KR870007985A - 탄성성형 스탬핑에 사용 가능한 저경도 실리콘 엘라스토더로 만든 탄성지지체 - Google Patents

탄성성형 스탬핑에 사용 가능한 저경도 실리콘 엘라스토더로 만든 탄성지지체 Download PDF

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KR870007985A
KR870007985A KR870001132A KR870001132A KR870007985A KR 870007985 A KR870007985 A KR 870007985A KR 870001132 A KR870001132 A KR 870001132A KR 870001132 A KR870001132 A KR 870001132A KR 870007985 A KR870007985 A KR 870007985A
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radicals
elastic support
support according
organic
plasticizer
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KR930003698B1 (ko
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로르 끌로드
로스땡 뽈
료바르 르네
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쨩 루이 쓰니에
롱 뽈랑 쉬미
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0016—Plasticisers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D22/00—Shaping without cutting, by stamping, spinning, or deep-drawing
    • B21D22/10—Stamping using yieldable or resilient pads
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/24—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen halogen-containing groups
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49805—Shaping by direct application of fluent pressure

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Laminated Bodies (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Shaping Metal By Deep-Drawing, Or The Like (AREA)

Abstract

내용 없음

Description

탄성성형 스탬핑에 사용 가능한 저경도 실리콘 엘라스토더로 만든 탄성지지체
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (12)

  1. 탄성성형으로 금속판을 스탬핑하기 위하여 실리콘 엘라스토머로 만든 다이를 형성하는 탄성지지체로서, 실리콘 엘라스토머는 그 교차결합된 네트웍내에 실리콘과 조화성이고 스탬핑 조건하에서도 안정적이고 비-이동성인 실리콘용의 1종 이상의 유기 또는 무기 가소제를 쇼어 00경도가 약 40 이하, 바람직하기로는 30 이하인 가소화된 실리콜 엘라스토머를 제조할 수 있는 양만큼 함유하고, 실리콘 엘라스토머는 촉매 존재하에 축중합 또는 부가중합에 의하여 주변온도 또는 가열에 의하여 교차결합하는 유체 오르가노폴리실옥산 조성물의 교차결합에 기원함을 특징으로 하는 탄성지지체.
  2. 제 1 항에 있어서, 가소제가 유기 및 광물성 탄화수소 오일, 디오르가노폴리실옥산 오일, 유기 가소제 및 혼합된 유기/디오르가노폴리실옥산 중합체로부터 선택됨을 특징으로 하는 탄성지지체.
  3. 제 2 항에 있어서, 가소제는 25℃에서 점도가 0.65-5,000mPa s, 바람직하기로는 5-1,000mPa s인 디오르가노폴리실옥산 오일임을 특징으로 하는 탄성지지체.
  4. 상기한 항들 중 어느 하나에 있어서, 탄성지지체는 다음으로 된 오르가노폴리실옥산 조성물의 교차 결합으로부터 기원함을 특징으로 하는 탄성지지체:
    A. 25℃에서 점도가 100-100,000mPa s이고, 분자당 2 이상의 비닐라디칼을 함유하고, 기타 라디칼은 메틸, 에틸, 페닐 및 3,3,3-트리플루오로프로필 라디킬로부터 선택되고, 유기 라디칼의 60%(숫자 기준) 이상이 메틸라디칼인 비닐화된 디오르가노폴리실옥산 오일:
    B. 분자당 3 이상의 ≡SiH기를 함유하고, 측쇄형 오르가노폴리실옥산 및 직쇄형 디오르가노폴리실옥산으로부터 선택되는 오르가노폴리실옥산:
    C. 필요시에 커플링제로서 분자당 2개의 ≡SiH기를 함유하는 직쇄형 디오르가노폴리실옥산 단, B.+C. 내의 ≡SiH기의 숫자 대 A.내의 비닐라디칼의 숫자의 비율은 0.7-2임:
    D. 바람직하기로는 그 일부분이 처리된 강화용 또는 반강화용 무기 충전제:
    E. 촉매적 유효량의 백금족 금속 촉매:그리고
    F. 가소제로서, 25℃에서 점도가 5-3,000mPa s, 바람직하기로는 10-1,500이고, 쇄중 유기라디칼은 C1-C10알킬, 페닐, 클로로페닐 및 3,3,3-트리플루오로프로필 라디칼로부터 선택되고, 이들 라디칼 중 80%(숫자 기준) 이상이 메틸라디칼인 디오르가노폴리실옥산.
  5. 제 4 항에 있어서, 오일 F는 A+B+C+D+E 100부당 5-400부, 바람직하기로는 20-200부 가해짐을 특징으로 하는 탄성지지체.
  6. 제 1-3 항 중 어느 하나에 있어서, 탄성지지체는 다음으로 된 오르가노폴리실옥산 조성물의 교차결합으로부터 기원함을 특징으로 하는 탄성지지체:
    (1) 25℃에서 점도가 20-500,0000Pa s이고, 쇄중 유기라디칼은 메틸, 비닐, 페닐 및 3,3,3-트리플루오로프로필 라디칼로부터 선택되고, 그 중 60%(숫자 기준) 이상이 메틸라디칼이고, 최대 20%(숫자 기준)이 페닐라디칼이고, 2%(숫자 기준) 이하가 비닐라디칼인 1종 이상의 알파, 오메가-디히드록시디오르가노폴리실옥산 중합체:
    (2) 강화용 또는 반강화용 무기 충전제:
    (3) 폴리알콕시실란 및 폴리알콜시실옥산으로부터 선택된는 1종 이상의 교차결합제:
    (4) 촉매적 유효량의 주석 촉매:그리고
    (5) 가소제로서, 25℃에서 점도가 5-3,000Pa s, 바람직하기로는 10-1,500이고, 쇄중 유기라디칼은 C1-C10알킬, 페닐, 클로로페닐, 비닐 및 3,3,3-트리플루오로필 라디칼로부터 선택되고, 이들 라디칼중 80%(숫자 기준) 이상이 메틸라디칼인 디오르가노폴리실옥산.
  7. 제 6 항에 있어서, 오일 (5)는 조성물 (1)+(2)+(3)+(4) 400부당 50-500부, 바람직하기로는 80-250부 가하여짐을 특징으로 하는 탄성지지체.
  8. 제 1 항에 있어서, 탄성지지체의 표면의 적어도 일부분에는 두께 0.5-25mm이고, 쇼어 A 경도가 30-90, 바람직하기는 35-80인 경질 엘라스토머의 막으로 둘러싸여져 있음을 특징으로 하는 탄성지지체.
  9. 제 8 항에 있어서 경질 엘라스토머는 폴리우레탄, 폴리부라디엔 및 천연고무로부터 선택됨을 특징으로 하는 탄성지지체.
  10. 제 1 항에 있어서, 탄성지지체는 다이용기내에 나란히 배열되거나 및/또는 중첩되어 있는 여러개의 탄성부재들로 되어 있음을 특징으로 하는 탄성지지체.
  11. 제 1-3 항 중 어는 하나의 탄성지지체를 제조함에 있어서, 교차결합 전에 가소제가 오르가노폴리실옥산 조성물내에 도입됨을 특징으로 하는 탄성지지체의 제조 방법..
  12. 상기한 항들 중 어느 하나에 따른 탄성지지체를 2중 작용 프레스내에 탄성성형에 의하여 금속판을 스탬핑하는데 사용하는 탄성지지체의 용도.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019870001132A 1986-02-11 1987-02-11 탄성성형 스탬핑에 사용가능한 저경도 실리콘 엘라스토머로 만든 탄성지지체 KR930003698B1 (ko)

