KR920017206A - 와이어 본더용의 프레임 고정장치 - Google Patents

와이어 본더용의 프레임 고정장치 Download PDF

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Publication number
KR920017206A
KR920017206A KR1019920001472A KR920001472A KR920017206A KR 920017206 A KR920017206 A KR 920017206A KR 1019920001472 A KR1019920001472 A KR 1019920001472A KR 920001472 A KR920001472 A KR 920001472A KR 920017206 A KR920017206 A KR 920017206A
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South Korea
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frame
heater block
presser
down cam
cam
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KR1019920001472A
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KR950003898B1 (ko
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히로시 우시기
노보루 후지노
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아라이 가즈오
가부시끼가이샤 신가와
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H01L2224/78302—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/788—Means for moving parts
    • H01L2224/78821—Upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/78822—Rotational mechanism
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)

Abstract

내용 없음

Description

와이어 본더용의 프레임 고정장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 한 실시예를 도시하는 와이어 본더용 프레임 고정장치의 평면도.

Claims (2)

  1. 리이드 프레임을 지지하는 가이드 레일과, 리이드 프레임의 밑쪽에 상하동이 가능하도록 설치된 히터블록과 리이드 프레임의 윗쪽에 상하동이 가능하도록 설치된 프레임 누르개와, 히터블록 및 프레임 누르개를 상하동시키는 히터블록 상하동용 캠 및 프레임 누르개 상하동용 캠과, 히터블록 상하동용 캠 및 프레임 누르개 상하동용 캠에 의해서 히터블록 및 프레임 누르개가 상하동하여 히터블록 및 프레임 누르개를 가압하도록 각각에 대응해서 설치된 스프링과, 히터블록 상하동용 캠 및 프레임 누르개 상하동용 캠을 회전시키는 모우터를 비치한 와이어 본더용 프레임 고정장치에 있어서, 히터블록 및 프레임 누르개의 상승은 히터블록 상하동용 캠 및 프레임 누르개 상하동용 캠에 의해서 강제적으로 행해지고 히터블록 및 프레임 누르개의 하강은 각각 스프링에 의해서 행해지고, 또한 히터블록이 상한위치에 위치할때는 그 히터블록의 상승에 이해 프레임 누르개를 상승시키도록 구성해서 이루어진 것을 특징으로 하는 와이어 본더용 프레임 고정장치.
  2. 리이드 프레임을 지지하는 가이드 레일과, 리이드 프레임의 아래에 상하동이 가능하도록 설치된 히터블록과 리이드 프레임의 윗쪽에 상하동이 가능하도록 설치된 프레임 누르개와, 히터블록 및 프레임 누르개를 상하동시키는 히터블록 상하동용 캠 및 프레임 누르개 상하동용 캠과, 히터블록 상하동용 캠 및 프레임 누르개 상하동용 캠에 의해서 히터블록 및 프레임 누르개가 상하동하여 히터블록 및 프레임 누르개를 가압하도록 각각에 대응해서 설치된 스프링과, 히터블록 상하동용 캠 및 프레임 누르개 상하동용 캠을 회전시키는 모우터와를 비치한 와이어 본더용 프레임 고정장치에 있어서, 히터블록 및 프레임 누르개의 하승은 히터블록 상하동용 캠 및 프레임 누르개 상하동용 캠에 의해서 강제적으로 행해지고 히터블록 및 프레임 누르개의 상승은 각각 스프링에 의해서 행해지고, 또한 프레임 누르개가 하한위치에 위치할때는 그 프레임 누르개의 하강에 의해서 그 히터블록을 하강시키도록 구성한 것을 특징으로 하는 와이어 본더용 프레임 고정장치.
    ※참고사항:최초출원 내용에 의하여 공개하는 것임.
KR1019920001472A 1991-02-15 1992-01-31 와이어 본더용 프레임 고정장치 KR950003898B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP03042359A JP3094374B2 (ja) 1991-02-15 1991-02-15 ワイヤボンダ用フレーム固定装置
JP91-042359 1991-02-15

Publications (2)

Publication Number Publication Date
KR920017206A true KR920017206A (ko) 1992-09-26
KR950003898B1 KR950003898B1 (ko) 1995-04-20

Family

ID=12633842

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920001472A KR950003898B1 (ko) 1991-02-15 1992-01-31 와이어 본더용 프레임 고정장치

Country Status (3)

Country Link
US (1) US5181646A (ko)
JP (1) JP3094374B2 (ko)
KR (1) KR950003898B1 (ko)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3020190B2 (ja) * 1993-08-18 2000-03-15 株式会社新川 リードフレーム押え装置
US5890644A (en) * 1996-01-26 1999-04-06 Micron Technology, Inc. Apparatus and method of clamping semiconductor devices using sliding finger supports
US5673845A (en) * 1996-06-17 1997-10-07 Micron Technology, Inc. Lead penetrating clamping system
JP3264851B2 (ja) * 1997-01-24 2002-03-11 株式会社新川 ボンディング装置
US5971256A (en) 1997-02-05 1999-10-26 Micron Technology, Inc. Quick change precisor
JP2001015545A (ja) 1999-07-02 2001-01-19 Shinkawa Ltd ワイヤボンディング装置及び方法
JP4298176B2 (ja) * 2001-01-19 2009-07-15 株式会社新川 ボンディング装置用ワーク押さえ
JP4298178B2 (ja) 2001-02-08 2009-07-15 株式会社新川 ボンディング装置用ワーク固定装置
US7070086B2 (en) * 2004-03-03 2006-07-04 Honeywell International Inc. Sensor pre-load and weld fixture apparatus and method
US7059511B2 (en) * 2004-03-15 2006-06-13 Honeywell International Inc. Adjustable force and position pre-load welding fixture
JP4547285B2 (ja) * 2005-03-17 2010-09-22 株式会社新川 バンプ形成装置
WO2011011298A2 (en) * 2009-07-20 2011-01-27 Kulicke And Soffa Industries, Inc. Method of operating a clamping system of a wire bonding machine
GB2473600B (en) * 2009-08-25 2013-09-25 Pillarhouse Int Ltd Quick-loading soldering apparatus
CN102054730B (zh) * 2010-11-19 2013-04-17 上海凯虹电子有限公司 引线框架的传送装置以及粘贴芯片的方法
CN105364330B (zh) * 2015-11-17 2018-04-13 深圳市德沃先进自动化有限公司 半导体封装焊线设备
CN105522288B (zh) * 2015-11-25 2018-05-22 深圳市德沃先进自动化有限公司 一种led焊线机

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5596648A (en) * 1979-01-18 1980-07-23 Toshiba Corp Wire bonding apparatus
US4550871A (en) * 1982-08-24 1985-11-05 Asm Assembly Automation Ltd. Four-motion wire bonder
JPS60195945A (ja) * 1984-03-19 1985-10-04 Hitachi Ltd ワイヤボンデイング装置
JPS60227432A (ja) * 1984-04-26 1985-11-12 Nec Corp ボンデイング用ワイヤのボ−ル形成装置
JPS63194343A (ja) * 1987-02-09 1988-08-11 Toshiba Corp ワイヤボンディング装置の制御方法

Also Published As

Publication number Publication date
JPH04262545A (ja) 1992-09-17
KR950003898B1 (ko) 1995-04-20
US5181646A (en) 1993-01-26
JP3094374B2 (ja) 2000-10-03

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