CN107301989A - 一种确定焊线芯片表面焊盘间距的方法 - Google Patents

一种确定焊线芯片表面焊盘间距的方法 Download PDF

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CN107301989A
CN107301989A CN201710419620.2A CN201710419620A CN107301989A CN 107301989 A CN107301989 A CN 107301989A CN 201710419620 A CN201710419620 A CN 201710419620A CN 107301989 A CN107301989 A CN 107301989A
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bonding wire
chip surface
pad spacing
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吴现伟
龙华
郑瑞
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Shenzhen National Fly Technology Co Ltd Xiang
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Priority to US16/619,578 priority patent/US20200135685A1/en
Priority to PCT/CN2017/104711 priority patent/WO2018223569A1/zh
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Abstract

本发明涉及一种确定焊线芯片表面焊盘间距的方法。该方法包括以下步骤：设定线弧高度，定义为K；选取劈刀，测量劈刀尖嘴外扩角度，定义为C；测量劈刀尖嘴直径，定义为T；测量劈刀孔径，定义为H；确定焊线芯片表面焊盘间距，定义为P，公式如下：P＝(T+H)/2+[tan(C/2)]*K。本发明所述的方法可以更准确地确定焊线芯片表面焊盘间距，从而可提供更宽性能调试空间；此外，还可以降低封装劈刀与已焊线触碰导致线变形，甚至与其它线短路等，导致互感变异等问题，从而提高工作效率，并减少验证次数。

Description

一种确定焊线芯片表面焊盘间距的方法
技术领域
本发明涉及焊接领域，具体涉及一种确定焊线芯片表面焊盘间距的方法。
背景技术
PA(PA，指功率放大器)类产品相较其它IC功能产品主要考虑RF(RF，指射频)输出/输入稳定性，且芯片是前期开发材料，大多性能输出和输入已定性，可调空间较小。因此，在封装加工焊线工艺上需要线弧高度(loop height)有较宽的调试空间及3D轮廓的稳定性。
当线弧高度较高且焊盘间距很近时，封装作业会有触碰到已完成的3D轮廓线上，即，在封装作业时，因未能提前考虑到焊盘间距，而导致的3D轮廓线的稳定性遭到破坏。另外，为了让封装有更大可调空间，芯片设计焊盘大小和位置时需要考虑焊盘间距越大越好，但因芯片本身尺寸较小导致间距可调性低，因此需要提前知道线弧高度与焊盘间距的关系，才能更好地完成封装。
发明内容
为解决上述问题，本发明提供一种确定焊线芯片表面焊盘间距的方法。
本发明所述的确定焊线芯片表面焊盘间距的方法，包括以下步骤：
设定线弧高度，定义为K；
选取劈刀，测量劈刀尖嘴外扩角度，定义为C；测量劈刀尖嘴直径，定义为T；测量劈刀孔径，定义为H；
确定焊线芯片表面焊盘间距，定义为P，公式如下：
P＝(T+H)/2+[tan(C/2)]*K。
具体地，该方法还包括以下步骤：
对通过公式得到的焊盘间距进行凑整进制处理。
优选地，当线径为25um时，选取劈刀的劈刀尖嘴外扩角度C为30°。
优选地，当线径为25um时，选取劈刀的劈刀尖嘴直径T为80um～100um。
特别地，将所述劈刀的劈刀孔径H设置为大于线径。
更特别地，将所述劈刀的劈刀孔径H设置为大于线径3～8um。
本发明所述的方法可以更准确地确定焊线芯片表面焊盘间距，从而可提供更宽性能调试空间；此外，还可以降低封装劈刀与已焊线触碰导致线变形，甚至与其它线短路等，导致互感变异等问题，从而提高工作效率，并减少验证次数。
附图说明
图1是本发明所述的确定焊线芯片表面焊盘间距的方法的示意图。
具体实施方式
以下结合附图和实施例，对本发明的具体实施方式进行更加详细的说明，以便能够更好地理解本发明的方案及其各个方面的优点。然而，以下描述的具体实施方式和实施例仅是说明的目的，而不是对本发明的限制。
为了让封装有更大可调空间，芯片设计焊盘大小和位置时时需要考虑焊盘间距越大越好，但因芯片本身尺寸较小导致间距可调性低，因此需要提前知道线弧高度与焊盘间距的关系，才能更好地完成封装。封装过程中，最常使用的工具为劈刀，劈刀是用来引导焊线并传递焊线设备参数，辅助焊球与焊盘结合的消耗类部件。
如图1所示，本发明提供一种确定焊线芯片表面焊盘间距的方法，包括以下步骤：
Step1：设定线弧高度，定义为K。线弧是指焊线利用劈刀运行轨迹过程中放线形成的焊线形状，线弧高度的设定要根据实际工作需要进行人为设定，是后续工作的基础，如果弧高更改为更高且焊线形状需要保持不变，则焊线芯片表面焊盘间距也要随之发生变化。
Step2：选取劈刀，(1)测量劈刀尖嘴外扩角度，定义为C；(2)测量劈刀尖嘴直径，定义为T；(3)测量劈刀孔径，定义为H。其中，如图1所示，劈刀尖嘴外扩角度是指尖嘴外形与纵轴间角度，劈刀尖嘴直径指的是尖嘴平面圆形直径，劈刀孔径指的是劈刀内引导线的内孔最窄处直径。焊线的直径，简称线径，优选地，当线径选取为25um时，选取劈刀的参数为劈刀尖嘴外扩角度C为30°，劈刀的劈刀尖嘴直径T为80um～100um，选取劈刀的标准在于劈刀不能过大，且易于控制，以便更好地在所述焊线芯片表面施工，最终实现封装。还需要将所述劈刀的劈刀孔径H设置为大于线径，具体地，将所述劈刀的劈刀孔径H设置为大于线径3～8um，因焊线在劈刀孔中是摆动的，焊线与焊盘施工稳定后也为了线根据劈刀轨迹输出形成线弧，因此要留有一定的空隙，即线径通常为25um，则劈刀孔径为28～33um即可。
Step3：确定焊线芯片表面焊盘间距，定义为P，公式如下：
P＝(T+H)/2+[tan(C/2)]*K。
具体地，该方法还包括以下步骤：对通过公式得到的焊盘间距进行凑整进制处理。
特别地，为了不使封装作业会有触碰到已完成的3D轮廓线上以及操作简单，需对上述公式计算得出的P值进行凑整进制处理，得到P值最小值Pmin，举例来说，P＝100.1um，则要近似为Pmin＝101um，也就是说，焊线芯片表面焊盘间距最少为101um，才能不会触碰到已完成的3D轮廓线上，从而降低封装劈刀与已焊线触碰导致线变形，甚至与其它线短路等，导致互感变异等问题，从而提高工作效率，并减少验证次数。
实施例1
已知线径为25um，此时设定线弧高度K为280um。
选取劈刀，劈刀尖嘴外扩角度C为30°；劈刀尖嘴直径T为80um；劈刀孔径H选取30um。
确定焊线芯片表面焊盘间距，定义为P，公式如下：
P＝(T+H)/2+[tan(C/2)]*K
带入数值可得：
P＝(T+H)/2+[tan(C/2)]*K
P＝1/2(80um+30um)+(tan15°)*280um
＝55um+75.04um
＝130.04um
对P值进行凑整进制处理，即,凑整进制为Pmin＝131um，因此确定焊线芯片表面焊盘间距为至少131um，在此前提下，进行其他操作，则不会触碰到已完成的3D轮廓线上，从而降低封装劈刀与已焊线触碰导致线变形，甚至与其它线短路等，导致互感变异等问题，从而提高工作效率，并减少验证次数。
需要说明的是，以上参照附图所描述的各个实施例仅用以说明本发明而非限制本发明的范围，本领域的普通技术人员应当理解，在不脱离本发明的精神和范围的前提下对本发明进行的修改或者等同替换，均应涵盖在本发明的范围之内。此外，除上下文另有所指外，以单数形式出现的词包括复数形式，反之亦然。另外，除非特别说明，那么任何实施例的全部或一部分可结合任何其它实施例的全部或一部分来使用。

