KR840004654A - 도선형성 및 도선 없는 부품에 도선을 접착시키는 방법 - Google Patents

도선형성 및 도선 없는 부품에 도선을 접착시키는 방법

Info

Publication number
KR840004654A
KR840004654A KR1019830001013A KR830001013A KR840004654A KR 840004654 A KR840004654 A KR 840004654A KR 1019830001013 A KR1019830001013 A KR 1019830001013A KR 830001013 A KR830001013 A KR 830001013A KR 840004654 A KR840004654 A KR 840004654A
Authority
KR
South Korea
Prior art keywords
conductors
parts
bonding
bonding conductors
Prior art date
Application number
KR1019830001013A
Other languages
English (en)
Other versions
KR910007103B1 (ko
Inventor
로브 피셔 2세 죤
Original Assignee
웨스턴 일렉트릭 캄파니 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 웨스턴 일렉트릭 캄파니 인코포레이티드 filed Critical 웨스턴 일렉트릭 캄파니 인코포레이티드
Publication of KR840004654A publication Critical patent/KR840004654A/ko
Application granted granted Critical
Publication of KR910007103B1 publication Critical patent/KR910007103B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67138—Apparatus for wiring semiconductor or solid state device
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10424—Frame holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0405—Solder foil, tape or wire
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0415—Small preforms other than balls, e.g. discs, cylinders or pillars
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/128—Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49149—Assembling terminal to base by metal fusion bonding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/49222—Contact or terminal manufacturing by assembling plural parts forming array of contacts or terminals

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
KR1019830001013A 1982-03-15 1983-03-14 도선형성 및 도선 없는 부품에 도선을 접착시키는 방법 KR910007103B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/358,412 US4412642A (en) 1982-03-15 1982-03-15 Cast solder leads for leadless semiconductor circuits
US358412 2003-02-04

Publications (2)

Publication Number Publication Date
KR840004654A true KR840004654A (ko) 1984-10-22
KR910007103B1 KR910007103B1 (ko) 1991-09-18

Family

ID=23409552

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019830001013A KR910007103B1 (ko) 1982-03-15 1983-03-14 도선형성 및 도선 없는 부품에 도선을 접착시키는 방법

Country Status (9)

Country Link
US (1) US4412642A (ko)
EP (1) EP0104204B1 (ko)
JP (1) JPS59500394A (ko)
KR (1) KR910007103B1 (ko)
CA (1) CA1187674A (ko)
DE (1) DE3363657D1 (ko)
GB (1) GB2117686B (ko)
HK (1) HK32486A (ko)
WO (1) WO1983003216A1 (ko)

