KR910010723A - 소메모리셀 면적에서 고안정성을 갖는 반도체기억장치 - Google Patents
소메모리셀 면적에서 고안정성을 갖는 반도체기억장치 Download PDFInfo
- Publication number
- KR910010723A KR910010723A KR1019900017414A KR900017414A KR910010723A KR 910010723 A KR910010723 A KR 910010723A KR 1019900017414 A KR1019900017414 A KR 1019900017414A KR 900017414 A KR900017414 A KR 900017414A KR 910010723 A KR910010723 A KR 910010723A
- Authority
- KR
- South Korea
- Prior art keywords
- memory device
- semiconductor memory
- mosfets
- memory cell
- deff
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims 8
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims 2
- 229920005591 polysilicon Polymers 0.000 claims 2
- 230000003068 static effect Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B10/00—Static random access memory [SRAM] devices
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/41—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming static cells with positive feedback, i.e. cells not needing refreshing or charge regeneration, e.g. bistable multivibrator or Schmitt trigger
- G11C11/412—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming static cells with positive feedback, i.e. cells not needing refreshing or charge regeneration, e.g. bistable multivibrator or Schmitt trigger using field-effect transistors only
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/41—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming static cells with positive feedback, i.e. cells not needing refreshing or charge regeneration, e.g. bistable multivibrator or Schmitt trigger
- G11C11/413—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing, timing or power reduction
- G11C11/417—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing, timing or power reduction for memory cells of the field-effect type
- G11C11/419—Read-write [R-W] circuits
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B10/00—Static random access memory [SRAM] devices
- H10B10/12—Static random access memory [SRAM] devices comprising a MOSFET load element
- H10B10/125—Static random access memory [SRAM] devices comprising a MOSFET load element the MOSFET being a thin film transistor [TFT]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Semiconductor Memories (AREA)
- Static Random-Access Memory (AREA)
- Thin Film Transistor (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도 (a)는 본 발명의 실시예의 회로도.
제1도 (b)는 본 발명의 실시예의 단면도.
Claims (4)
- 제1도전형의 2개의 구동 MOSFET와 2개의 전송 MOSFET로 구성된 스테이틱형 메모리셀이 반도체 기판에 형성된 반도체 기억장치에 있어서, 상기 메모리셀의 농동부하로서 제2도전형의 2개의 FET가 상기 4개의 MOSFET의 상부에 형성되고, 상기 2개의 구동 MOSFET의 채널 길이LDEFF, 채널폭 WDEFF및 상기 2개의 전송 MOSFET의 채널 길이 LTEFF, 채널 폭 WTEFF에 관하여(WDEFF/LDEFF)/(WTEFF/)LTEFF)〈3로 되는 조건이 설정되고, 상기 능동부와 FET의 전류가 1×10-8A이상으로 설정되어 있는 반도체 기억장치.
- 특허청구의 범위 제1항에 있어서, 상기 능동부하 FET는 폴리실리콘 TFT인 반도체 기억장치.
- 특허청구의 범위 제2항에 있어서, 상기 전송 MOSFET를 도통 상태로 하는 워드선의 전압 펄스의 폭 tWD,반도체 기억장치의최소사이클 시간 tcycle에 관하여 tWD〈tcycle는 조건을 설정하는 것에 의해 상기 전송 MOSFET가 비도통 상태로 되는 시간을 마련하고, 상기 비도통 상태로 되는 시간에 상기 폴리실리콘 TFT의 상기 전류에 의해서 상기 메모리셀내의 한쪽의 접속점의 충전을 실행하는 반도체 기억장치.
