KR900005846B1 - 고속도금방법 - Google Patents
고속도금방법 Download PDFInfo
- Publication number
- KR900005846B1 KR900005846B1 KR1019870001314A KR870001314A KR900005846B1 KR 900005846 B1 KR900005846 B1 KR 900005846B1 KR 1019870001314 A KR1019870001314 A KR 1019870001314A KR 870001314 A KR870001314 A KR 870001314A KR 900005846 B1 KR900005846 B1 KR 900005846B1
- Authority
- KR
- South Korea
- Prior art keywords
- plating
- bath
- speed
- plated
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
- H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/04—Electroplating with moving electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing of the conductive pattern
- H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0292—Using vibration, e.g. during soldering or screen printing
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34971 | 1986-02-21 | ||
| JP61-34971 | 1986-02-21 | ||
| JP61034971A JPS62196398A (ja) | 1986-02-21 | 1986-02-21 | スルーホールプリント基板の高速鍍金方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR870008057A KR870008057A (ko) | 1987-09-24 |
| KR900005846B1 true KR900005846B1 (ko) | 1990-08-13 |
Family
ID=12429024
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019870001314A Expired KR900005846B1 (ko) | 1986-02-21 | 1987-02-18 | 고속도금방법 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US4726884A (https=) |
| JP (1) | JPS62196398A (https=) |
| KR (1) | KR900005846B1 (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01316498A (ja) * | 1988-06-15 | 1989-12-21 | Nec Corp | プリント基板のめっき治具 |
| DE3905100A1 (de) * | 1989-02-20 | 1990-08-23 | Hans Henig | Verfahren und vorrichtung zum elektrolytaustausch vornehmlich in engen vertiefungen grossflaechiger werkstuecke |
| CH683007A5 (de) * | 1990-08-17 | 1993-12-31 | Hans Henig | Verfahren zum kontinuierlichen Austausch der wässrigen Lösungen während einer Oberflächenbehandlung sowie eine Vorrichtung dazu. |
| DE4133561C2 (de) * | 1991-10-10 | 1994-02-03 | Reinhard Kissler Gmbh | Verfahren und Vorrichtung zum Galvanisieren von Waren |
| US6001235A (en) * | 1997-06-23 | 1999-12-14 | International Business Machines Corporation | Rotary plater with radially distributed plating solution |
| DE10061226A1 (de) * | 2000-12-08 | 2002-06-20 | Emil Hepting | Verfahren und Vorrichtung zur Behandlung von Waren in einem Tauchbad |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS501349A (https=) * | 1973-05-14 | 1975-01-08 | ||
| JPS563690A (en) * | 1979-06-20 | 1981-01-14 | Ibiden Co Ltd | High speed through-hole plating method |
-
1986
- 1986-02-21 JP JP61034971A patent/JPS62196398A/ja active Granted
-
1987
- 1987-02-18 KR KR1019870001314A patent/KR900005846B1/ko not_active Expired
- 1987-02-24 US US07/017,947 patent/US4726884A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| KR870008057A (ko) | 1987-09-24 |
| JPS62196398A (ja) | 1987-08-29 |
| JPH0248640B2 (https=) | 1990-10-25 |
| US4726884A (en) | 1988-02-23 |
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| KR890002623B1 (en) | Method for electroplating non-metallic surfaces | |
| KR900005846B1 (ko) | 고속도금방법 | |
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