JPH0430186B2 - - Google Patents
Info
- Publication number
- JPH0430186B2 JPH0430186B2 JP23346282A JP23346282A JPH0430186B2 JP H0430186 B2 JPH0430186 B2 JP H0430186B2 JP 23346282 A JP23346282 A JP 23346282A JP 23346282 A JP23346282 A JP 23346282A JP H0430186 B2 JPH0430186 B2 JP H0430186B2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- warpage
- frames
- ribbon
- warp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 16
- 238000000034 method Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 6
- 238000005192 partition Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23346282A JPS59123254A (ja) | 1982-12-28 | 1982-12-28 | リボン状材料の反り修正装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23346282A JPS59123254A (ja) | 1982-12-28 | 1982-12-28 | リボン状材料の反り修正装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59123254A JPS59123254A (ja) | 1984-07-17 |
| JPH0430186B2 true JPH0430186B2 (de) | 1992-05-21 |
Family
ID=16955406
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23346282A Granted JPS59123254A (ja) | 1982-12-28 | 1982-12-28 | リボン状材料の反り修正装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59123254A (de) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010269368A (ja) * | 2009-05-25 | 2010-12-02 | T K R:Kk | プレス金型構造 |
-
1982
- 1982-12-28 JP JP23346282A patent/JPS59123254A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59123254A (ja) | 1984-07-17 |
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