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Application Number Priority Date Filing Date Title
FR01993 1986-02-11
FR1993 1986-02-11
FR8601993A FR2594126B1 (fr) 1986-02-11 1986-02-11 Support elastique en elastomere silicone de faible durete utilisable pour l'emboutissage par elastoformage

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KR870007985A true KR870007985A (ko) 1987-09-23
KR930003698B1 KR930003698B1 (ko) 1993-05-08

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EP (1) EP0236243B1 (ko)
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FR2594126A1 (fr) 1987-08-14
ES2021744B3 (es) 1991-11-16
GR3001899T3 (en) 1992-11-23
FR2594126B1 (fr) 1988-08-05
EP0236243A1 (fr) 1987-09-09
CA1274336A (fr) 1990-09-18
DK65587A (da) 1987-08-12
CZ279000B6 (en) 1994-11-16
SU1766263A3 (ru) 1992-09-30
KR930003698B1 (ko) 1993-05-08
US4926673A (en) 1990-05-22
NO870506D0 (no) 1987-02-10
DE3769675D1 (de) 1991-06-06
CN87100670A (zh) 1987-08-26
JPS62253629A (ja) 1987-11-05
UA11067A (uk) 1996-12-25
PT84265A (fr) 1987-03-01
NO169081B (no) 1992-01-27
DD260015A5 (de) 1988-09-14
IL81357A (en) 1990-11-05
AU7371787A (en) 1988-12-01
BR8700575A (pt) 1987-12-08
PT84265B (pt) 1989-09-14
US4824891A (en) 1989-04-25
AU599107B2 (en) 1990-07-12
SK278729B6 (sk) 1998-01-14
DK173422B1 (da) 2000-10-02
CZ89887A3 (en) 1993-04-14
IN169905B (ko) 1992-01-11
IE870338L (en) 1987-08-11
US5000029A (en) 1991-03-19
IL81357A0 (en) 1987-08-31
ATE63071T1 (de) 1991-05-15
HU212241B (en) 1996-04-29
ZA87908B (en) 1987-07-31
NO870506L (no) 1987-08-12
IE59243B1 (en) 1994-01-26
NO169081C (no) 1992-05-06
SK89887A3 (en) 1998-01-14
DK65587D0 (da) 1987-02-10
AR245752A1 (es) 1994-02-28
EP0236243B1 (fr) 1991-05-02
JPH0653816B2 (ja) 1994-07-20
CN1012620B (zh) 1991-05-15
HUT55425A (en) 1991-05-28

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