction system
US5835334A (en) * 1996-09-30 1998-11-10 Lam Research Variable high temperature chuck for high density plasma chemical vapor deposition
JP3245369B2 (ja) * 1996-11-20 2002-01-15 東京エレクトロン株式会社 被処理体を静電チャックから離脱する方法及びプラズマ処理装置
US5886864A (en) * 1996-12-02 1999-03-23 Applied Materials, Inc. Substrate support member for uniform heating of a substrate
TW325148U (en) * 1997-01-23 1998-01-11 Taiwan Semiconductor Mfg Co Ltd Temperature processing device
GB9711273D0 (en) 1997-06-03 1997-07-30 Trikon Equip Ltd Electrostatic chucks
US6075375A (en) * 1997-06-11 2000-06-13 Applied Materials, Inc. Apparatus for wafer detection
US6205870B1 (en) 1997-10-10 2001-03-27 Applied Komatsu Technology, Inc. Automated substrate processing systems and methods
US5901030A (en) * 1997-12-02 1999-05-04 Dorsey Gage, Inc. Electrostatic chuck employing thermoelectric cooling
US5872694A (en) * 1997-12-23 1999-02-16 Siemens Aktiengesellschaft Method and apparatus for determining wafer warpage for optimized electrostatic chuck clamping voltage
US5948986A (en) * 1997-12-26 1999-09-07 Applied Materials, Inc. Monitoring of wafer presence and position in semiconductor processing operations
US5886865A (en) * 1998-03-17 1999-03-23 Applied Materials, Inc. Method and apparatus for predicting failure of an eletrostatic chuck
US5969934A (en) * 1998-04-10 1999-10-19 Varian Semiconductor Equipment Associats, Inc. Electrostatic wafer clamp having low particulate contamination of wafers
TW432580B (en) * 1998-09-29 2001-05-01 Applied Materials Inc Piezoelectric method and apparatus for semiconductor wafer detection
US6113165A (en) * 1998-10-02 2000-09-05 Taiwan Semiconductor Manufacturing Co., Ltd. Self-sensing wafer holder and method of using
US6454332B1 (en) 1998-12-04 2002-09-24 Applied Materials, Inc. Apparatus and methods for handling a substrate
US6215640B1 (en) 1998-12-10 2001-04-10 Applied Materials, Inc. Apparatus and method for actively controlling surface potential of an electrostatic chuck
US6430022B2 (en) * 1999-04-19 2002-08-06 Applied Materials, Inc. Method and apparatus for controlling chucking force in an electrostatic
US6248642B1 (en) 1999-06-24 2001-06-19 Ibis Technology Corporation SIMOX using controlled water vapor for oxygen implants
US6452195B1 (en) 1999-08-18 2002-09-17 Ibis Technology Corporation Wafer holding pin
US6433342B1 (en) 1999-08-18 2002-08-13 Ibis Technology Corporation Coated wafer holding pin
US6423975B1 (en) 1999-08-18 2002-07-23 Ibis Technology, Inc. Wafer holder for simox processing
US6155436A (en) * 1999-08-18 2000-12-05 Ibis Technology Corporation Arc inhibiting wafer holder assembly
US6257001B1 (en) * 1999-08-24 2001-07-10 Lucent Technologies, Inc. Cryogenic vacuum pump temperature sensor
US6740853B1 (en) * 1999-09-29 2004-05-25 Tokyo Electron Limited Multi-zone resistance heater
WO2001024581A1 (en) * 1999-09-29 2001-04-05 Tokyo Electron Limited Multi-zone resistance heater
US6362946B1 (en) 1999-11-02 2002-03-26 Varian Semiconductor Equipment Associates, Inc. Electrostatic wafer clamp having electrostatic seal for retaining gas
US6538873B1 (en) 1999-11-02 2003-03-25 Varian Semiconductor Equipment Associates, Inc. Active electrostatic seal and electrostatic vacuum pump
US6307728B1 (en) * 2000-01-21 2001-10-23 Applied Materials, Inc. Method and apparatus for dechucking a workpiece from an electrostatic chuck
JP4615670B2 (ja) * 2000-04-19 2011-01-19 アプライド マテリアルズ インコーポレイテッド 静電チャックにおけるチャッキング力を制御する方法及び装置
KR100344221B1 (ko) * 2000-09-22 2002-07-20 삼성전자 주식회사 웨이퍼 클램프 텐션 측정 장치
US6403322B1 (en) 2001-03-27 2002-06-11 Lam Research Corporation Acoustic detection of dechucking and apparatus therefor
WO2002101377A1 (en) * 2001-06-07 2002-12-19 Tokyo Electron Limited Apparatus and method for determining clamping status of semiconductor wafer
US6998353B2 (en) * 2001-11-05 2006-02-14 Ibis Technology Corporation Active wafer cooling during damage engineering implant to enhance buried oxide formation in SIMOX wafers
US6710360B2 (en) 2002-07-10 2004-03-23 Axcelis Technologies, Inc. Adjustable implantation angle workpiece support structure for an ion beam implanter
US6900444B2 (en) * 2002-07-29 2005-05-31 Axcelis Technologies, Inc. Adjustable implantation angle workpiece support structure for an ion beam implanter
US6774373B2 (en) * 2002-07-29 2004-08-10 Axcelis Technologies, Inc. Adjustable implantation angle workpiece support structure for an ion beam implanter
US20040079289A1 (en) * 2002-10-23 2004-04-29 Kellerman Peter L. Electrostatic chuck wafer port and top plate with edge shielding and gas scavenging
