JPS648077B2 - - Google Patents

Info

Publication number
JPS648077B2
JPS648077B2 JP13447083A JP13447083A JPS648077B2 JP S648077 B2 JPS648077 B2 JP S648077B2 JP 13447083 A JP13447083 A JP 13447083A JP 13447083 A JP13447083 A JP 13447083A JP S648077 B2 JPS648077 B2 JP S648077B2
Authority
JP
Japan
Prior art keywords
cathode
anode
electroplating
plating
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP13447083A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6026692A (ja
Inventor
Kyoshi Hasegawa
Toshiro Okamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP13447083A priority Critical patent/JPS6026692A/ja
Publication of JPS6026692A publication Critical patent/JPS6026692A/ja
Publication of JPS648077B2 publication Critical patent/JPS648077B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Electroplating Methods And Accessories (AREA)
JP13447083A 1983-07-25 1983-07-25 電気めつき方法 Granted JPS6026692A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13447083A JPS6026692A (ja) 1983-07-25 1983-07-25 電気めつき方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13447083A JPS6026692A (ja) 1983-07-25 1983-07-25 電気めつき方法

Publications (2)

Publication Number Publication Date
JPS6026692A JPS6026692A (ja) 1985-02-09
JPS648077B2 true JPS648077B2 (https=) 1989-02-13

Family

ID=15129070

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13447083A Granted JPS6026692A (ja) 1983-07-25 1983-07-25 電気めつき方法

Country Status (1)

Country Link
JP (1) JPS6026692A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9657406B2 (en) 2011-06-30 2017-05-23 C. Uyemura & Co., Ltd. Surface treating apparatus and plating tank

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1213567B (it) * 1986-12-19 1989-12-20 Permelec Spa Anodo permanente per procedimenti galvanici ad alta densita' di correnti
EP1961842A1 (en) * 2007-02-22 2008-08-27 Atotech Deutschland Gmbh Device and method for the electrolytic plating of a metal

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9657406B2 (en) 2011-06-30 2017-05-23 C. Uyemura & Co., Ltd. Surface treating apparatus and plating tank

Also Published As

Publication number Publication date
JPS6026692A (ja) 1985-02-09

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