KR880009418A - 와이어 본딩방법 및 와이어 본딩장치 및 그 와이어 본딩 방법에 의해 생산되는 반도체 장치 - Google Patents

와이어 본딩방법 및 와이어 본딩장치 및 그 와이어 본딩 방법에 의해 생산되는 반도체 장치 Download PDF

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Publication number
KR880009418A
KR880009418A KR1019880000418A KR880000418A KR880009418A KR 880009418 A KR880009418 A KR 880009418A KR 1019880000418 A KR1019880000418 A KR 1019880000418A KR 880000418 A KR880000418 A KR 880000418A KR 880009418 A KR880009418 A KR 880009418A
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South Korea
Prior art keywords
wire
insulator
bonding
gas
coated
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KR1019880000418A
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English (en)
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KR960009982B1 (ko
Inventor
스스무 오기가와
미찌오 다니모두
Original Assignee
미다 가쓰시게
가부시기가이샤 히다찌세이사꾸쇼
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Priority claimed from JP62014035A external-priority patent/JPS63182828A/ja
Priority claimed from JP62152839A external-priority patent/JP2637430B2/ja
Application filed by 미다 가쓰시게, 가부시기가이샤 히다찌세이사꾸쇼 filed Critical 미다 가쓰시게
Publication of KR880009418A publication Critical patent/KR880009418A/ko
Application granted granted Critical
Publication of KR960009982B1 publication Critical patent/KR960009982B1/ko

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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/24—Preliminary treatment
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Abstract

내용 없음.

Description

와이어 본딩방법 및 와이어 본딩장치 및 그 와이어 본딩 방법에 의해 생산되는 반도체 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1 도는 본 발명의 실시예 1인 볼본딩 장치의 개략 구성도.
제 2 도는 상기 본딩 장치의 주요부 사시도.
제 3 도는 상기 본딩 장치에서 본딩된 수지 봉지형 반도체 장치의 단면도.

Claims (36)

