KR910002968A - 폴리이미드필름 및 그 제조 방법 - Google Patents

폴리이미드필름 및 그 제조 방법 Download PDF

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Publication number
KR910002968A
KR910002968A KR1019900010766A KR900010766A KR910002968A KR 910002968 A KR910002968 A KR 910002968A KR 1019900010766 A KR1019900010766 A KR 1019900010766A KR 900010766 A KR900010766 A KR 900010766A KR 910002968 A KR910002968 A KR 910002968A
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South Korea
Prior art keywords
film
stretched
polyimide
polyimide film
temperature
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KR1019900010766A
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English (en)
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KR930002990B1 (ko
Inventor
마스미 사루와다리
야스히고 오오다
야스히로 후지이
야스고 혼지
쇼오이찌 쯔지
서노브 모리야
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사와무라 하루오
미쯔이도오아쯔가가꾸 가부시기가이샤
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Publication of KR910002968A publication Critical patent/KR910002968A/ko
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Publication of KR930002990B1 publication Critical patent/KR930002990B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C55/00—Shaping by stretching, e.g. drawing through a die; Apparatus therefor
    • B29C55/005—Shaping by stretching, e.g. drawing through a die; Apparatus therefor characterised by the choice of materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C67/00—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
    • B29C67/24—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00 characterised by the choice of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2079/00—Use of polymers having nitrogen, with or without oxygen or carbon only, in the main chain, not provided for in groups B29K2061/00 - B29K2077/00, as moulding material
    • B29K2079/08—PI, i.e. polyimides or derivatives thereof
    • B29K2079/085—Thermoplastic polyimides, e.g. polyesterimides, PEI, i.e. polyetherimides, or polyamideimides; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Shaping By String And By Release Of Stress In Plastics And The Like (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)

Abstract

내용 없음.

Description

폴리이미드필름 및 그 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (9)

  1. 식(Ⅰ)로 표시되는 반복구조 단위를 가진 폴리이미드로 이루어진 연신필름으로서, 23℃에 있어서의 두께방향의 굴절율이 1.605~1.680인 폴리이미드 필름.
  2. 식(Ⅰ)로 표시되는 반복구조단위를 폴리이미드로 이루어진 연신필름으로서, 23℃에 있어서의 밀도가 1.335~1.390g/㎠인 폴리이미드 필름.
  3. 식(Ⅰ)로 표시되는 반복구조단위를 가진 폴리이미드로 이루어진 연신필름으로서, 23℃에 있어서의 밀도가 1.335~1.390g/㎠인 또한 두께방향의 굴절율이 1.605~1.680인 폴리이미드 필름.
  4. 식(Ⅰ)로 표시되는 반복구조단위를 가진 폴리이미드를 사용해서 필름을 제조할 때, 미연신필름을 가열연신하고, 이어서 긴장하에 열고정하는 것을 특징으로 하는 폴리이미드 필름의 제조방법.
  5. 제4항에 있어서, 미연신필름을 230~320℃의 온도에서 한방향 또는 직각을 이루는 두방향으로 1.5~10배 연신하고, 이어서 긴장하에 250℃이상, 이필름의 융점미만의 온도에서 열고정하는 것을 특징으로 하는 폴리이미드 필름의 제조방법.
  6. 제4항 또는 제5항에 있어서, 미연신필름을 230~300℃의 온도에서 한방향으로 1.5~5.0배 연신하는 것을 특징으로 하는 폴리이미드 필름의 제조방법.
  7. 제4항 또는 제5항에 있어서, 미연신 필름을 240~300℃ 온도에서 한방향으로 1.5~3.0배 연신하고, 이어서 이 연신방향과 직각방향을 250~320℃의 범위에서 1.5~3.0배 연신하는 것을 특징으로 하는 폴리이미드 필름의 제조방법.
  8. 제4항 또는 제5항에 있어서, 미연신필름을 250~300℃의 온도에서 서로 직각을 이루는 두방향으로 동시에 연신하여 면적배율을 2~10배로 하는 것을 특징으로 하는 폴리이미드 필름의 제조방법.
  9. 제4항에 있어서, 미연신필름을 연신할 때, 미연신필름을 150℃이상, 이 필름의 유리전이 온도 미만의 온도에서, 연신중의 수분이 0.1~3%의 범위에서 연신하는 것을 특징으로 하는 폴리이미드 필름의 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019900010766A 1989-07-17 1990-07-16 폴리이미드필름 및 그 제조방법 KR930002990B1 (ko)

