KR940016640A - 와이어본딩장치 - Google Patents

와이어본딩장치 Download PDF

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Publication number
KR940016640A
KR940016640A KR1019930026005A KR930026005A KR940016640A KR 940016640 A KR940016640 A KR 940016640A KR 1019930026005 A KR1019930026005 A KR 1019930026005A KR 930026005 A KR930026005 A KR 930026005A KR 940016640 A KR940016640 A KR 940016640A
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South Korea
Prior art keywords
bonding
height
loop
reverse
capillary
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KR1019930026005A
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English (en)
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KR970010766B1 (ko
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미츠히로 나카오
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사토 후미오
가부시키가이샤 도시바
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Publication of KR970010766B1 publication Critical patent/KR970010766B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05599—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48095—Kinked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/789—Means for monitoring the connection process
    • H01L2224/78901—Means for monitoring the connection process using a computer, e.g. fully- or semi-automatic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/049—Nitrides composed of metals from groups of the periodic table
    • H01L2924/0495—5th Group
    • H01L2924/04953—TaN

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)

Abstract

본 발명은 본딩와이어의 루프높이, 루프형상을 최적으로 함과 더불어 에지터치불량 및 본딩불량의 발생을 방지하고자 함에 그 목적이 있다.
이를 위해 본 발명은, 제 1 연산부(33)에 있어서 본딩단차 및 본딩와이어의 루프길이를 제1, 제 2 본딩위치에 의해 산출하고; 제 2 연산부(34)에 있어서 본딩단차, 루프길이 및 루프높이로부터 본딩와이어의 경사변의 길이, 이 경사변 및 내부리드와 베드를 결합하는 직선으로 이루어진 각도를 산출하며; 자동연산부(35)에 있어서 경사변의 길이, 상기 각도 및 루프높이로부터 개필러리를 윗쪽으로 이동시킬 때의 높이인 리버스 높이 및 캐필러리를 본딩위치의 반대측으로 이동시킬 때의 길이인 리버스량 및 캐필러리를 최고의 위치까지 이동시킬 때의 높이인 캐필러리 상승량을 산출하고 있다. 따라서, 본딩화이어의 루프높이 및 루프형상을 최적으로 할 수 있게 된다.

Description

와이어본딩장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1 도는 본 발명의 제1 및 제 2 실시예에 따른 와이어본딩장치의 주요부를 나타낸 단면도, 제 2 도는 본 발명의 제 1 도에 도시한 와이어본딩장치에 의해 와이어본딩장치에 의해 와이어본딩된 반도체장치의 주요부를 나타낸 단면도, 제 3 도는 본 발명의 제1 및 제 2 실시예에 따른 와이어본딩장치를 나타낸 구성도.

Claims (1)

  1. 인식부(32)에 의해 인식된 반도체칩에서의 본딩패드의 위치 및 리드프레임에서의 내부리드의 본딩위치로부터 본딩단차 및 본딩와이어의 루프길이를 산출하는 제 1 연산부(33)와, 캐필러리를 상기 본딩패드의 위치로부터 윗쪽으로 이동시킬 때의 높이인 리버스높이, 이 리버스높이까지 이동시킨 상기 캐필러리를 상기 본딩위치의 반대측으로 이동시킬 때의 길이인 리버스량 및 이 리버스량만큼 이동시킨 상기 캐필러리를 최고의 위치까지 이동시킬 때의 상기 반도체장치의 상면으로부터의 높이인 캐필러리 상승량을 상기 본딩단차 및 상기 루프길이로부터 산출하는 제 2 연산부(3)를 구비한 것을 특징으로 하는 와이어본딩장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019930026005A 1992-12-03 1993-12-01 와이어본딩장치 KR970010766B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP4323861A JP2823454B2 (ja) 1992-12-03 1992-12-03 ワイヤボンディング装置
JP92-323861 1992-12-03

Publications (2)

Publication Number Publication Date
KR940016640A true KR940016640A (ko) 1994-07-23
KR970010766B1 KR970010766B1 (ko) 1997-06-30

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Application Number Title Priority Date Filing Date
KR1019930026005A KR970010766B1 (ko) 1992-12-03 1993-12-01 와이어본딩장치

Country Status (5)

Country Link
US (1) US5395035A (ko)
EP (1) EP0604782B1 (ko)
JP (1) JP2823454B2 (ko)
KR (1) KR970010766B1 (ko)
DE (1) DE69329105T2 (ko)

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DE69433514T2 (de) * 1993-07-16 2004-11-11 Kaijo Corp., Hamura Drahtverbinder und zugehörige Methode
US5653375A (en) * 1994-10-29 1997-08-05 Samsung Aerospace Industries, Ltd. Wire bonding apparatus
TW424027B (en) * 1998-01-15 2001-03-01 Esec Sa Method of making wire connections of predetermined shaped
JP3377748B2 (ja) * 1998-06-25 2003-02-17 株式会社新川 ワイヤボンディング方法
US6073827A (en) * 1998-08-27 2000-06-13 Kulicke & Soffa Investments, Inc. Wire bonding capillary with a conical surface
US6405357B1 (en) * 2000-05-02 2002-06-11 Advanced Semiconductor Engineering, Inc. Method for positioning bond pads in a semiconductor die
EP1187190A1 (en) * 2000-09-11 2002-03-13 Marconi Communications GmbH Method for monitoring the length of constant-wire-length bonds & apparatus therefor
JP4738675B2 (ja) * 2001-09-14 2011-08-03 ルネサスエレクトロニクス株式会社 半導体装置
CN102047400B (zh) * 2008-03-17 2013-01-30 库力索法工业公司 用于线焊机的导线放线测量和校准技术
TWI573235B (zh) 2009-09-11 2017-03-01 羅姆股份有限公司 半導體裝置及其製造方法
JP6002461B2 (ja) * 2011-08-26 2016-10-05 ローム株式会社 半導体装置および電子デバイス
CN107301989A (zh) * 2017-06-06 2017-10-27 深圳国民飞骧科技有限公司 一种确定焊线芯片表面焊盘间距的方法
US20240006193A1 (en) * 2020-11-25 2024-01-04 Shinkawa Ltd. Semiconductor device manufacturing method and manufacturing apparatus

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JPS6362242A (ja) * 1986-09-02 1988-03-18 Toshiba Corp ワイヤボンディング装置
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JPH0713988B2 (ja) * 1990-02-13 1995-02-15 株式会社東芝 ワイヤボンディング方法
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JPH04273135A (ja) * 1991-02-27 1992-09-29 Shinkawa Ltd ワイヤボンデイング方法

Also Published As

Publication number Publication date
JP2823454B2 (ja) 1998-11-11
DE69329105T2 (de) 2001-03-22
DE69329105D1 (de) 2000-08-31
KR970010766B1 (ko) 1997-06-30
US5395035A (en) 1995-03-07
EP0604782A1 (en) 1994-07-06
EP0604782B1 (en) 2000-07-26
JPH06177195A (ja) 1994-06-24

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