Families Citing this family (71)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4664309A (en) * 1983-06-30 1987-05-12 Raychem Corporation Chip mounting device
US4705205A (en) * 1983-06-30 1987-11-10 Raychem Corporation Chip carrier mounting device
EP0150928A3 (en) * 1984-01-30 1985-08-28 AMP INCORPORATED (a New Jersey corporation) A compliant interconnection device and assembly method of manufacture, and of micro interconnection casting
US4558812A (en) * 1984-11-07 1985-12-17 At&T Technologies, Inc. Method and apparatus for batch solder bumping of chip carriers
US4661375A (en) * 1985-04-22 1987-04-28 At&T Technologies, Inc. Method for increasing the height of solder bumps
FR2584235B1 (fr) * 1985-06-26 1988-04-22 Bull Sa Procede de montage d'un circuit integre sur un support, dispositif en resultant et son application a une carte a microcircuits electroniques
US5917707A (en) 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
US4712721A (en) * 1986-03-17 1987-12-15 Raychem Corp. Solder delivery systems
US4878611A (en) * 1986-05-30 1989-11-07 American Telephone And Telegraph Company, At&T Bell Laboratories Process for controlling solder joint geometry when surface mounting a leadless integrated circuit package on a substrate
DE3684602D1 (de) * 1986-10-08 1992-04-30 Ibm Verfahren zum herstellen von loetkontakten fuer ein keramisches modul ohne steckerstifte.
US4722470A (en) * 1986-12-01 1988-02-02 International Business Machines Corporation Method and transfer plate for applying solder to component leads
US5189507A (en) * 1986-12-17 1993-02-23 Raychem Corporation Interconnection of electronic components
US4955523A (en) * 1986-12-17 1990-09-11 Raychem Corporation Interconnection of electronic components
US4739917A (en) * 1987-01-12 1988-04-26 Ford Motor Company Dual solder process for connecting electrically conducting terminals of electrical components to printed circuit conductors
US4861944A (en) * 1987-12-09 1989-08-29 Cabot Electronics Ceramics, Inc. Low cost, hermetic pin grid array package
JP2573016B2 (ja) * 1988-02-27 1997-01-16 アンプ インコーポレーテッド マイクロ入出力ピンおよびその製造方法
JPH0241794A (ja) * 1988-07-29 1990-02-09 Hitachi Ltd はんだ合金およびこれを用いた電子回路装置
US4889275A (en) * 1988-11-02 1989-12-26 Motorola, Inc. Method for effecting solder interconnects
US4914814A (en) * 1989-05-04 1990-04-10 International Business Machines Corporation Process of fabricating a circuit package
US5244143A (en) * 1992-04-16 1993-09-14 International Business Machines Corporation Apparatus and method for injection molding solder and applications thereof
US5211328A (en) * 1992-05-22 1993-05-18 International Business Machines Method of applying solder
US5464652A (en) * 1992-11-19 1995-11-07 Hughes Aircraft Company Green ceramic via metallization technique
DE4322391A1 (de) * 1993-06-30 1995-01-12 Volker Hoehns Bondeinrichtung
US5388327A (en) * 1993-09-15 1995-02-14 Lsi Logic Corporation Fabrication of a dissolvable film carrier containing conductive bump contacts for placement on a semiconductor device package
US6835898B2 (en) * 1993-11-16 2004-12-28 Formfactor, Inc. Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
US5820014A (en) 1993-11-16 1998-10-13 Form Factor, Inc. Solder preforms
US20070228110A1 (en) * 1993-11-16 2007-10-04 Formfactor, Inc. Method Of Wirebonding That Utilizes A Gas Flow Within A Capillary From Which A Wire Is Played Out
US20020053734A1 (en) 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US5435480A (en) * 1993-12-23 1995-07-25 International Business Machines Corporation Method for filling plated through holes
CA2135508C (en) * 1994-11-09 1998-11-03 Robert J. Lyn Method for forming solder balls on a semiconductor substrate
US5547902A (en) * 1995-01-18 1996-08-20 Advanced Micro Devices, Inc. Post hot working process for semiconductors
US20100065963A1 (en) 1995-05-26 2010-03-18 Formfactor, Inc. Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out
US5673846A (en) * 1995-08-24 1997-10-07 International Business Machines Corporation Solder anchor decal and method
JP3116130B2 (ja) * 1995-12-19 2000-12-11 住友金属工業株式会社 Ｂｇａ接続構造の形成方法
US6448169B1 (en) * 1995-12-21 2002-09-10 International Business Machines Corporation Apparatus and method for use in manufacturing semiconductor devices
US5994152A (en) 1996-02-21 1999-11-30 Formfactor, Inc. Fabricating interconnects and tips using sacrificial substrates
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
JP3116273B2 (ja) * 1996-04-26 2000-12-11 日本特殊陶業株式会社 中継基板、その製造方法、基板と中継基板と取付基板とからなる構造体、基板と中継基板の接続体
US5735452A (en) * 1996-06-17 1998-04-07 International Business Machines Corporation Ball grid array by partitioned lamination process
US5957370A (en) * 1997-01-10 1999-09-28 Integrated Device Technology, Inc. Plating process for fine pitch die in wafer form
US7819301B2 (en) * 1997-05-27 2010-10-26 Wstp, Llc Bumping electronic components using transfer substrates
US7842599B2 (en) * 1997-05-27 2010-11-30 Wstp, Llc Bumping electronic components using transfer substrates
US6609652B2 (en) 1997-05-27 2003-08-26 Spheretek, Llc Ball bumping substrates, particuarly wafers
US7288471B2 (en) * 1997-05-27 2007-10-30 Mackay John Bumping electronic components using transfer substrates
US7007833B2 (en) * 1997-05-27 2006-03-07 Mackay John Forming solder balls on substrates
US7654432B2 (en) 1997-05-27 2010-02-02 Wstp, Llc Forming solder balls on substrates
US6293456B1 (en) 1997-05-27 2001-09-25 Spheretek, Llc Methods for forming solder balls on substrates
US6025649A (en) 1997-07-22 2000-02-15 International Business Machines Corporation Pb-In-Sn tall C-4 for fatigue enhancement
US6105852A (en) 1998-02-05 2000-08-22 International Business Machines Corporation Etched glass solder bump transfer for flip chip integrated circuit devices
US6010340A (en) * 1998-03-04 2000-01-04 Internatinal Business Machines Corporation Solder column tip compliancy modification for use in a BGA socket connector
US6449840B1 (en) * 1998-09-29 2002-09-17 Delphi Technologies, Inc. Column grid array for flip-chip devices
US6450397B1 (en) * 1999-09-01 2002-09-17 Texas Instruments Incorporated Method of making ball grid array columns
US6295730B1 (en) * 1999-09-02 2001-10-02 Micron Technology, Inc. Method and apparatus for forming metal contacts on a substrate
US7156361B1 (en) 1999-09-02 2007-01-02 Micron Technology, Inc. Method and apparatus for forming metal contacts on a substrate
US6578754B1 (en) * 2000-04-27 2003-06-17 Advanpack Solutions Pte. Ltd. Pillar connections for semiconductor chips and method of manufacture
US6276596B1 (en) * 2000-08-28 2001-08-21 International Business Machines Corporation Low temperature solder column attach by injection molded solder and structure formed
SE520174C2 (sv) * 2000-12-29 2003-06-03 Ericsson Telefon Ab L M Förfarande och anordning för anordnande av vior i mönsterkort
US6527043B2 (en) * 2001-05-01 2003-03-04 Antaya Technologies Corporation Apparatus for casting solder on a moving strip
US6425518B1 (en) * 2001-07-25 2002-07-30 International Business Machines Corporation Method and apparatus for applying solder to an element on a substrate
CA2426651A1 (en) * 2003-04-28 2004-10-28 Ibm Canada Limited - Ibm Canada Limitee Method and apparatus for transferring solder bumps
US20050127484A1 (en) * 2003-12-16 2005-06-16 Texas Instruments Incorporated Die extender for protecting an integrated circuit die on a flip chip package
US7543376B2 (en) * 2004-10-20 2009-06-09 Panasonic Corporation Manufacturing method of flexible printed wiring board
US7273806B2 (en) * 2004-12-09 2007-09-25 International Business Machines Corporation Forming of high aspect ratio conductive structure using injection molded solder
US7781324B2 (en) * 2005-06-30 2010-08-24 Brother Kogyo Kabushiki Kaisha Method of producing wire-connection structure, and wire-connection structure
US7600667B2 (en) * 2006-09-29 2009-10-13 Intel Corporation Method of assembling carbon nanotube reinforced solder caps
US20090279275A1 (en) * 2008-05-09 2009-11-12 Stephen Peter Ayotte Method of attaching an integrated circuit chip to a module
US7867842B2 (en) * 2008-07-29 2011-01-11 International Business Machines Corporation Method and apparatus for forming planar alloy deposits on a substrate
US8162203B1 (en) * 2011-02-18 2012-04-24 International Business Machines Corporation Spherical solder reflow method
EP2796018A4 (en) * 2011-12-21 2015-08-12 Satinderpall S Pannu METHOD FOR PRODUCING ELECTRICAL FEEDING BY EXTRUDED METAL DELIVERIES
CN104409364B (zh) * 2014-11-19 2017-12-01 清华大学 转接板及其制作方法、封装结构及用于转接板的键合方法
FR3049155B1 (fr) * 2016-03-15 2018-04-13 Alstom Transport Technologies Carte electronique comprenant un circuit intercalaire a demi-trous metallises