Claims (6)

1.一种确定焊线芯片表面焊盘间距的方法，其特征在于，该方法包括以下步骤：
设定线弧高度，定义为K；
选取劈刀，测量劈刀尖嘴外扩角度，定义为C；测量劈刀尖嘴直径，定义为T；测量劈刀孔径，定义为H；
确定焊线芯片表面焊盘间距，定义为P，公式如下：
P＝(T+H)/2+[tan(C/2)]*K。
2.如权利要求1所述的方法，其特征在于，该方法还包括以下步骤：
对通过公式得到的焊盘间距进行凑整进制处理。
3.如权利要求1所述的方法，其特征在于，当线径为25um时，选取劈刀的劈刀尖嘴外扩角度C为30°。
4.如权利要求1所述的方法，其特征在于，当线径为25um时，选取劈刀的劈刀尖嘴直径T为80um～100um。
5.如权利要求1所述的方法，其特征在于，将所述劈刀的劈刀孔径H设置为大于线径。
6.如权利要求5所述的方法，其特征在于，将所述劈刀的劈刀孔径H设置为大于线径3～8um。
CN201710419620.2A 2017-06-06 2017-06-06 一种确定焊线芯片表面焊盘间距的方法 Pending CN107301989A (zh)

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CN201710419620.2A CN107301989A (zh) 2017-06-06 2017-06-06 一种确定焊线芯片表面焊盘间距的方法
US16/619,578 US20200135685A1 (en) 2017-06-06 2017-09-30 Method for determining bonding pad spacing on the surface of bonding wire chip
PCT/CN2017/104711 WO2018223569A1 (zh) 2017-06-06 2017-09-30 一种确定焊线芯片表面焊盘间距的方法

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