US6740894B1 (en) 2003-02-21 2004-05-25 Axcelis Technologies, Inc. Adjustable implantation angle workpiece support structure for an ion beam implanter utilizing a linear scan motor
US20040187787A1 (en) * 2003-03-31 2004-09-30 Dawson Keith E. Substrate support having temperature controlled substrate support surface
US6828572B2 (en) * 2003-04-01 2004-12-07 Axcelis Technologies, Inc. Ion beam incident angle detector for ion implant systems
US6794664B1 (en) 2003-12-04 2004-09-21 Axcelis Technologies, Inc. Umbilical cord facilities connection for an ion beam implanter
US7245357B2 (en) * 2003-12-15 2007-07-17 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US6987272B2 (en) * 2004-03-05 2006-01-17 Axcelis Technologies, Inc. Work piece transfer system for an ion beam implanter
US7697260B2 (en) * 2004-03-31 2010-04-13 Applied Materials, Inc. Detachable electrostatic chuck
US7030395B2 (en) * 2004-08-06 2006-04-18 Axcelis Technologies, Inc. Workpiece support structure for an ion beam implanter featuring spherical sliding seal vacuum feedthrough
US7982195B2 (en) * 2004-09-14 2011-07-19 Axcelis Technologies, Inc. Controlled dose ion implantation
US8226769B2 (en) * 2006-04-27 2012-07-24 Applied Materials, Inc. Substrate support with electrostatic chuck having dual temperature zones
US7629597B2 (en) * 2006-08-18 2009-12-08 Axcelis Technologies, Inc. Deposition reduction system for an ion implanter
US7993465B2 (en) * 2006-09-07 2011-08-09 Applied Materials, Inc. Electrostatic chuck cleaning during semiconductor substrate processing
US7986146B2 (en) * 2006-11-29 2011-07-26 Globalfoundries Inc. Method and system for detecting existence of an undesirable particle during semiconductor fabrication
US20090181475A1 (en) * 2008-01-11 2009-07-16 Novellus Systems, Inc. Detecting the presence of a workpiece relative to a carrier head
US7558045B1 (en) * 2008-03-20 2009-07-07 Novellus Systems, Inc. Electrostatic chuck assembly with capacitive sense feature, and related operating method
US8169769B2 (en) * 2008-09-11 2012-05-01 Tel Epion Inc. Electrostatic chuck power supply
US7948734B2 (en) * 2008-09-11 2011-05-24 Tel Epion Inc. Electrostatic chuck power supply
US8514544B2 (en) * 2009-08-07 2013-08-20 Trek, Inc. Electrostatic clamp optimizer
JP6151028B2 (ja) * 2013-01-17 2017-06-21 株式会社日立ハイテクノロジーズ 荷電粒子線装置
JP6066084B2 (ja) * 2013-12-11 2017-01-25 日新イオン機器株式会社 基板保持装置、半導体製造装置及び基板吸着判別方法
US9543110B2 (en) 2013-12-20 2017-01-10 Axcelis Technologies, Inc. Reduced trace metals contamination ion source for an ion implantation system
GB2540883B (en) 2014-02-07 2018-12-26 Trek Inc System and method for clamping a work piece
US20150357151A1 (en) 2014-06-10 2015-12-10 Axcelis Technologies, Inc. Ion implantation source with textured interior surfaces
JP6942936B2 (ja) * 2017-08-25 2021-09-29 株式会社アルバック 真空装置、吸着電源
CN113984788B (zh) * 2021-12-24 2022-03-15 北京凯世通半导体有限公司 一种通过光学检测仪器对超低温离子注入设备监测的方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4184188A (en) * 1978-01-16 1980-01-15 Veeco Instruments Inc. Substrate clamping technique in IC fabrication processes
US4261762A (en) * 1979-09-14 1981-04-14 Eaton Corporation Method for conducting heat to or from an article being treated under vacuum
US4384918A (en) * 1980-09-30 1983-05-24 Fujitsu Limited Method and apparatus for dry etching and electrostatic chucking device used therein
GB2147459A (en) * 1983-09-30 1985-05-09 Philips Electronic Associated Electrostatic chuck for semiconductor wafers
US4692836A (en) * 1983-10-31 1987-09-08 Toshiba Kikai Kabushiki Kaisha Electrostatic chucks
JPS6216540A (ja) * 1985-07-15 1987-01-24 Canon Inc ウエハ搬送装置
US4733632A (en) * 1985-09-25 1988-03-29 Tokyo Electron Limited Wafer feeding apparatus
EP0297227B1 (en) * 1987-04-14 1993-03-17 Abisare Co., Ltd. Machine unit having retaining device using static electricity
JPS63257481A (ja) * 1987-04-14 1988-10-25 Abisare:Kk 静電保持装置
JP2678381B2 (ja) * 1987-05-06 1997-11-17 ユニサーチ・リミテッド 交流電界励振を利用した静電チャック
US4962441A (en) * 1989-04-10 1990-10-09 Applied Materials, Inc. Isolated electrostatic wafer blade clamp
US5173834A (en) * 1989-06-02 1992-12-22 Roland Dg Corporation Electrostatic attraction apparatus
EP0460954B1 (en) * 1990-06-08 1994-09-21 Varian Associates, Inc. Clamping a workpiece
US5325261A (en) * 1991-05-17 1994-06-28 Unisearch Limited Electrostatic chuck with improved release
US5315473A (en) * 1992-01-21 1994-05-24 Applied Materials, Inc. Isolated electrostatic chuck and excitation method

