KR940002771Y1 - 리드 프레임의 인너리드 클램프장치 - Google Patents

리드 프레임의 인너리드 클램프장치 Download PDF

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Publication number
KR940002771Y1
KR940002771Y1 KR2019910006846U KR910006846U KR940002771Y1 KR 940002771 Y1 KR940002771 Y1 KR 940002771Y1 KR 2019910006846 U KR2019910006846 U KR 2019910006846U KR 910006846 U KR910006846 U KR 910006846U KR 940002771 Y1 KR940002771 Y1 KR 940002771Y1
Authority
KR
South Korea
Prior art keywords
clamp
inner lead
lead
bolt
frame
Prior art date
Application number
KR2019910006846U
Other languages
English (en)
Korean (ko)
Other versions
KR920022184U (ko
Inventor
유중하
Original Assignee
금성일렉트론 주식회사
문정환
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 금성일렉트론 주식회사, 문정환 filed Critical 금성일렉트론 주식회사
Priority to KR2019910006846U priority Critical patent/KR940002771Y1/ko
Priority to US07/795,451 priority patent/US5193733A/en
Priority to DE4142649A priority patent/DE4142649C2/de
Priority to JP1992002094U priority patent/JP2509298Y2/ja
Publication of KR920022184U publication Critical patent/KR920022184U/ko
Application granted granted Critical
Publication of KR940002771Y1 publication Critical patent/KR940002771Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4825—Connection or disconnection of other leads to or from flat leads, e.g. wires, bumps, other flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
KR2019910006846U 1991-05-14 1991-05-14 리드 프레임의 인너리드 클램프장치 KR940002771Y1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR2019910006846U KR940002771Y1 (ko) 1991-05-14 1991-05-14 리드 프레임의 인너리드 클램프장치
US07/795,451 US5193733A (en) 1991-05-14 1991-11-21 Clamping device for inner leads of lead frame
DE4142649A DE4142649C2 (de) 1991-05-14 1991-12-21 Klemmvorrichtung für die Innenleiter eines Leiterrahmens
JP1992002094U JP2509298Y2 (ja) 1991-05-14 1992-01-24 リ―ドフレ―ムのインナ―リ―ドクランプ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019910006846U KR940002771Y1 (ko) 1991-05-14 1991-05-14 리드 프레임의 인너리드 클램프장치

Publications (2)

Publication Number Publication Date
KR920022184U KR920022184U (ko) 1992-12-19
KR940002771Y1 true KR940002771Y1 (ko) 1994-04-23

Family

ID=19313797

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019910006846U KR940002771Y1 (ko) 1991-05-14 1991-05-14 리드 프레임의 인너리드 클램프장치

Country Status (4)

