KR930003797A - 계단형 다층 상호 연결 장치 - Google Patents

계단형 다층 상호 연결 장치 Download PDF

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Publication number
KR930003797A
KR930003797A KR1019920013248A KR920013248A KR930003797A KR 930003797 A KR930003797 A KR 930003797A KR 1019920013248 A KR1019920013248 A KR 1019920013248A KR 920013248 A KR920013248 A KR 920013248A KR 930003797 A KR930003797 A KR 930003797A
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South Korea
Prior art keywords
metallization
substrate
layer
multilayer interconnection
outer layer
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KR1019920013248A
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English (en)
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KR960006982B1 (ko
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스코엔셀러 데이비드
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알.비. 레비
아메리칸 델리폰 앤드 텔레그라프 캄파니
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Publication of KR930003797A publication Critical patent/KR930003797A/ko
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Publication of KR960006982B1 publication Critical patent/KR960006982B1/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0314—Elastomeric connector or conductor, e.g. rubber with metallic filler
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/0919—Exposing inner circuit layers or metal planes at the side edge of the PCB or at the walls of large holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/061—Lamination of previously made multilayered subassemblies
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer

Abstract

내용 없음.

Description

계단형 다층 상호 연결 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따른 계단형 다층 상호 연결 기판의 근시도,
제2도는 제1도의 평면 2-2를 고려한 계단형 다층 상호 연결의 단면도.

Claims (7)

  1. 상부 및 하부 외곽층과 그 사이에 적어도 하나의 중간층을 가지며, 적어도 하나의 외곽층은 복수개의 제1금속화 부품 수용 영역 및 그위에 제1금속좌화링크를 가지며, 각각의 중간층은 적어도 한 층위에 있는 제1링크의 적어도 하나가 배선 통로를 설정하도록 외곽층위 한쌍의 부품 수용 영역간에 적어도 일부분의 전기적 연결을 제공하기 위해서 그 위에 적어도 하나의 제1금속화 링크와 상기 제1링크를 연결하기 위한 적어도 하나의 금속화 바이어를 갖는 다층 상호 연결 주기판에 있어서, 주 기판보다 작은 영역의 적어도 하나의 보조 다층 상호 연결 기판부, 상부 및 하부 외곽층과 그 사이에 적어도 하나의 중간층을 갖는 보조 기판, 제2금속화 부품 수용 영역과 그위에 제2금속화 링크를 갖는 상부 외곽층, 그위에 금속화 연결 영역을 갖는 하부 외곽층 그리고 그위에 적어도 하나의 제2금속화 링크와 상기 보조 기판부의 적어도 한 층위의 적어도 하나의 제2링크가 제2부품 수용 영역과 금속화 연결 영역간에 적어도 일부분의 전기적 연결을 제공하기 위하여 상기 제2링크를 연결하기 위한 적어도 하나의 제2금속화 바이어를 갖는 각각의 중간층, 주 기판과 각 보조 기판부의 하부 외곽층 위의 각각의 금속화 연결 영역을 주 기판의 상부 외곽층상의 개별적인 제1금속화 부품 수용 영역으로 연결시키기 위한 각각의 보조 기판부간의 비등방성 전도 재료층과 서로 지지하도록 각보조 기판부와 주 기판을 통해 각각 걸쳐 있는 복수개의 고정자로서 구성되는 것을 특징으로 하는 계단형 다층 상호 연결장치.
  2. 제1항에 있어서, 상기 주기판은 기판 전체의 어느 곳에서나 소정의 최소수의 배선 통로를 제공하기 위하여 외곽층에 결합하여 단지 필요한 만큼의 중간층을 갖는 것을 특징으로 하는 계단형 다층 상호 연결 장치.
  3. 제1항에 있어서, 각각의 보조 기판부는 주기판에 연결될 때 주기판과 보조 기판의 층을 결합한 수가 소정의 최대 배선 통로수를 제공하기에 충분하도록 충분한 층수를 갖는 것을 특징으로 하는 계단형 다층 상호 연결 장치.
  4. 제1항에 있어서, 주 상호 접속 기판의 각 외곽 및 중간층이 인쇄 배선 보드 재료로 구성된 것을 특징으로 하는 계단형 다층 상호 연결 장치.
  5. 제1항에 있어서, 각각의 보조 상호 접속 기판부의 각 외곽 및 중간층이 인쇄 배선 보드 재료로 구성된 것을 특징으로 하는 계단형 다층 상호 연결 장치.
  6. 제1항에 있어서, 각각의 고정자는 갈라진 핀으로 구성된 것을 특징으로 하는 계단형 다층 상호 연결 장치.
  7. 제1항에 있어서, 각각의 고정자는 열이 스며든 플라스틱 핀을 포함하는 것을 특징으로 하는 계단형 다층 상호 연결 장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019920013248A 1991-07-30 1992-07-24 계단형 다층 상호 연결 장치 KR960006982B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/737,754 US5165984A (en) 1991-07-30 1991-07-30 Stepped multilayer interconnection apparatus and method of making the same
US737,754 1991-07-30

Publications (2)

Publication Number Publication Date
KR930003797A true KR930003797A (ko) 1993-02-24
KR960006982B1 KR960006982B1 (ko) 1996-05-25

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Country Status (7)

Country Link
US (1) US5165984A (ko)
EP (1) EP0526107B1 (ko)
JP (1) JP2559954B2 (ko)
KR (1) KR960006982B1 (ko)
CA (1) CA2073911C (ko)
DE (1) DE69200500T2 (ko)
TW (1) TW303050U (ko)

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KR100329717B1 (ko) * 1998-09-25 2002-08-14 주식회사 문화방송 방송및데이터방송수신모듈내장다기능이동통신단말기

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DE69200500T2 (de) 1995-02-23
CA2073911A1 (en) 1993-01-31
JPH07193096A (ja) 1995-07-28
KR960006982B1 (ko) 1996-05-25
EP0526107B1 (en) 1994-10-05
US5165984A (en) 1992-11-24
CA2073911C (en) 1996-07-02
TW303050U (en) 1997-04-11
EP0526107A1 (en) 1993-02-03
DE69200500D1 (de) 1994-11-10
JP2559954B2 (ja) 1996-12-04

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