KR850008225A - 납땜 가능한 전도성 중합체조성물 및 그 제조방법 - Google Patents

납땜 가능한 전도성 중합체조성물 및 그 제조방법 Download PDF

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KR850008225A
KR850008225A KR1019850003344A KR850003344A KR850008225A KR 850008225 A KR850008225 A KR 850008225A KR 1019850003344 A KR1019850003344 A KR 1019850003344A KR 850003344 A KR850003344 A KR 850003344A KR 850008225 A KR850008225 A KR 850008225A
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acid
conductive polymer
polymer composition
metal
saturated monocarboxylic
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KR1019850003344A
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KR900000857B1 (ko
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세인트죤(외 1) 프랭크
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원본미기재
엘렉트로 머티리얼즈 코오포레이션 오브 어메리카
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F5/00—Screening processes; Screens therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wood Science & Technology (AREA)
  • General Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
  • Conductive Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Non-Insulated Conductors (AREA)
  • Epoxy Resins (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Laminated Bodies (AREA)

Abstract

내용 없음

Description

납땜 가능한 전도성 중합체조성물 및 그 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (27)

  1. 유기중합체 매트릭스 및 그속에 분산된, 포화모노카르복시산으로 도포된 금속(바람직하게는 니켈)으로 구성된 납땜가능한 전도성 중합체 조성물.
  2. 청구범위 제1항에 있어서, 그것이 거절에 적용되어 필름을 형성함을 특징으로 하는, 전도성 중합체 조성물.
  3. 청구범위 제2항에 있어서, 필름이 건조 경화될 수 있음을 특징으로 하는, 전도성 중합체 조성물.
  4. 청구범위 제1항에 있어서, 금속이 분말, 박편, 스펀지 또는 그들의 혼합물 형태로 구성된 것인, 전도성 중합체 조성물.
  5. 청구범위 제1항에 있어서, 유기중합체 매트릭스가 열경화성수지, 에폭시수지 및 페놀수지로 구성된 그룹으로부터 선택된 것인, 전도성 중합체 조성물.
  6. 청구범위 제1항에 있어서, 포화모노카르복시산이 다음 일반식을 갖는 것인, 전도성 중합체 조성물.
    식중, R은 일반식 CnH2n+1(n=10-18의 정수)의 탄화수소임.
  7. 청구범위 제1항에 있어서, 포화모노카르복시산이 지방산인 것인,전도성 중합체 조성물.
  8. 청구범위 제1항에 있어서, 포화모노카르복시산이 옥타메카노산 또는 n-헵타데카노산인 것인, 전도성 중합체 조성물.
  9. 청구범위 제1항에 있어서, 금속대 유기중합체 매트릭스의 중량비가 약 5:3 내지 20:1인 것인,전도성 중합체 조성물.
  10. 청구범위 제1항에 있어서, 포화모노카르복시산 대금속의 중량비가 약 1:1000 내지 1:30 정도인 것인,전도성 중합체 조성물.
  11. 청구범위 제1항에 있어서, 조성물중의 금속의 총중량비가 약 50-85%인 것인,전도성 중합체 조성물.
  12. 청구범위 제1항에 있어서, 조성물중의 포화모노카르복시산의 총중량비가 약 0.1-3%인 것인,전도성 중합체 조성물.
  13. 금속(주로 니켈)을 포화모노카르복시산으로 도포한 후 이것을 유기중합체 매트릭스내에 분산시켜 납땜용이한 전도성 중합체 조성물을 제조하는 방법.
  14. 청구범위 제13항에 있어서, 유기중합체 매트릭스가 열경화성 수지, 에폭시수지 및 페놀수지로 구성된 그룹으로부터 선택된 것인, 전도성 중합체 조성물의 제조방법.
  15. 청구범위 제13항에 있어서, 금속이 분말, 박편, 스펀지 또는 그들의 혼합물 형태로 구성된 것인,전도성 중합체 조성물의 제조방법.
  16. 청구범위 제13항에 있어서, 포화모노카르복시산이 다음 일반식을 갖는 것인,전도성 중합체 조성물의 제조방법.
    식중, R은 일반식 CnH2n+1(n=10-18의 정수)의 탄화수소임.
  17. 청구범위 제13항에 있어서, 포화모노카르복시산이 지방산인 것인, 전도성 중합체 조성물의 제조방법.
  18. 청구범위 제13항에 있어서, 포화모노카르복시산이 n-헵타메카노산, 헥사매카노산, 옥타매카노산, 테트라매카노산, n-펜타데카노산, 테카노산, 운데카노산, 노나데카노산, 도데카노산 및 n-트리데카노산으로 구성된 그룹으로부터 선택된 것인, 전도성 중합체 조성물의 제조방법.
  19. 청구범위 제13항에 있어서, 금속과 유기중합체 매트릭스의 중량비가 약 50:50 내지 85:15인 것인, 전도성 중합체 조성물의 제조방법.
  20. 청구범위 제13항에 있어서, 카르복시산과 금속의 중량비가 약 1:1000 내지 1:30인 것인, 전도성 중합체 조성물의 제조방법.
  21. 카르복시산을 용매에 용해시킨 수, 이 용액에 금속을 가한 다음 용매를 증발시킴으로서 금속(바람직하게는 니켈)을 카르복시산으로 도포하는 방법.
  22. 청구범위 제21항에 있어서, 카르복시산이 포화모노카르복시산인 것인, 도포방법.
  23. 유기중합체 매트릭스을 용매에 용해시키고, 이 용액을 포화모노카르복시산으로 도포된 금속(주로 니켈)을 분산시켜 분산혼합물을 형성한 다음 이 혼합물을 기질에 적용하고 경화시켜 기질상에 납땜가능한 전도성 중합체 필름을 형성함을 특징으로 하는 기질의 처리방법.
  24. 청구범위 제23항에 있어서, 유기중합체 매트릭스가 에폭시수지인 것인, 기질의 처리방법.
  25. 청구범위 제24항에 있어서, 용매가 부틸카르비롤 아세테이트인 것인, 기질의 처리방법.
  26. 청구범위 제23항에 있어서, 혼합물이 약 125-200℃에서 약 30초-2시간동안 경화 처리되는 것인, 기질의 처리방법.
  27. 청구범위 제23항에 있어서, 포화모노카르복시산이 옥타데카노산 또는 n-헵타데카노산인 것인, 기질의 처리방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019850003344A 1984-05-21 1985-05-16 납땜가능한 전도성 중합체조성물 및 그 제조방법 KR900000857B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US612,184 1984-05-21
US612184 1984-05-21
US06/612,184 US4548879A (en) 1984-05-21 1984-05-21 Solderable polymer thick films

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KR850008225A true KR850008225A (ko) 1985-12-13
KR900000857B1 KR900000857B1 (ko) 1990-02-17

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Country Status (8)

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US (1) US4548879A (ko)
EP (1) EP0162698B1 (ko)
JP (1) JPS612202A (ko)
KR (1) KR900000857B1 (ko)
AT (1) ATE52355T1 (ko)
CA (1) CA1286439C (ko)
DE (1) DE3577369D1 (ko)
PH (1) PH20682A (ko)

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JPS6058268B2 (ja) * 1981-10-29 1985-12-19 藤倉化成株式会社 導電性銅ペ−スト組成物
JPS6099182A (ja) * 1983-11-04 1985-06-03 Atsugi Chuo Kenkyusho Kk シアノアクリレート混合用金属粉

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Publication number Publication date
PH20682A (en) 1987-03-24
ATE52355T1 (de) 1990-05-15
EP0162698B1 (en) 1990-04-25
KR900000857B1 (ko) 1990-02-17
JPS612202A (ja) 1986-01-08
CA1286439C (en) 1991-07-16
DE3577369D1 (de) 1990-05-31
EP0162698A1 (en) 1985-11-27
JPH0371726B2 (ko) 1991-11-14
US4548879A (en) 1985-10-22

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