Country Link
US (1) US5193733A (de)
JP (1) JP2509298Y2 (de)
KR (1) KR940002771Y1 (de)
DE (1) DE4142649C2 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100276781B1 (ko) * 1992-02-03 2001-01-15 비센트 비. 인그라시아 리드-온-칩 반도체장치 및 그 제조방법
US5217111A (en) * 1992-05-15 1993-06-08 General Electric Company Screw retainer for a molded case circuit breaker movable contact arm arrangement
DE4338246A1 (de) * 1993-11-09 1995-05-11 Siemens Ag Vorrichtung zur Herstellung von Drahtkontaktierungen zwischen Anschlüssen eines Halbleiterchips und eines Systemträgers
KR0145128B1 (ko) * 1995-04-24 1998-08-17 김광호 열방열 핀을 구비한 내부 리드 본딩 장치 및 이를 이용한 내부 리드 본딩 방법
US5890644A (en) 1996-01-26 1999-04-06 Micron Technology, Inc. Apparatus and method of clamping semiconductor devices using sliding finger supports
US5673845A (en) * 1996-06-17 1997-10-07 Micron Technology, Inc. Lead penetrating clamping system
US5954842A (en) * 1996-01-26 1999-09-21 Micron Technology, Inc. Lead finger clamp assembly
US5611478A (en) * 1996-03-11 1997-03-18 National Semiconductor Corporation Lead frame clamp for ultrasonic bonding
US6068174A (en) * 1996-12-13 2000-05-30 Micro)N Technology, Inc. Device and method for clamping and wire-bonding the leads of a lead frame one set at a time
US6121674A (en) 1998-02-23 2000-09-19 Micron Technology, Inc. Die paddle clamping method for wire bond enhancement
US6126062A (en) * 1998-04-02 2000-10-03 Micron Technology, Inc. Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits
US6634538B2 (en) 1998-04-02 2003-10-21 Micron Technology, Inc. Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits
US6062459A (en) * 1998-04-29 2000-05-16 Advanced Micro Devices, Inc. Wire bond clamp
US6977214B2 (en) * 1998-12-11 2005-12-20 Micron Technology, Inc. Die paddle clamping method for wire bond enhancement
TWI244419B (en) * 2003-09-25 2005-12-01 Unaxis Internat Tranding Ltd Wire bonder with a downholder for pressing the fingers of a system carrier onto a heating plate
JP2005340677A (ja) * 2004-05-31 2005-12-08 Matsushita Electric Ind Co Ltd ワイヤボンダの押さえパーツおよび支持パーツ
SG143997A1 (en) * 2006-12-21 2008-07-29 Rokko Technology Pte Ltd A clamping assembly
CN203827615U (zh) * 2013-12-23 2014-09-10 中兴通讯股份有限公司 一种焊接托盘
CN104022045B (zh) * 2014-06-20 2016-08-17 成都先进功率半导体股份有限公司 一种压平引线框架上索引孔的装置
CN104942504B (zh) * 2015-06-05 2017-02-01 中船黄埔文冲船舶有限公司 阳极块安装用可调节辅助手柄
MY183541A (en) 2016-03-01 2021-02-25 Carsem M Sdn Bhd Flexible window clamp
CN109047582B (zh) * 2018-07-23 2019-06-28 江苏宝浦莱半导体有限公司 一种用于封装半导体元件用的切筋成型机及其使用方法
CN110847033B (zh) * 2019-12-02 2021-07-27 中冶建工集团有限公司 桥梁护栏钢筋定位装置
KR102456505B1 (ko) * 2021-04-02 2022-10-18 박태인 기판 클램핑 장치
CN114778285A (zh) * 2022-06-21 2022-07-22 北京世维通科技股份有限公司 一种用于调制器的引线键合力测试的夹具

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5288970A (en) * 1976-01-17 1977-07-26 Iwao Yamashita Operation circuit for lumber conveyor
DE3401286C2 (de) * 1984-01-16 1986-02-20 Deubzer-Eltec GmbH, 8000 München Bondgerät
US4979663A (en) * 1986-08-27 1990-12-25 Digital Equipment Corporation Outer lead tape automated bonding system
DD261881A1 (de) * 1987-07-01 1988-11-09 Erfurt Mikroelektronik Anordnung zur verringerung des temperaturgradienten beim thermokompressions- und thermosonic-drahtbonden
JPH0252444A (ja) * 1988-08-17 1990-02-22 Nec Kyushu Ltd ワイヤボンディング装置
JPH0258845A (ja) * 1988-08-25 1990-02-28 Toshiba Corp 超音波ワイヤボンディング装置
JPH02129729U (de) * 1989-03-30 1990-10-25
US5035034A (en) * 1990-07-16 1991-07-30 Motorola, Inc. Hold-down clamp with mult-fingered interchangeable insert for wire bonding semiconductor lead frames

Also Published As

Publication number Publication date
DE4142649A1 (de) 1992-11-19
US5193733A (en) 1993-03-16
KR920022184U (ko) 1992-12-19
JPH0520326U (ja) 1993-03-12
JP2509298Y2 (ja) 1996-08-28
DE4142649C2 (de) 1997-01-16

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