Also Published As

Publication number Publication date
CA2113290A1 (en) 1994-07-16
KR940018947A (ko) 1994-08-19
EP0607043B1 (en) 1996-03-27
US5436790A (en) 1995-07-25
CA2113290C (en) 1999-11-30
EP0607043A1 (en) 1994-07-20
DE69400113T2 (de) 1996-10-24
DE69400113D1 (de) 1996-05-02
JP3341221B2 (ja) 2002-11-05
KR100284663B1 (ko) 2001-04-02
JPH077073A (ja) 1995-01-10

Similar Documents

Publication Publication Date Title
FR10C0052I2 (zh)
TW231366B (zh)
EP0746323A4 (zh)
TW273616B (zh)
IN181745B (zh)
EP0723449A4 (zh)
IN181963B (zh)
ECSMU930027U (zh)
ECSDI930126S (zh)
ECSDI930173S (zh)
IN178895B (zh)
IN179436B (zh)
IN187324B (zh)
ECSDI930099S (zh)
IN180005B (zh)
IN188798B (zh)
IN187428B (zh)
IN180016B (zh)
IN180028B (zh)
IN179433B (zh)
IN186023B (zh)
IN185977B (zh)
IN183178B (zh)
IN182885B (zh)
IN180246B (zh)

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees