KR870000747A - 인화비소칼륨 혼합결정 에피텍셜 웨이퍼 - Google Patents

인화비소칼륨 혼합결정 에피텍셜 웨이퍼 Download PDF

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KR870000747A
KR870000747A KR1019860004772A KR860004772A KR870000747A KR 870000747 A KR870000747 A KR 870000747A KR 1019860004772 A KR1019860004772 A KR 1019860004772A KR 860004772 A KR860004772 A KR 860004772A KR 870000747 A KR870000747 A KR 870000747A
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epitaxial wafer
mixed crystal
layer
monolayer
single crystal
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KR920007445B1 (ko
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후지다 히사노리
가나야마 마사끼
오까노 다께시
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미쓰비시 몬산토 케미칼 컴파니 리미티드
이찌하라시로
미쓰비시 케미칼 인더스트리스 리미티드
자스즈끼세이지
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    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/26Materials of the light emitting region
    • H01L33/30Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
    • HELECTRICITY
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    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
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    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract

내용 없음.

Description

인화비소칼륨 혼합결정 에피텍셜 웨이퍼
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (7)

  1. 단일결정기질, 이러한 단일결정 기질상에 형성되고, 그 두께에 따라 혼합결정비가 변동되는 인화비소칼륨층(이하 "단층"이라 한다) 및 단층상에 형성되고, 그 두께에 따라 일정한 혼합결정비를 가진 인화비소칼륨층(이하 "일정층"이라 한다)으로 구성된 인화비소 갈륨 혼합결정의 에피텍셜 웨이퍼로서, 상기 단층내에 또는 그 위에 인화비소갈륨의 혼합결정비가 그 두께에 따라 불연속적으로 변동되는 적어도 하나 이상의 층영역이 포함되어 있는 것을 특징으로 하는 에피텍셜 웨이퍼.
  2. 제1항에 있어서, 단일 결정기질이 비소화갈륨으로 구성되어 있는 에피텍셜 웨이퍼.
  3. 제1항에 있어서 단일 결정기질이 인화갈륨으로 구성되어 있는 에피텍셜 웨이퍼. .
  4. 제1항 또는 제2항에 있어서, 일정층의 혼합결정비가 0.35내지 0.45의 범위 안에 한값으로 되어 있는 에피텍셜 웨이퍼.
  5. 제4항에 았어서, 상기 값이 0.4인 에피텍셜 웨이퍼.
  6. 제4항에 있어서, 상기 단층의 두께가 5내지 200μm의 범위 안에 있는 에피텍셜 웨이퍼.
  7. 제4항 또는 제6항에 있어서, 상기 단층에 이 단층과 단일 결정기질 또는 일정층 사이의 계면상에 혼합결정비가 상기 단층의 혼합결정비의 가변도에 대하여 불연속적으로 변동되는 적어도 하나 이상의 층영역이 포함되어 있는 에피텍셜 웨이퍼.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019860004772A 1985-06-19 1986-06-16 갈륨비소인 혼합결정 에피택셜 웨이퍼 KR920007445B1 (ko)

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JP60133554A JPS61291491A (ja) 1985-06-19 1985-06-19 りん化ひ化ガリウム混晶エピタキシヤルウエハ
JP133554 1985-06-19

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KR870000747A true KR870000747A (ko) 1987-02-01
KR920007445B1 KR920007445B1 (ko) 1992-09-01

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US (2) US4865655A (ko)
JP (1) JPS61291491A (ko)
KR (1) KR920007445B1 (ko)
BE (1) BE904951A (ko)
DE (1) DE3620466C3 (ko)

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BE904951A (fr) 1986-10-16
US4968642A (en) 1990-11-06
US4865655A (en) 1989-09-12
JPS61291491A (ja) 1986-12-22
JPH0581560B2 (ko) 1993-11-15
DE3620466C3 (de) 1998-04-23
DE3620466C2 (ko) 1993-09-09
KR920007445B1 (ko) 1992-09-01
DE3620466A1 (de) 1987-01-02

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