  1. 본딩부에 금속선 표면을 절연체로 피복한 피복 와이어를 접속하는 본딩방법에 있어서, 연소용 개스와 상기 연소용 개스의 연소온도를 저하시키는 온도 제어요 개스의 혼합개스를 형성하는 공정, 상기 혼합개스의 연소용 개스를 연소시킨 연소염으로 상기 피복 와이어의 본딩 부분의 절연체를 제거하여 상기 피복 와이어의 본딩 부분의 금속선 표면을 노출시키는 공정, 상기 표면이 노출된 피복 와이어의 금속선을 상기 본딩부에 접속하는 공정을 마련하는 것을 특징으로 하는 본딩방법.
  2. 특허청구의 범위 제1항에 있어서, 상기 혼합개스의 연소용 개스의 연소염은 상기 피복 와이어의 금속선의 용해점과 동등 또는 그것보다도 저온도를 가지고 상기 피복 와이어의 절연체의 액체상태화에 요하는 온도보다도 고온도를 갖도록 온도 제어용 개스에 의해서 그 온도가 제어되는 있는 것을 특징으로 하는 본딩방법.
  3. 특허청구의 범위 제1항에 있어서, 상기 혼합개스의 온도 제어용 개스는 연소용 개스의 연소온도를 저하시킴과 동시에 연소용 개스의 연소염의 형상을 뾰족하게 제어할 수 있는 것을 특징으로 하는 본딩방법.
  4. 특허청구의 범위 제1항에 있어서, 상기 혼합개스의 연소용 개스는 He, Co이며, 상기 온도제어용 개스는 N2, Ar, He 인 것을 특징으로 하는 본딩방법.
  5. 특허청구의 범위 제1항에 있어서, 상기 피복 와이어의 금속선은 금,동,알루미늄으로 형성되며, 상기 절연체는 폴리우레탄 수지, 에스틸 이미드 수지, 에스텔 아미드 수지, 폴리이미드 수지의 수지막이나 CuO, Cu2O, AL2O3의 산화막으로 형성되어 있는 것을 특징으로 하는 본딩방법.
  6. 특허청구의 범위 제1항에 있어서, 상기 본딩부는 수지 또는 세라믹 봉지형 반도체 장치의 반도체칩의 외부단자와 외부 도출용 리드의 이너 리드부인 것을 특징으로 하는 본딩방법.
  7. 특허청구의 범위 제1항에 있어서, 상기 피복 와이어는 상기 리드의 이너 리드부에 접속하는 본딩 부분과 그 다음공정의 본딩 공정에 있어서 상기 반도체칩의 외부단자에 접속하는 본딩부분과의 절연체가 동일공정으로 제거되는 것을 특징으로 하는 본딩방법.
  8. 금속선 표면을 절연체로 피복한 와이어의 선단부에 금속볼을 형성하여 이 금속볼을 본딩부에 접속하는 본딩방법에 있어서, 연소용 개스와 상기 연소용 개스의 연소 온도를 저하시키는 온도 제어용 개스의 혼합개스를 형성하는 공정, 상기 혼합개스의 연소용 개스를 연소시킨 연소염으로 상기 피복 와이어의 본딩 부분의 절연체를 제거하여 상기 피복 와이어의 본딩부분의 금속선 표면을 노출시키는 공정, 상기 노출된 피복 와이어의 금속선을 상기 연소염 또는 다른 혼합개스를 연소시켜서 형성한 연소염을 사용해서 금속볼로 형성하는 공정, 상기 피복 와이어의 선단의 금속볼을 상기 본딩부에 접속하는 공정을 마련한 것을 특징으로 하는 본딩방법.
  9. 금속선 표면을 절연체로 피복한 와이어를 사용하여 반도체칩의 외부단자와 리드를 접속하는 본딩방법에 있어서, 상기 피복 와이어의 선단측의 절연체를 제거해서 노출시킨 금속선으로 금속볼을 형성하는 공정, 상기 금속볼을 상기 반도체칩의 외부단자에 접속하는 공정, 상기 피복 와이어의 후단측을 상기 리드에 접촉시키는 공정, 상기 접촉부분의 절연체를 파괴하여 피복 와이어의 다른 쪽끝의 금속선과 리드를 접속하는 공정을 마련한 것을 특징으로 하는 본딩방법.
  10. 특허청구의 범위 제9항에 있어서, 상기 피복 와이어의 한쪽 끝의 절연체의 제거 및 금속볼을 형성하는 공정은 피복 와이어의 금속선과 전기토치 사이에 아크를 발생시켜서 행하여지는 것을 특징으로 하는 본딩방법.
  11. 특허청구의 범위 제9항에 있어서, 상기 금속볼을 반도체칩의 외부단자에 접속하는 공정은 열압착 또는 초음파 진동 및 초음파 진동 병용의 열압착에 의해서 행하여지는 것을 특징으로 하는 본딩방법.
  12. 특허청구의 범위 제9항에 있어서, 상기 피복 와이어의 다른쪽끝의 절연체를 파괴하여 피복와이어의 다른쪽끝의 금속선과 리드를 접속하는 공정은 초음파 진동에 의해서 행하여지는 것을 특징으로 하는 본딩방법.
