KR900001223B1 - 반도체 장치 - Google Patents

반도체 장치 Download PDF

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Publication number
KR900001223B1
KR900001223B1 KR8201045A KR820001045A KR900001223B1 KR 900001223 B1 KR900001223 B1 KR 900001223B1 KR 8201045 A KR8201045 A KR 8201045A KR 820001045 A KR820001045 A KR 820001045A KR 900001223 B1 KR900001223 B1 KR 900001223B1
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South Korea
Prior art keywords
die
copper
lead
package
metallization
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Expired
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KR8201045A
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English (en)
Korean (ko)
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KR830009650A (ko
Inventor
알.올슨 데니스
카이츠지.스파니어
Original Assignee
빈센트 제이.라우너
모터로라 인코오포레이티드
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Publication of KR830009650A publication Critical patent/KR830009650A/ko
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Publication of KR900001223B1 publication Critical patent/KR900001223B1/ko
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    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
KR8201045A 1981-03-23 1982-03-11 반도체 장치 Expired KR900001223B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US24678481A 1981-03-23 1981-03-23
US246784 1981-03-23

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KR900001223B1 true KR900001223B1 (ko) 1990-03-05

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EP (1) EP0074378A4 (enrdf_load_stackoverflow)
JP (1) JPS58500463A (enrdf_load_stackoverflow)
KR (1) KR900001223B1 (enrdf_load_stackoverflow)
IT (1) IT1147903B (enrdf_load_stackoverflow)
WO (1) WO1982003294A1 (enrdf_load_stackoverflow)

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DE3401404A1 (de) * 1984-01-17 1985-07-25 Robert Bosch Gmbh, 7000 Stuttgart Halbleiterbauelement
GB2174063B (en) * 1985-04-22 1988-08-17 Philips Electronic Associated Semiconductor device having a laser printable envelope
JPS63253653A (ja) * 1987-04-10 1988-10-20 Citizen Watch Co Ltd 樹脂封止型ピングリツドアレイ及びその製造方法
IT1252624B (it) * 1991-12-05 1995-06-19 Cons Ric Microelettronica Dispositivo semiconduttore incapsulato in resina e elettricamente isolato di migliorate caratteristiche di isolamento,e relativo processo di fabbricazione
JPH088446A (ja) * 1995-05-25 1996-01-12 Rohm Co Ltd 個別ダイオード装置
US6821821B2 (en) * 1996-04-18 2004-11-23 Tessera, Inc. Methods for manufacturing resistors using a sacrificial layer
US6020636A (en) * 1997-10-24 2000-02-01 Eni Technologies, Inc. Kilowatt power transistor
US7696611B2 (en) * 2004-01-13 2010-04-13 Halliburton Energy Services, Inc. Conductive material compositions, apparatus, systems, and methods
US12074099B2 (en) * 2021-05-07 2024-08-27 Materion Corporation Microelectronics package assemblies and processes for making

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US2984774A (en) * 1956-10-01 1961-05-16 Motorola Inc Transistor heat sink assembly
US3434018A (en) * 1966-07-05 1969-03-18 Motorola Inc Heat conductive mounting base for a semiconductor device
US3597666A (en) * 1969-11-26 1971-08-03 Fairchild Camera Instr Co Lead frame design
US3763403A (en) * 1972-03-01 1973-10-02 Gen Electric Isolated heat-sink semiconductor device
JPS5120323B2 (enrdf_load_stackoverflow) * 1972-08-08 1976-06-24
US3821615A (en) * 1973-05-16 1974-06-28 Solitron Devices Long life lead frame means for semiconductor devices
US3922712A (en) * 1974-05-01 1975-11-25 Gen Motors Corp Plastic power semiconductor flip chip package
JPS5315763A (en) * 1976-07-28 1978-02-14 Hitachi Ltd Resin sealed type semiconductor device
IN148328B (enrdf_load_stackoverflow) * 1977-04-18 1981-01-17 Rca Corp
IT7821073V0 (it) * 1978-03-09 1978-03-09 Ates Componenti Elettron Morsetto per il fissaggio di un dispositivo a semiconduttore ad un dissipatore di calore.
JPS5516425A (en) * 1978-07-21 1980-02-05 Toshiba Corp Semiconductor device
JPS55127027A (en) * 1979-03-26 1980-10-01 Toshiba Corp Semiconductor device

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IT8248005A0 (it) 1982-03-16
KR830009650A (ko) 1983-12-22
EP0074378A4 (en) 1985-04-25
EP0074378A1 (en) 1983-03-23
JPH0412028B2 (enrdf_load_stackoverflow) 1992-03-03
JPS58500463A (ja) 1983-03-24
IT1147903B (it) 1986-11-26
WO1982003294A1 (en) 1982-09-30

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