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3171175A (en) * 1958-09-11 1965-03-02 Fidelitone Inc Method of bonding a stylus tip
US3193789A (en) * 1962-08-01 1965-07-06 Sperry Rand Corp Electrical circuitry
US3429040A (en) * 1965-06-18 1969-02-25 Ibm Method of joining a component to a substrate
US3589000A (en) * 1969-01-13 1971-06-29 Du Pont Method for attaching integrated circuit chips to thick film circuitry
US3541222A (en) * 1969-01-13 1970-11-17 Bunker Ramo Connector screen for interconnecting adjacent surfaces of laminar circuits and method of making
US3604836A (en) * 1969-09-08 1971-09-14 Sprague Electric Co Dip-coated electrical components
GB1353671A (en) * 1971-06-10 1974-05-22 Int Computers Ltd Methods of forming circuit interconnections
DE2143844C3 (de) * 1971-09-01 1979-09-13 Siemens Ag, 1000 Berlin U. 8000 Muenchen Verfahren zum Herstellen von Zweischichten-Kontaktstücken als Formteil
US3719981A (en) * 1971-11-24 1973-03-13 Rca Corp Method of joining solder balls to solder bumps
US3854521A (en) * 1972-07-25 1974-12-17 Coats & Clark Self contained metal casting dies
US4179802A (en) * 1978-03-27 1979-12-25 International Business Machines Corporation Studded chip attachment process
SU831318A1 (ru) * 1979-07-04 1981-05-23 Институт Проблем Литья Ан Украинской Сср Способ получени длинномерных биметал-личЕСКиХ ОТлиВОК
US4352449A (en) * 1979-12-26 1982-10-05 Bell Telephone Laboratories, Incorporated Fabrication of circuit packages
JPS5824037B2 (ja) * 1980-05-26 1983-05-18 富士通株式会社 導体ボ−ル配列方法