- 특허청구의 범위 제2항에 있어서, 상기 전송 MOSFET의 채널 방향과 상기 구동 MOSFET의 채널 방향이 병행인 반도체 기억장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28298489 | 1989-11-01 | ||
JP1-282984 | 1989-11-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR910010723A true KR910010723A (ko) | 1991-06-29 |
KR0184281B1 KR0184281B1 (ko) | 1999-03-20 |
Family
ID=17659695
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019900017414A KR0184281B1 (ko) | 1989-11-01 | 1990-10-30 | 소메모리 면적에서 고안정성을 갖는 반도체기억장치 |
Country Status (3)
Country | Link |
---|---|
US (1) | US5134581A (ko) |
JP (1) | JPH03218667A (ko) |
KR (1) | KR0184281B1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100724604B1 (ko) * | 1999-02-10 | 2007-06-04 | 소니 가부시끼 가이샤 | 반도체 기억 장치 |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5278790A (en) * | 1989-05-15 | 1994-01-11 | Casio Computer Co., Ltd. | Memory device comprising thin film memory transistors |
US5350933A (en) * | 1990-02-21 | 1994-09-27 | Sony Corporation | Semiconductor CMOS static RAM with overlapping thin film transistors |
JPH0732200B2 (ja) * | 1990-11-15 | 1995-04-10 | 株式会社東芝 | スタティック型メモリセル |
GB2254487B (en) * | 1991-03-23 | 1995-06-21 | Sony Corp | Full CMOS type static random access memories |
JPH04334054A (ja) * | 1991-05-09 | 1992-11-20 | Mitsubishi Electric Corp | 半導体装置、電界効果トランジスタおよびその製造方法 |
US5307142A (en) * | 1991-11-15 | 1994-04-26 | The United States Of America As Represented By The United States Department Of Energy | High performance static latches with complete single event upset immunity |
US5264385A (en) * | 1991-12-09 | 1993-11-23 | Texas Instruments Incorporated | SRAM design with no moat-to-moat spacing |
US5404326A (en) * | 1992-06-30 | 1995-04-04 | Sony Corporation | Static random access memory cell structure having a thin film transistor load |
EP0585059B1 (en) * | 1992-08-21 | 1999-05-12 | STMicroelectronics, Inc. | Vertical memory cell processing and structure manufactured by that processing |
JPH06169071A (ja) * | 1992-11-30 | 1994-06-14 | Fujitsu Ltd | 半導体記憶装置 |
JP2518133B2 (ja) * | 1993-02-12 | 1996-07-24 | 日本電気株式会社 | スタティック型半導体記憶装置 |
US5363328A (en) * | 1993-06-01 | 1994-11-08 | Motorola Inc. | Highly stable asymmetric SRAM cell |
US6072715A (en) * | 1994-07-22 | 2000-06-06 | Texas Instruments Incorporated | Memory circuit and method of construction |
JPH0869693A (ja) * | 1994-08-30 | 1996-03-12 | Mitsubishi Electric Corp | スタティック型半導体記憶装置 |
US6028340A (en) | 1995-07-10 | 2000-02-22 | Lg Semicon Co., Ltd. | Static random access memory cell having a field region |
US5804477A (en) * | 1997-02-24 | 1998-09-08 | Integrated Device Technology, Inc. | Method of making a 6-transistor compact static ram cell |
US6519176B1 (en) * | 2000-09-29 | 2003-02-11 | Intel Corporation | Dual threshold SRAM cell for single-ended sensing |
US6509216B2 (en) * | 2001-03-07 | 2003-01-21 | United Microelectronics Corp. | Memory structure with thin film transistor and method for fabricating the same |
JP4524735B2 (ja) * | 2003-06-20 | 2010-08-18 | ルネサスエレクトロニクス株式会社 | 半導体記憶装置 |
US7436696B2 (en) * | 2006-04-28 | 2008-10-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Read-preferred SRAM cell design |
JP2009048772A (ja) * | 2008-12-05 | 2009-03-05 | Renesas Technology Corp | 半導体記憶装置 |
US20160276156A1 (en) * | 2015-03-16 | 2016-09-22 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor device and manufacturing process thereof |
US20200098934A1 (en) * | 2018-09-25 | 2020-03-26 | Shriram Shivaraman | Spacer and channel layer of thin-film transistors |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4623989A (en) * | 1983-08-31 | 1986-11-18 | Texas Instruments Incorporated | Memory with p-channel cell access transistors |
JPH0770222B2 (ja) * | 1984-06-04 | 1995-07-31 | 株式会社日立製作所 | Mosスタテイツク型ram |
-
1990
- 1990-10-26 JP JP2287059A patent/JPH03218667A/ja active Pending
- 1990-10-29 US US07/604,469 patent/US5134581A/en not_active Expired - Lifetime
- 1990-10-30 KR KR1019900017414A patent/KR0184281B1/ko not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100724604B1 (ko) * | 1999-02-10 | 2007-06-04 | 소니 가부시끼 가이샤 | 반도체 기억 장치 |
Also Published As
Publication number | Publication date |
---|---|
KR0184281B1 (ko) | 1999-03-20 |
JPH03218667A (ja) | 1991-09-26 |
US5134581A (en) | 1992-07-28 |
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