  13. 특허청구의 범위 제9항에 있어서, 피복 와이어를 피복하고 있는 절연체는 폴리 우레탄 수지로 만들어 진 것을 특징으로 하는 본딩방법.
  14. 본딩부에 금속선 표면을 절연체로 피복한 피복 와이어를 접속하는 본딩장치에 있어서, 상기 피복 와이어의 공급 경로의 근방에 연소용 개스와 상기 연소용 개스의 연소 온도를 저하시키는 온도제어용 개스와의 혼합개스의 상기 연소용 개스를 연소시키는 절연체 제거토치를 마련한 것을 특징으로 하는 본딩장치.
  15. 특허청구의 범위 제14항에 있어서, 상기 절연체 제거토치는 상기 본딩부와 상기 피복 와이어를 공급하는 본딩툴 사이의 피복 와이어의 공급 경로의 근방에 마련되어 있는 것을 특징으로 하는 본딩장치.
  16. 특허청구의 범위 제14항에 있어서, 상기 절연체 제거토치는 피복 와이어의 공급 경로와 동일 방향으로 위치를 이동시키는 제1이동 장치에 마련되어 있는 것을 특징으로 하는 본딩장치.
  17. 특허청구의 범위 제14항에 있어서, 상기 절연체 제거토치는 피복 와이어의 공급경로를 횡단하는 방향으로 동직하는 제2이동 장치에 마련되어 있는 특징으로 하는 본딩장치.
  18. 본딩부에 금속선 표면을 절연체로 피복한 피복 와이어를 접속하는 본딩 장치에 있어서, 상기 피복 와이어의 공급 경로 근방에 연소용 개스와 상기 연소용 개스의 연소온도를 저하시키는 온도 제어용 개스와의 혼합개스의 상기 연소용 개스를 연소시키는 절연체 제거토치를 마련하고, 상기 절연체 제거토치의 혼합개스의 분출구의 근방에 상기 연소용 개스를 자연 점화하는 정도로 가열하는 히터부를 마련한 것을 특징으로 하는 본딩장치.
  19. 본딩부에 금속선 표면을 절연체로 피복한 피복 와이어를 접속하는 본딩장치에 있어서, 상기 피복 와이어의 공급 경로 근방에 연소용 개스를 연소시키는 절연체 제거토치를 마련하여 상기 절연체 제거토치의 연소용 개스의 분출구를 토치본체의 안지름에 비해서 작은 치수로 구성한 것을 특징으로 하는 본딩장치.
  20. 특허청구의 범위 제19항에 있어서, 상기 절연체 제거토치의 분출구의 치수는 38∼150㎛의 범위내로 구성되어 있는 것을 특징으로 하는 본딩장치.
  21. 특허청구의 범위 제19항에 있어서, 상기 절연체 제거토치에는 연소용 개스, 연소용 개스와 상기 연소용 개스의 연소온도를 저하시키는 온도제어용 개스의 혼합개스, 또는 연소용 개스와 상기 연소용 개스의 연소온도를 상승시키는 온도 제어용 개스의 혼합개스가 공급되는 것을 특징으로 하는 본딩장치.
  22. 금속선 표면을 절연체로 피복한 피복 와이어의 선단부의 금속선과 그 근방에 배치된 아크 전극 사이에 아크를 발생시켜 상기 피복 와이어의 선단부에 금속볼을 형성하는 본딩장치에 있어서, 상기 피복 와이어의 금속선을 정전극에 접속하고, 상기 아크 전극을 부전극에 접속한 것을 특징으로 하는 본딩장치.
  23. 특허청구의 범위 제22항에 있어서, 상기 피복 와이어의 선단부의 금속선과 아크 전극 사이의 근방에는 차페용 개스를 공급하는 차페개스 공급 노즐이 마련되어 있는 것을 특징으로 하는 본딩장치.
  24. 금속선 표면을 절연체로 피복한 피복 와이어의 선단부의 금속선과 전기토치 사이에 아크를 발생시켜서 이 피복 와이어의 선단부의 절연체를 제거함과 동시에 선단부의 금속선으로 금속볼을 형성하는 본딩장치로서, 상기 피복 와이어의 선단부 근방에 이 피복 와이어의 선단부분에 유체를 분출하는 유체 분출 장치를 마련한 것을 특징으로 하는 본딩장치.
  25. 특허청구의 범위 제24항에 있어서, 상기 유체 분출 장치는 피복 와이어의 선단부를 공급하는 본딩툴부와 전기 토치 사이의 피복 와이어의 공급 경로 근방에 마련되어있는 것을 특징으로 하는 본딩장치.
  26. 특허청구의 범위 제24항에 있어서, 상기 유체 분출 장치는 상기 아크 발생시에 상기 피복 와이어의 선단부의 금속선 표면상을 용해하는 절연체를 비산시키도록 구성되어 있는 것을 특징으로 하는 본딩장치.
  27. 특허청구의 범위 제24항에 있어서, 상기 유체 분출 장치에서 피복 와이어의 선단부분에 분출되는 유체는 N2, H2, He, Ar, 공기의 기체인 것을 특징으로 하는 본딩장치.