Also Published As

Publication number Publication date
EP0104204A4 (en) 1984-07-24
KR910007103B1 (ko) 1991-09-18
EP0104204B1 (en) 1986-05-28
JPS59500394A (ja) 1984-03-08
GB2117686A (en) 1983-10-19
GB8306447D0 (en) 1983-04-13
HK32486A (en) 1986-05-16
DE3363657D1 (en) 1986-07-03
WO1983003216A1 (en) 1983-09-29
GB2117686B (en) 1985-10-09
CA1187674A (en) 1985-05-28
EP0104204A1 (en) 1984-04-04
US4412642A (en) 1983-11-01

Similar Documents

Publication Publication Date Title
KR840004654A (ko) 도선형성 및 도선 없는 부품에 도선을 접착시키는 방법
MX164962B (es) Mejoras en metodo de deshidrociclizar alcanos
DK148580C (da) Koblingselement til hoereapparat
KR880700481A (ko) 전기적 상호 접속 수단 및 접속방법
KR840005446A (ko) N--4-피페리딘아민의 제조방법
KR870700614A (ko) -1-아릴-2-아실아미도-3-플루오로-1-프로판올의 제조방법
NO832155L (no) Beskyttelsesmetode
DK436483D0 (da) Elektrisk forbindelsesdase
BR8301629A (pt) Vedador
DE2967370D1 (en) Method of bonding two members
DK606183A (da) Stikforbindelse
FI831772A0 (fi) I under tryck staoende behaollare anvaendbar foerdelningsventil
KR880004732A (ko) 본딩방법
KR840009150A (ko) 4-상한 게이트 분립 방법
NO840906L (no) Induktiv effektkobler
IT1179536B (it) Dispositivo per collegare connessioni elettriche
BR8306556A (pt) Metodo de preparacao de(trifluorometil)piridinas
DK256883D0 (da) Forbedret forgaeringsmetode
IT1196054B (it) Guardafili
ATA367084A (de) Verbindungseinrichtung
IT1176657B (it) Bicchierino
KR840004092A (ko) N-치환-테트라하이드로티아진의 제조방법
BE896050A (fr) Cisaille
SE8303990D0 (sv) Limningsmetod
DK373482A (da) Isoleringsmetode

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20000824

Year of fee payment: 10

LAPS Lapse due to unpaid annual fee