KR930018703A - 반도체 리드 프레임 - Google Patents

반도체 리드 프레임

Info

Publication number
KR930018703A
KR930018703A KR1019920002797A KR920002797A KR930018703A KR 930018703 A KR930018703 A KR 930018703A KR 1019920002797 A KR1019920002797 A KR 1019920002797A KR 920002797 A KR920002797 A KR 920002797A KR 930018703 A KR930018703 A KR 930018703A
Authority
KR
South Korea
Prior art keywords
semiconductor
lead frame
lead
cross
chip bonding
Prior art date
Application number
KR1019920002797A
Other languages
English (en)
Other versions
KR950003908B1 (ko
Inventor
오동렬
정현조
권홍규
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019920002797A priority Critical patent/KR950003908B1/ko
Priority to JP4306906A priority patent/JP2507855B2/ja
Priority to US08/006,202 priority patent/US5250840A/en
Publication of KR930018703A publication Critical patent/KR930018703A/ko
Application granted granted Critical
Publication of KR950003908B1 publication Critical patent/KR950003908B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/061—Disposition
    • H01L2224/0612—Layout
    • H01L2224/0615—Mirror array, i.e. array having only a reflection symmetry, i.e. bilateral symmetry
    • H01L2224/06154—Mirror array, i.e. array having only a reflection symmetry, i.e. bilateral symmetry covering only portions of the surface to be connected
    • H01L2224/06156—Covering only the central area of the surface to be connected, i.e. central arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

이 발명은 십자형태로 배열 형성된 칩 본딩 패드를 이용하여 디바이스의 신뢰성 향상 및 특성을 개선할 수 있는 반도체 리드 프레임을 개재한다
또한, 이와같이 구성된 반도체 리드 프레임은 다핀화 LOC (High pin Lead Chip)에 적용 기능하며, 반도체 리드 프레임의 설계 및 팁 패드의 배열 자유도가 증대되고, 버스바를 2개에서 4개까지 자유롭게 설계할 수 있다.

Description

반도체 리드 프레임
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제2도는 이 발명에 따른 LOC용 리드 프레임의 평면도이다.

Claims (6)

  1. 주변에 회로 및 여러개의 외부단자가 형성된 사각형상의 반도체 칩과, 내부리드부와 상기 내부리드부와 접속되어 있으며 내부리드에서 밀어지는 방향으로 연장하는 외부리드부로 되는 여러개의 리드와, 상기 리드의 주위에 형성된 버스바와, 상기 반도체 칩과 내부리드 사이에 개재해서 전기적으로 절연하기 위한 적어도 1개의 절연체와, 상기 외부단자와 내부리드를 전기적으로 접속하기 위한 금속와이어를 포함하는 반도체 리드 프레임으로서, 상기 외부단자와 내부리드를 전기적으로 접속하기 위하여 다수개의 칩 본딩 패드를 십자형으로 배열 형성시킨 십자형태의 칩 본딩 패드를 구비한 반도체 리드 프레임.
  2. 제1항에 있어서, 상기 내부리드부를 30~60°정도 경사지게 형성할 수 있도록 한 반도체 리드 프레임.
  3. 제1항에 있어서, 상기 버스바는 2개에서 4개 정도까지 설치할 수 있도록 한 반도체 리드 프레임.
  4. 제1항에 있어서, 상기 반도체 리드 프레임은 십자형 칩 본딩 패드 배열에 적합하도록 설계 및 제조할 수 있도록 한 반도체 리드 프레임.
  5. 제1항에 있어서, 상기 십자형태의 칩 본딩 패드는 패드의 배열 및 배치의 자유도를 크게 할 수 있도록 한 반도체 리드 프레임.
  6. 제1항에 있어서, 상기 십자형태의 칩 본딩 패드는 칩의 크기를 최소화시킬 수 있도록 한 반도체 리드 프레임.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019920002797A 1992-02-24 1992-02-24 반도체 리드 프레임 KR950003908B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1019920002797A KR950003908B1 (ko) 1992-02-24 1992-02-24 반도체 리드 프레임
JP4306906A JP2507855B2 (ja) 1992-02-24 1992-11-17 半導体装置
US08/006,202 US5250840A (en) 1992-02-24 1993-01-19 Semiconductor lead frame with a chip having bonding pads in a cross arrangement

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019920002797A KR950003908B1 (ko) 1992-02-24 1992-02-24 반도체 리드 프레임

Publications (2)

Publication Number Publication Date
KR930018703A true KR930018703A (ko) 1993-09-22
KR950003908B1 KR950003908B1 (ko) 1995-04-20

Family

ID=19329409

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920002797A KR950003908B1 (ko) 1992-02-24 1992-02-24 반도체 리드 프레임

Country Status (2)

Country Link
JP (1) JP2507855B2 (ko)
KR (1) KR950003908B1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100708046B1 (ko) * 2001-10-23 2007-04-16 앰코 테크놀로지 코리아 주식회사 반도체패키지용 섭스트레이트

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100708046B1 (ko) * 2001-10-23 2007-04-16 앰코 테크놀로지 코리아 주식회사 반도체패키지용 섭스트레이트

Also Published As

Publication number Publication date
KR950003908B1 (ko) 1995-04-20
JPH05283592A (ja) 1993-10-29
JP2507855B2 (ja) 1996-06-19

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