  28. 특허청구의 범위 제 24항에 있어서, 상기 피복 와이어의 선단부의 금속선은 정전위에 인가되고, 상기 전기토치는 부하전위에 인가되어 있는 것을 특징으로 하는 본딩방법.
  29. 금속선 표면을 절연체로 피복한 피복 와이어의 선단부의 금속선과 전기토치 사이에 아크를 발생시켜 이 피복 와이어의 선단부의 절연체를 제거함과 동시에 선단부의 금속선 으로 금속볼을 형성하는 본딩장치로서, 상기 피복 와이어의 선단부 근방에 상기 피복 와이어의 선단부분에 유체를 분출하는 유체 분출 장치를 마련하고, 상기 피복 와이어의 선단부 근방에 상기 유체 분출 장치에서의 유체의 분출로 비산되는 피복 와이어의 절연체를 흡인하는 흡인장치를 마련한 것을 특징으로 하는 본딩장치.
  30. 금속선 표면을 절연체로 피복한 피복 와이어의 선단부의 금속선과 전기토치 사이에 아크를 발생시켜 상기 피복 와이어의 선단부의 절연체를 제거함과 동시에 선단부의 금속선으로 금속볼을 형성하는 본딩장치로서, 상기 피복 와이어의 선단부 근방에 상기 피복 와이어의 선단부분에 유체를 분출하는 유체 분출 장치를 마련하여 상기 유체 분출 장치의 유체를 냉각하는 냉각장치를 마련한 것을 특징으로 하는 본딩장치.
  31. 금속선 표면을 절연체로 피복한 피복 와이어를 사용하여 반도체칩의 외부단자와 리드를 접속하는 반도체 장치에 있어서, 상기 피복 와이어의 한쪽끝의 절연체는 금속볼 형성시에 제거해서 상기 금속볼을 상기 반도체칩의 외부단자에 접속하고, 상기 피복 와이어의 다른쪽끝을 상기 리드에 접촉시켜서 이 접촉부분의 절연체를 파괴하여 상기 피복 와이어의 다른쪽의 금속선과 리드를 접속한 것을 특징으로 하는 반도체 장치.
  32. 특허청구의 범위 제31항에 있어서, 상기 피복 와이어의 한쪽끝의 절연체의 제거 및 금속볼의 형성은 피복 와이어의 금속선과 전기토치 사이에 아크를 발생시켜서 행하여져는 것을 특징으로 하는 반도체 장치.
  33. 특허청구의 범위 제31항에 있어서, 상기 금속볼을 열압착 및 초음파 진동 또는 초음파 진동병용 열압착에 의해서 반도체칩의 외부단자에 접속되는 것을 특징으로 하는 반도체 장치.
  34. 특허청구의 범위 제31항에 있어서, 상기 피복 와이어의 다른쪽끝의 절연체는 초음파 진동에 의해서 파괴되는 것을 특징으로 하는 반도체 장치.
  35. 특허청구의 범위 제31항에 있어서, 상기 피복 와이어의 금속선은 금, 동, 알루미늄으로 형성되고, 상기 절연체는 폴리 우레탄 수지, 에스텔 이미드수지, 에스텔 아미드 수지, 폴리 이미드 수지의 수지막이나 CuO, Cu2O의 산화막으로 형성되어 있는 것을 특징으로 하는 반도체 장치.
  36. 특허청구의 범위 제31항에 있어서, 상기 반도체 장치는 수지 봉지형 또는 세라믹 봉지형인 것을 특징으로 하는 반도체 장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019880000418A 1987-01-26 1988-01-21 와이어 본딩 방법 및 와이어 본딩 장치 및 그 와이어 본딩 방법에 의해 생산되는 반도체 장치 KR960009982B1 (ko)

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JP62014035A JPS63182828A (ja) 1987-01-26 1987-01-26 ボンデイング方法及びその実施装置
JP62-14035 1987-01-26
JP62-152839 1987-06-19
JP62152839A JP2637430B2 (ja) 1987-06-19 1987-06-19 ボンディング装置及びボンディング方法

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DE3851901D1 (de) 1994-12-01
KR960009982B1 (ko) 1996-07-25
US4998002A (en) 1991-03-05
HK28596A (en) 1996-02-23
DE3851901T2 (de) 1995-04-13
EP0276928B1 (en) 1994-10-26
EP0276928A2 (en) 1988-08-03
EP0276928A3 (en) 1990-08-22

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