DE69200500T2 - Gestufte Mehrlagenverbindungsplatte und Herstellungsmethoden. - Google Patents
Gestufte Mehrlagenverbindungsplatte und Herstellungsmethoden.Info
- Publication number
- DE69200500T2 DE69200500T2 DE69200500T DE69200500T DE69200500T2 DE 69200500 T2 DE69200500 T2 DE 69200500T2 DE 69200500 T DE69200500 T DE 69200500T DE 69200500 T DE69200500 T DE 69200500T DE 69200500 T2 DE69200500 T2 DE 69200500T2
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing methods
- connector plate
- layer connector
- tiered multi
- tiered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0314—Elastomeric connector or conductor, e.g. rubber with metallic filler
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/0919—Exposing inner circuit layers or metal planes at the side edge of the PCB or at the walls of large holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09845—Stepped hole, via, edge, bump or conductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/061—Lamination of previously made multilayered subassemblies
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Metallurgy (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Combinations Of Printed Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/737,754 US5165984A (en) | 1991-07-30 | 1991-07-30 | Stepped multilayer interconnection apparatus and method of making the same |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69200500D1 DE69200500D1 (de) | 1994-11-10 |
DE69200500T2 true DE69200500T2 (de) | 1995-02-23 |
Family
ID=24965179
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69200500T Expired - Fee Related DE69200500T2 (de) | 1991-07-30 | 1992-07-23 | Gestufte Mehrlagenverbindungsplatte und Herstellungsmethoden. |
Country Status (7)
Country | Link |
---|---|
US (1) | US5165984A (de) |
EP (1) | EP0526107B1 (de) |
JP (1) | JP2559954B2 (de) |
KR (1) | KR960006982B1 (de) |
CA (1) | CA2073911C (de) |
DE (1) | DE69200500T2 (de) |
TW (1) | TW303050U (de) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2674078B1 (fr) * | 1991-03-12 | 1994-10-07 | Thomson Trt Defense | Emetteur-recepteur hyperfrequence utilisant la technique des circuits imprimes multicouches. |
JP2966972B2 (ja) * | 1991-07-05 | 1999-10-25 | 株式会社日立製作所 | 半導体チップキャリアとそれを実装したモジュール及びそれを組み込んだ電子機器 |
US5315239A (en) * | 1991-12-16 | 1994-05-24 | Hughes Aircraft Company | Circuit module connections |
US5241454A (en) * | 1992-01-22 | 1993-08-31 | International Business Machines Corporation | Mutlilayered flexible circuit package |
US5384434A (en) * | 1992-03-02 | 1995-01-24 | Murata Manufacturing Co., Ltd. | Multilayer ceramic circuit board |
EP0715489A3 (de) * | 1994-11-30 | 1997-02-19 | Ncr Int Inc | Leiterplattenanordnung |
JP2638569B2 (ja) * | 1995-05-24 | 1997-08-06 | 日本電気株式会社 | 多層プリント基板及び多層プリント基板の形成方法 |
US6147870A (en) * | 1996-01-05 | 2000-11-14 | Honeywell International Inc. | Printed circuit assembly having locally enhanced wiring density |
JPH1093240A (ja) * | 1996-09-10 | 1998-04-10 | Yamaichi Electron Co Ltd | 多層配線板および多層配線板の製造方法 |
US5917709A (en) * | 1997-06-16 | 1999-06-29 | Eastman Kodak Company | Multiple circuit board assembly having an interconnect mechanism that includes a flex connector |
JP3921756B2 (ja) * | 1997-10-06 | 2007-05-30 | 株式会社デンソー | プリント基板およびその製造方法 |
US6281446B1 (en) * | 1998-02-16 | 2001-08-28 | Matsushita Electric Industrial Co., Ltd. | Multi-layered circuit board and method of manufacturing the same |
CN1180667C (zh) * | 1998-07-20 | 2004-12-15 | 三星电子株式会社 | 无线电-电子部件 |
KR100329717B1 (ko) * | 1998-09-25 | 2002-08-14 | 주식회사 문화방송 | 방송및데이터방송수신모듈내장다기능이동통신단말기 |
US6310398B1 (en) | 1998-12-03 | 2001-10-30 | Walter M. Katz | Routable high-density interfaces for integrated circuit devices |
WO2001015228A1 (fr) * | 1999-08-19 | 2001-03-01 | Seiko Epson Corporation | Panneau de cablage, procede de fabrication d'un panneau de cablage, dispositif semiconducteur, procede de fabrication d'un dispositif semiconducteur, carte a circuit imprime et appareil electronique |
