KR890700267A - 접착제수지를 이용한 리드프레임에 대한 반도체 다이의 접착방법과 그 장치 - Google Patents

접착제수지를 이용한 리드프레임에 대한 반도체 다이의 접착방법과 그 장치

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Publication number
KR890700267A
KR890700267A KR1019880700809A KR880700809A KR890700267A KR 890700267 A KR890700267 A KR 890700267A KR 1019880700809 A KR1019880700809 A KR 1019880700809A KR 880700809 A KR880700809 A KR 880700809A KR 890700267 A KR890700267 A KR 890700267A
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South Korea
Prior art keywords
lead frame
semiconductor die
adhesive resin
bonding semiconductor
bonding
Prior art date
Application number
KR1019880700809A
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English (en)
Other versions
KR910006966B1 (ko
Inventor
윌리엄엔 볼스터
스탠리 에이 마커스
링컨 와잉
Original Assignee
엠 앤드 티 케미칼스 아이엔시 고든시. 앤드류스
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Application filed by 엠 앤드 티 케미칼스 아이엔시 고든시. 앤드류스 filed Critical 엠 앤드 티 케미칼스 아이엔시 고든시. 앤드류스
Publication of KR890700267A publication Critical patent/KR890700267A/ko
Application granted granted Critical
Publication of KR910006966B1 publication Critical patent/KR910006966B1/ko

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    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Die Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1019880700809A 1986-11-13 1987-11-12 접착제수지를 이용한 리드프레임에 대한 반도체 다이의 접착방법과 그 장치 KR910006966B1 (ko)

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US93060086A 1986-11-13 1986-11-13
US930600 1986-11-13
PCT/US1987/002952 WO1988003704A1 (en) 1986-11-13 1987-11-12 Attachment of semiconductor die to lead frame by means of an adhesive resin

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KR890700267A true KR890700267A (ko) 1989-03-10
KR910006966B1 KR910006966B1 (ko) 1991-09-14

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EP (1) EP0333734A1 (ko)
JP (1) JPH01502868A (ko)
KR (1) KR910006966B1 (ko)
CN (1) CN87107692A (ko)
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WO (1) WO1988003704A1 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100819794B1 (ko) * 2002-04-02 2008-04-07 삼성테크윈 주식회사 리드프레임 및, 그것을 이용한 반도체 패키지 제조 방법
KR101475467B1 (ko) * 2007-06-28 2014-12-22 샌디스크 테크놀로지스, 인코포레이티드 재배선 층을 갖는 반도체 다이

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US5019535A (en) * 1989-03-28 1991-05-28 General Electric Company Die attachment method using nonconductive adhesive for use in high density interconnected assemblies
US5237206A (en) * 1989-07-21 1993-08-17 Kabushiki Kaisha Toshiba Low-melting point glass sealed semiconductor device and method of manufacturing the same
EP0409004A3 (en) * 1989-07-21 1991-04-03 Kabushiki Kaisha Toshiba Low-melting point glass sealed semiconductor device and method of manufacturing the same
EP0409257A3 (en) * 1989-07-21 1991-04-03 Kabushiki Kaisha Toshiba Low-melting point glass sealed semiconductor device and method of manufacturing the same
US5002818A (en) * 1989-09-05 1991-03-26 Hughes Aircraft Company Reworkable epoxy die-attach adhesive
DE4124053A1 (de) * 1991-07-19 1993-01-21 Siemens Ag Verfahren zum herstellen einer haftverbindung zwischen wenigstens einem bauteil und einem metallischen substrat
DE69426347T2 (de) * 1993-09-29 2001-05-17 Matsushita Electric Ind Co Ltd Verfahren zum Montieren einer Halbleiteranordnung auf einer Schaltungsplatte und eine Schaltungsplatte mit einer Halbleiteranordnung darauf
JP2000144082A (ja) * 1998-11-16 2000-05-26 Minnesota Mining & Mfg Co <3M> 熱硬化性接着剤組成物、接着剤、および接着剤の製造方法
KR100576886B1 (ko) * 2000-08-30 2006-05-03 앰코 테크놀로지 코리아 주식회사 반도체패키지의 제조 방법
JP3542080B2 (ja) 2001-03-30 2004-07-14 リンテック株式会社 半導体チップ担持用接着テープ・シート、半導体チップ担持体、半導体チップマウント方法および半導体チップ包装体
DE10240460A1 (de) 2002-08-29 2004-03-11 Infineon Technologies Ag Universelles Halbleitergehäuse mit vorvernetzten Kunststoffeinbettmassen und Verfahren zur Herstellung desselben
JP6033734B2 (ja) * 2013-04-30 2016-11-30 日東電工株式会社 フィルム状接着剤、ダイシングテープ一体型フィルム状接着剤、及び、半導体装置の製造方法
DE102015107724B4 (de) * 2015-04-02 2016-12-01 Heraeus Deutschland GmbH & Co. KG Verfahren zum Herstellen einer Substratanordnung, Substratanordnung, Verfahren zum Verbinden eines Elektronikbauteils mit einer Substratanordnung und Elektronikbauteil

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US4029628A (en) * 1974-05-22 1977-06-14 The United States Of America As Represented By The Secretary Of The Navy Bonding material for planar electronic device
JPS5211154A (en) * 1975-07-17 1977-01-27 Shoei Chemical Ind Co Electrode material for wire welding
EP0051165A1 (en) * 1980-11-03 1982-05-12 BURROUGHS CORPORATION (a Michigan corporation) Repairable IC package with thermoplastic chip attach
JPS57152135A (en) * 1981-03-13 1982-09-20 Yamagata Nippon Denki Kk Manufacture of semiconductor device
EP0065686A3 (en) * 1981-05-21 1984-10-10 General Electric Company Power device module
JPS59931A (ja) * 1982-06-25 1984-01-06 Mitsubishi Electric Corp 半導体素子のマウント方法
JPS6045030A (ja) * 1983-08-23 1985-03-11 Hitachi Chem Co Ltd 半導体装置の製造法
JPS6066440A (ja) * 1983-09-21 1985-04-16 Fujitsu Ltd 半導体装置の製造方法
JPS6110246A (ja) * 1984-06-26 1986-01-17 Hitachi Chem Co Ltd 半導体装置の製造法
JPS61164233A (ja) * 1985-01-17 1986-07-24 Oki Electric Ind Co Ltd ダイボンデイング方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100819794B1 (ko) * 2002-04-02 2008-04-07 삼성테크윈 주식회사 리드프레임 및, 그것을 이용한 반도체 패키지 제조 방법
KR101475467B1 (ko) * 2007-06-28 2014-12-22 샌디스크 테크놀로지스, 인코포레이티드 재배선 층을 갖는 반도체 다이

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EP0333734A1 (en) 1989-09-27
JPH01502868A (ja) 1989-09-28
CN87107692A (zh) 1988-05-25
KR910006966B1 (ko) 1991-09-14
BR8707876A (pt) 1990-03-01
WO1988003704A1 (en) 1988-05-19

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