KR910008819A - 반도체웨이퍼 지지캐리어 - Google Patents

반도체웨이퍼 지지캐리어 Download PDF

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Publication number
KR910008819A
KR910008819A KR1019900015932A KR900015932A KR910008819A KR 910008819 A KR910008819 A KR 910008819A KR 1019900015932 A KR1019900015932 A KR 1019900015932A KR 900015932 A KR900015932 A KR 900015932A KR 910008819 A KR910008819 A KR 910008819A
Authority
KR
South Korea
Prior art keywords
semiconductor wafer
semiconductor
semiconductor wafers
support carrier
liquid phase
Prior art date
Application number
KR1019900015932A
Other languages
English (en)
Inventor
마사코 고데라
Original Assignee
아오이 죠이치
가부시키가이샤 도시바
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아오이 죠이치, 가부시키가이샤 도시바 filed Critical 아오이 죠이치
Publication of KR910008819A publication Critical patent/KR910008819A/ko
Priority to KR2019940015682U priority Critical patent/KR950010445Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67313—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
  • Weting (AREA)

Abstract

내용 없음

Description

반도체웨이퍼 지지캐리어
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 제1실시예를 나타낸 측면도.
제2도는 그 변형례를 나타낸 측면도.

Claims (2)

  1. 복수의 반도체웨이퍼(4,4',4")를 세운 상태에서 전후방향으로 서정간격 이간시켜거 배열하여 지지하고, 그 반도체웨이퍼와 더불어 액상중에 담그어서 반도체웨이퍼를 액상처리하도록 한 반도체웨이퍼 지지캐리어에 있어서, 상기 반도체웨이퍼의 표면측에 그 반도체웨이퍼의 상단으로부터 윗쪽으로 돌출시켜서 액상으로부터 끌어올릴 때에 반도체웨이퍼보다도 앞서서 액면으로부터 나오도록 한 방진판(13,19)을 배치한 것을 특징으로 하는 반도체웨이퍼 지지캐리어.
  2. 제1항에 있어서, 상기 액상처리가 과포화용액으로부터의 석출반응에 의해 반도체웨이퍼의 표면에 실리콘산화막을 형성하는 처리(LPD법)인 것을 특징으로 하는 반도체웨이퍼 지지캐리어.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019900015932A 1989-10-09 1990-10-08 반도체웨이퍼 지지캐리어 KR910008819A (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019940015682U KR950010445Y1 (ko) 1989-10-09 1994-06-29 반도체웨이퍼 지지캐리어

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1263440A JPH06103720B2 (ja) 1989-10-09 1989-10-09 半導体ウェハ支持キャリア
JP1-263440 1989-10-09

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR2019940015682U Division KR950010445Y1 (ko) 1989-10-09 1994-06-29 반도체웨이퍼 지지캐리어

Publications (1)

Publication Number Publication Date
KR910008819A true KR910008819A (ko) 1991-05-31

Family

ID=17389536

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900015932A KR910008819A (ko) 1989-10-09 1990-10-08 반도체웨이퍼 지지캐리어

Country Status (3)

Country Link
US (1) US5131546A (ko)
JP (1) JPH06103720B2 (ko)
KR (1) KR910008819A (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05102056A (ja) * 1991-10-11 1993-04-23 Rohm Co Ltd ウエハー支持具
US6090726A (en) * 1996-07-05 2000-07-18 National Science Council Pretreatment method of a silicon wafer using nitric acid
US5759273A (en) * 1996-07-16 1998-06-02 Micron Technology, Inc. Cross-section sample staining tool
US6520191B1 (en) 1998-10-19 2003-02-18 Memc Electronic Materials, Inc. Carrier for cleaning silicon wafers
DE60226512D1 (de) * 2002-11-26 2008-06-19 Disco Corp Kassette zum speichern mehrerer halbleiterwaferlagen
KR100655431B1 (ko) * 2005-03-23 2006-12-11 삼성전자주식회사 웨이퍼와의 접촉 면적을 최소화할 수 있는 웨이퍼 캐리어 및 이를 이용한 웨이퍼 세정방법
KR100746645B1 (ko) * 2006-02-06 2007-08-06 삼성전자주식회사 지지 부재, 이를 포함하는 기판 세정 장치, 그리고 기판세정 방법.

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3534862A (en) * 1968-09-13 1970-10-20 Rca Corp Semiconductor wafer transporting jig
US3926305A (en) * 1973-07-12 1975-12-16 Fluoroware Inc Wafer basket
US4088254A (en) * 1976-12-08 1978-05-09 Hooper Joel Ray Magnetic holding apparatus and methods of constructing and utilizing same
DE3440111C1 (de) * 1984-11-02 1986-05-15 Heraeus Quarzschmelze Gmbh, 6450 Hanau Traegerhorde
US4669612A (en) * 1985-02-20 1987-06-02 Empak Inc. Disk processing cassette
US4841906A (en) * 1986-11-12 1989-06-27 Heraeus Amersil, Inc. Mass transferable semiconductor substrate processing and handling full shell carrier (boat)
US4949848A (en) * 1988-04-29 1990-08-21 Fluoroware, Inc. Wafer carrier
JPH0278246A (ja) * 1988-09-14 1990-03-19 Kakizaki Seisakusho:Kk 薄板処理用バスケット
JPH02113331U (ko) * 1989-02-27 1990-09-11

Also Published As

Publication number Publication date
JPH03125457A (ja) 1991-05-28
JPH06103720B2 (ja) 1994-12-14
US5131546A (en) 1992-07-21

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A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application
WICV Withdrawal of application forming a basis of a converted application