KR870008057A - 고속 도금방법 - Google Patents

고속 도금방법 Download PDF

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Publication number
KR870008057A
KR870008057A KR870001314A KR870001314A KR870008057A KR 870008057 A KR870008057 A KR 870008057A KR 870001314 A KR870001314 A KR 870001314A KR 870001314 A KR870001314 A KR 870001314A KR 870008057 A KR870008057 A KR 870008057A
Authority
KR
South Korea
Prior art keywords
plating method
high speed
speed plating
plated
vibrated
Prior art date
Application number
KR870001314A
Other languages
English (en)
Other versions
KR900005846B1 (ko
Inventor
히로나리 사와
Original Assignee
히로나리 사와
사아렉 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 히로나리 사와, 사아렉 가부시기가이샤 filed Critical 히로나리 사와
Publication of KR870008057A publication Critical patent/KR870008057A/ko
Application granted granted Critical
Publication of KR900005846B1 publication Critical patent/KR900005846B1/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04—Electroplating with moving electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0292—Using vibration, e.g. during soldering or screen printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Chemically Coating (AREA)

Abstract

내용 없음

Description

고속 도금방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (1)

  1. 피도금기판을, 이 판면을 포함하는 평면내에서 평행회전시킴과 동시에 또한 상하방향 및/또는 좌우방향에 있어서 회전방향에 대해서 소정의 각도로 부여하여 진동시켜서 도금하는 것을 특징으로 하는 고속도금방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019870001314A 1986-02-21 1987-02-18 고속도금방법 KR900005846B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP34971 1986-02-21
JP61-34971 1986-02-21
JP61034971A JPS62196398A (ja) 1986-02-21 1986-02-21 スルーホールプリント基板の高速鍍金方法

Publications (2)

Publication Number Publication Date
KR870008057A true KR870008057A (ko) 1987-09-24
KR900005846B1 KR900005846B1 (ko) 1990-08-13

Family

ID=12429024

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019870001314A KR900005846B1 (ko) 1986-02-21 1987-02-18 고속도금방법

Country Status (3)

Country Link
US (1) US4726884A (ko)
JP (1) JPS62196398A (ko)
KR (1) KR900005846B1 (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01316498A (ja) * 1988-06-15 1989-12-21 Nec Corp プリント基板のめっき治具
DE3905100A1 (de) * 1989-02-20 1990-08-23 Hans Henig Verfahren und vorrichtung zum elektrolytaustausch vornehmlich in engen vertiefungen grossflaechiger werkstuecke
CH683007A5 (de) * 1990-08-17 1993-12-31 Hans Henig Verfahren zum kontinuierlichen Austausch der wässrigen Lösungen während einer Oberflächenbehandlung sowie eine Vorrichtung dazu.
DE4133561C2 (de) * 1991-10-10 1994-02-03 Reinhard Kissler Gmbh Verfahren und Vorrichtung zum Galvanisieren von Waren
US6001235A (en) * 1997-06-23 1999-12-14 International Business Machines Corporation Rotary plater with radially distributed plating solution
DE10061226A1 (de) * 2000-12-08 2002-06-20 Emil Hepting Verfahren und Vorrichtung zur Behandlung von Waren in einem Tauchbad

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS501349A (ko) * 1973-05-14 1975-01-08
JPS563690A (en) * 1979-06-20 1981-01-14 Ibiden Co Ltd High speed through-hole plating method

Also Published As

Publication number Publication date
US4726884A (en) 1988-02-23
JPS62196398A (ja) 1987-08-29
KR900005846B1 (ko) 1990-08-13
JPH0248640B2 (ko) 1990-10-25

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A201 Request for examination
E902 Notification of reason for refusal
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
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Payment date: 20000715

Year of fee payment: 11

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