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
JP1-182463 1989-07-17
JP1-182464 1989-07-17
JP18246389 1989-07-17
JP1-182462 1989-07-17
JP18246289 1989-07-17
JP18246489 1989-07-17
JP25076689 1989-09-28
JP1-250766 1989-09-28
JP1-271503 1989-10-20
JP27150389 1989-10-20

Publications (2)

Publication Number Publication Date
KR910002968A true KR910002968A (ko) 1991-02-26
KR930002990B1 KR930002990B1 (ko) 1993-04-16

Family

ID=27528829

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900010766A KR930002990B1 (ko) 1989-07-17 1990-07-16 폴리이미드필름 및 그 제조방법

Country Status (6)

Country Link
US (1) US5260407A (ko)
EP (1) EP0409466B1 (ko)
JP (1) JPH0778136B2 (ko)
KR (1) KR930002990B1 (ko)
CA (1) CA2021293A1 (ko)
DE (1) DE69018717T2 (ko)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5288843A (en) * 1987-05-20 1994-02-22 Mitsui Toatsu Chemicals, Inc. Polyimides, process for the preparation thereof and polyimide resin compositions
US5237044A (en) * 1988-10-20 1993-08-17 Mitsui Toatsu Chemicals, Inc. Polyimide sheet and preparation process of the sheet
JPH03103444A (ja) * 1989-09-16 1991-04-30 Mitsui Toatsu Chem Inc ポリイミド成形体の製造方法
CA2406723C (en) * 2000-04-20 2008-12-30 Teijin Limited Polyimide film and production process thereof
JP5119401B2 (ja) * 2007-02-01 2013-01-16 倉敷紡績株式会社 熱可塑性ポリイミド層を有するフレキシブル積層板及びその製造方法
WO2007116685A1 (ja) * 2006-03-31 2007-10-18 Kurashiki Boseki Kabushiki Kaisha 熱可塑性ポリイミド層を有するフレキシブル積層板及びその製造方法
US8568867B2 (en) * 2006-06-26 2013-10-29 Sabic Innovative Plastics Ip B.V. Polyimide solvent cast films having a low coefficient of thermal expansion and method of manufacture thereof
US8545975B2 (en) * 2006-06-26 2013-10-01 Sabic Innovative Plastics Ip B.V. Articles comprising a polyimide solvent cast film having a low coefficient of thermal expansion and method of manufacture thereof
US7928154B2 (en) 2006-06-26 2011-04-19 Sabic Innovative Plastics Ip B.V. Methods of preparing polymer-organoclay composites and articles derived therefrom
US9161440B2 (en) * 2006-06-26 2015-10-13 Sabic Global Technologies B.V. Articles comprising a polyimide solvent cast film having a low coefficient of thermal expansion and method of manufacture thereof
US20080118730A1 (en) * 2006-11-22 2008-05-22 Ta-Hua Yu Biaxially oriented film, laminates made therefrom, and method
US20080119616A1 (en) * 2006-11-22 2008-05-22 General Electric Company Polyimide resin compositions
US8399573B2 (en) * 2006-11-22 2013-03-19 Sabic Innovative Plastics Ip B.V. Polymer blend compositions
WO2012155083A1 (en) * 2011-05-12 2012-11-15 Sabic Innovative Plastics Ip B.V. Amorphous polyetherimide films for capacitors, methods of manufacture, and articles manufactured therefrom
CN103562263B (zh) 2011-05-12 2015-05-27 沙特基础全球技术有限公司 用于电容器的无定形聚碳酸酯膜、制备方法、以及由其制造的制品
US10077345B2 (en) 2013-05-31 2018-09-18 Sabic Global Technologies B.V. Capacitor films, methods of manufacture, and articles manufactured therefrom
US9659711B2 (en) 2013-05-31 2017-05-23 Sabic Global Technologies B.V. Capacitor films, methods of manufacture, and articles manufactured therefrom
US9567445B2 (en) 2013-08-28 2017-02-14 Sabic Global Technologies B.V. Polycarbonate films for capacitors, methods of manufacture, and articles manufactured therefrom
US20160221275A1 (en) * 2015-01-29 2016-08-04 Rohr, Inc. Method of manufacturing a polyimide film
KR101898455B1 (ko) * 2016-03-31 2018-09-13 가부시키가이샤 아이.에스.티 폴리이미드 섬유 및 폴리이미드 섬유의 제조 방법
KR102452649B1 (ko) * 2016-10-21 2022-10-07 삼성전자주식회사 적층 투명 필름, 표시 장치용 윈도우 및 표시 장치
JP6966642B2 (ja) * 2017-12-04 2021-11-17 コーロン インダストリーズ インク ポリイミド系フィルムの製造方法
JP7334446B2 (ja) * 2019-04-01 2023-08-29 大日本印刷株式会社 フィルム、ポリイミドフィルム、積層体、ディスプレイ用部材、タッチパネル部材、液晶表示装置、及び有機エレクトロルミネッセンス表示装置
KR20210001810A (ko) * 2019-06-28 2021-01-06 에스케이씨 주식회사 폴리이미드계 필름 및 이의 제조 방법
KR20230093871A (ko) * 2021-12-20 2023-06-27 에스케이마이크로웍스 주식회사 필름, 다층전자장비 및 필름의 제조방법

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3619461A (en) * 1969-03-25 1971-11-09 Du Pont Stretching process for polyimide film
JPS56118421A (en) * 1980-02-25 1981-09-17 Nitto Electric Ind Co Ltd Heat-shrinkable polyimide film and production thereof
EP0235294B1 (en) * 1985-08-27 1997-11-12 MITSUI TOATSU CHEMICALS, Inc. Polyimides and heat-resistant adhesives comprising the same
EP0234882B1 (en) * 1986-02-25 1993-01-13 MITSUI TOATSU CHEMICALS, Inc. High-temperature adhesive of polyimide
JPS62201524A (ja) * 1986-02-28 1987-09-05 井関農機株式会社 播種機
JPH0655432B2 (ja) * 1986-03-14 1994-07-27 宇部興産株式会社 高物性ポリイミド延伸成形体およびその製法
JPH083041B2 (ja) * 1986-06-30 1996-01-17 三井東圧化学株式会社 ポリイミド樹脂組成物
JP2585552B2 (ja) * 1986-11-19 1997-02-26 三井東圧化学株式会社 ポリイミド
JPS63242625A (ja) * 1987-03-31 1988-10-07 Hitachi Chem Co Ltd 高延伸ポリイミドフイルムの製法
DE3888869T2 (de) * 1987-06-01 1994-09-22 Mitsui Toatsu Chemicals Polyimidharz-Zusammensetzung.
AT387783B (de) * 1987-06-09 1989-03-10 Chemiefaser Lenzing Ag Verfahren zur herstellung von hochtemperaturbestaendigen folien
JPH01198638A (ja) * 1987-08-21 1989-08-10 Ube Ind Ltd ポリイミドフィルムの製造法
US4966680A (en) * 1988-05-31 1990-10-30 Mobil Oil Corporation Integrated catalytic cracking process with light olefin upgrading

Also Published As

Publication number Publication date
JPH0778136B2 (ja) 1995-08-23
EP0409466A2 (en) 1991-01-23
CA2021293A1 (en) 1991-01-18
DE69018717D1 (de) 1995-05-24
JPH03205432A (ja) 1991-09-06
EP0409466B1 (en) 1995-04-19
US5260407A (en) 1993-11-09
KR930002990B1 (ko) 1993-04-16
DE69018717T2 (de) 1995-08-17
EP0409466A3 (en) 1991-10-02

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