JP2003298232A (ja) * | 2002-04-02 | 2003-10-17 | Sony Corp | 多層配線基板の製造方法および多層配線基板 |
US7750446B2 (en) | 2002-04-29 | 2010-07-06 | Interconnect Portfolio Llc | IC package structures having separate circuit interconnection structures and assemblies constructed thereof |
CN1659810B (zh) * | 2002-04-29 | 2012-04-25 | 三星电子株式会社 | 直接连接信号传送系统 |
JP2004031555A (ja) * | 2002-06-25 | 2004-01-29 | Nec Corp | 回路基板装置および基板間の接続方法 |
US6891272B1 (en) | 2002-07-31 | 2005-05-10 | Silicon Pipe, Inc. | Multi-path via interconnection structures and methods for manufacturing the same |
JP3849705B2 (ja) * | 2002-08-07 | 2006-11-22 | 株式会社デンソー | 配線基板および配線基板の接続構造 |
US7014472B2 (en) * | 2003-01-13 | 2006-03-21 | Siliconpipe, Inc. | System for making high-speed connections to board-mounted modules |
US7462783B2 (en) * | 2004-08-02 | 2008-12-09 | Texas Instruments Incorporated | Semiconductor package having a grid array of pin-attached balls |
US7870663B2 (en) * | 2006-02-09 | 2011-01-18 | Hitachi Chemical Company, Ltd. | Method for manufacturing multilayer wiring board |
US7663232B2 (en) * | 2006-03-07 | 2010-02-16 | Micron Technology, Inc. | Elongated fasteners for securing together electronic components and substrates, semiconductor device assemblies including such fasteners, and accompanying systems |
WO2007135879A1 (ja) * | 2006-05-22 | 2007-11-29 | Nec Corporation | 回路基板装置、配線基板間接続方法及び回路基板モジュール装置 |
US9066439B2 (en) * | 2011-07-14 | 2015-06-23 | Ibiden Co., Ltd. | Wiring board and method for manufacturing the same |
KR20160099381A (ko) * | 2015-02-12 | 2016-08-22 | 삼성전기주식회사 | 인쇄회로기판 및 인쇄회로기판의 제조 방법 |
US10584727B2 (en) | 2016-11-03 | 2020-03-10 | Ford Global Technologies, Llc | Multi-material restrainer joint |
CN112911793A (zh) * | 2021-01-15 | 2021-06-04 | 浪潮电子信息产业股份有限公司 | 一种服务器组件pcb及其多层连接孔导通机构 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3142610A (en) * | 1960-04-13 | 1964-07-28 | Wright Barry Corp | Self-damped composite structures |
US4211603A (en) * | 1978-05-01 | 1980-07-08 | Tektronix, Inc. | Multilayer circuit board construction and method |
DE2840890A1 (de) * | 1978-09-20 | 1980-04-03 | Licentia Gmbh | Mehrlagenverbindungsplatte mit mindestens einer loecher aufweisenden metallplatte und mit mindestens einer durchplattierte loecher ausweisenden gedruckten leiterplatte |
JPS613497A (ja) * | 1984-06-15 | 1986-01-09 | 富士通株式会社 | 異種複合プリント板の電気接続構造 |
US4880684A (en) * | 1988-03-11 | 1989-11-14 | International Business Machines Corporation | Sealing and stress relief layers and use thereof |
JP2551224B2 (ja) * | 1990-10-17 | 1996-11-06 | 日本電気株式会社 | 多層配線基板および多層配線基板の製造方法 |
-
1991
- 1991-07-30 US US07/737,754 patent/US5165984A/en not_active Expired - Lifetime
-
1992
- 1992-07-15 CA CA002073911A patent/CA2073911C/en not_active Expired - Fee Related
- 1992-07-23 EP EP92306746A patent/EP0526107B1/de not_active Expired - Lifetime
- 1992-07-23 DE DE69200500T patent/DE69200500T2/de not_active Expired - Fee Related
- 1992-07-24 KR KR1019920013248A patent/KR960006982B1/ko not_active IP Right Cessation
- 1992-07-29 JP JP4220957A patent/JP2559954B2/ja not_active Expired - Fee Related
-
1993
- 1993-07-27 TW TW085206681U patent/TW303050U/zh unknown
Also Published As
Publication number | Publication date |
---|---|
EP0526107A1 (de) | 1993-02-03 |
KR960006982B1 (ko) | 1996-05-25 |
DE69200500D1 (de) | 1994-11-10 |
EP0526107B1 (de) | 1994-10-05 |
JP2559954B2 (ja) | 1996-12-04 |
TW303050U (en) | 1997-04-11 |
JPH07193096A (ja) | 1995-07-28 |
US5165984A (en) | 1992-11-24 |
CA2073911A1 (en) | 1993-01-31 |
CA2073911C (en) | 1996-07-02 |
KR930003797A (ko) | 1993-02-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8328 | Change in the person/name/address of the agent |
Free format text: BLUMBACH, KRAMER & PARTNER, 65193 WIESBADEN |
|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |