KR910002826B1 - 웨이퍼 접착용 시이트 - Google Patents

웨이퍼 접착용 시이트 Download PDF

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Publication number
KR910002826B1
KR910002826B1 KR1019870007148A KR870007148A KR910002826B1 KR 910002826 B1 KR910002826 B1 KR 910002826B1 KR 1019870007148 A KR1019870007148 A KR 1019870007148A KR 870007148 A KR870007148 A KR 870007148A KR 910002826 B1 KR910002826 B1 KR 910002826B1
Authority
KR
South Korea
Prior art keywords
adhesive
adhesive sheet
meth
water
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
KR1019870007148A
Other languages
English (en)
Korean (ko)
Other versions
KR880002261A (ko
Inventor
가즈요시 에베
히로아끼 나리따
가쯔히사 다구찌
요시다까 아께다
다까노리 사이또
Original Assignee
린테크 가부시끼가이샤
쇼오지 고오메이
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 린테크 가부시끼가이샤, 쇼오지 고오메이 filed Critical 린테크 가부시끼가이샤
Publication of KR880002261A publication Critical patent/KR880002261A/ko
Application granted granted Critical
Publication of KR910002826B1 publication Critical patent/KR910002826B1/ko
Expired legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1019870007148A 1986-07-09 1987-07-04 웨이퍼 접착용 시이트 Expired KR910002826B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP161682 1986-07-09
JP61-161682 1986-07-09
JP16168286 1986-07-09
JP62-43744 1987-02-26
JP62043744A JPS63153814A (ja) 1986-07-09 1987-02-26 ウエハ貼着用粘着シ−ト
JP43744 1990-02-23

Publications (2)

Publication Number Publication Date
KR880002261A KR880002261A (ko) 1988-04-30
KR910002826B1 true KR910002826B1 (ko) 1991-05-06

Family

ID=15739841

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019870007148A Expired KR910002826B1 (ko) 1986-07-09 1987-07-04 웨이퍼 접착용 시이트

Country Status (3)

Country Link
JP (1) JPS63153814A (https=)
KR (1) KR910002826B1 (https=)
MY (2) MY102454A (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3177149B2 (ja) * 1996-03-15 2001-06-18 リンテック株式会社 粘着テープ用基材、該基材を用いた粘着テープ、および該基材の製造方法
JPH10337823A (ja) * 1997-04-11 1998-12-22 Lintec Corp 基材および該基材を用いた粘着テープ
JP3809733B2 (ja) 1998-02-25 2006-08-16 セイコーエプソン株式会社 薄膜トランジスタの剥離方法
US6235387B1 (en) 1998-03-30 2001-05-22 3M Innovative Properties Company Semiconductor wafer processing tapes
AU2003299296A1 (en) 2002-11-29 2004-06-23 Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. Method and device for machining a wafer, in addition to a wafer comprising a separation layer and a support layer
JP4574234B2 (ja) 2004-06-02 2010-11-04 リンテック株式会社 半導体加工用粘着シートおよび半導体チップの製造方法
JP5665020B2 (ja) * 2009-12-22 2015-02-04 国立大学法人九州工業大学 配線用電子部品の製造方法
JP5762781B2 (ja) 2011-03-22 2015-08-12 リンテック株式会社 基材フィルムおよび該基材フィルムを備えた粘着シート
JP5282113B2 (ja) 2011-03-22 2013-09-04 リンテック株式会社 基材フィルムおよび該基材フィルムを備えた粘着シート
US10224230B2 (en) 2014-10-23 2019-03-05 Lintec Corporation Surface protective sheet
JP6647267B2 (ja) * 2017-11-09 2020-02-14 古河電気工業株式会社 半導体チップの製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2319973B2 (de) * 1972-04-26 1981-06-04 Celanese Corp., 10036 New York, N.Y. Verfahren zur Stabilisierung von Oxymethylencopolymer
JPS6031351B2 (ja) * 1979-11-13 1985-07-22 日本合成化学工業株式会社 水溶性感圧接着剤
JPS59157162A (ja) * 1983-02-26 1984-09-06 Dainippon Printing Co Ltd 水による剥離の容易な粘着剤組成物
JPS6143677A (ja) * 1984-08-07 1986-03-03 Mitsui Toatsu Chem Inc Ｉｃプロセス用フイルム

Also Published As

Publication number Publication date
KR880002261A (ko) 1988-04-30
MY109333A (en) 1997-01-31
MY102454A (en) 1992-06-30
JPH0577284B2 (https=) 1993-10-26
JPS63153814A (ja) 1988-06-27

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