KR20250164337A - 아민이미드 화합물, 아민이미드 조성물, 경화제, 에폭시 수지 조성물, 아민이미드 화합물의 제조 방법, 밀봉재, 및 접착제 - Google Patents

아민이미드 화합물, 아민이미드 조성물, 경화제, 에폭시 수지 조성물, 아민이미드 화합물의 제조 방법, 밀봉재, 및 접착제

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Publication number
KR20250164337A
KR20250164337A KR1020257037816A KR20257037816A KR20250164337A KR 20250164337 A KR20250164337 A KR 20250164337A KR 1020257037816 A KR1020257037816 A KR 1020257037816A KR 20257037816 A KR20257037816 A KR 20257037816A KR 20250164337 A KR20250164337 A KR 20250164337A
Authority
KR
South Korea
Prior art keywords
amine
imide compound
epoxy resin
group
compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257037816A
Other languages
English (en)
Korean (ko)
Inventor
나오야 가미무라
데루히사 야마다
Original Assignee
아사히 가세이 가부시키가이샤
아사히 가세이 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아사히 가세이 가부시키가이샤, 아사히 가세이 가부시키가이샤 filed Critical 아사히 가세이 가부시키가이샤
Publication of KR20250164337A publication Critical patent/KR20250164337A/ko
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D295/00—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms
    • C07D295/22—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms with hetero atoms directly attached to ring nitrogen atoms
    • C07D295/28—Nitrogen atoms
    • C07D295/32—Nitrogen atoms acylated with carboxylic or carbonic acids, or their nitrogen or sulfur analogues
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/506—Amines heterocyclic containing only nitrogen as a heteroatom having one nitrogen atom in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
    • C09J161/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
    • C09J161/30—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic and acyclic or carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Materials Engineering (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Plural Heterocyclic Compounds (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Indole Compounds (AREA)
KR1020257037816A 2020-07-15 2021-07-14 아민이미드 화합물, 아민이미드 조성물, 경화제, 에폭시 수지 조성물, 아민이미드 화합물의 제조 방법, 밀봉재, 및 접착제 Pending KR20250164337A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2020121122 2020-07-15
JPJP-P-2020-121122 2020-07-15
KR1020237001173A KR102886585B1 (ko) 2020-07-15 2021-07-14 아민이미드 화합물, 아민이미드 조성물, 경화제, 에폭시 수지 조성물, 아민이미드 화합물의 제조 방법, 밀봉재, 및 접착제
PCT/JP2021/026500 WO2022014646A1 (ja) 2020-07-15 2021-07-14 アミンイミド化合物、アミンイミド組成物、硬化剤、エポキシ樹脂組成物、アミンイミド化合物の製造方法、封止材、及び接着剤

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020237001173A Division KR102886585B1 (ko) 2020-07-15 2021-07-14 아민이미드 화합물, 아민이미드 조성물, 경화제, 에폭시 수지 조성물, 아민이미드 화합물의 제조 방법, 밀봉재, 및 접착제

Publications (1)

Publication Number Publication Date
KR20250164337A true KR20250164337A (ko) 2025-11-24

Family

ID=79554637

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020257037816A Pending KR20250164337A (ko) 2020-07-15 2021-07-14 아민이미드 화합물, 아민이미드 조성물, 경화제, 에폭시 수지 조성물, 아민이미드 화합물의 제조 방법, 밀봉재, 및 접착제
KR1020237001173A Active KR102886585B1 (ko) 2020-07-15 2021-07-14 아민이미드 화합물, 아민이미드 조성물, 경화제, 에폭시 수지 조성물, 아민이미드 화합물의 제조 방법, 밀봉재, 및 접착제

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020237001173A Active KR102886585B1 (ko) 2020-07-15 2021-07-14 아민이미드 화합물, 아민이미드 조성물, 경화제, 에폭시 수지 조성물, 아민이미드 화합물의 제조 방법, 밀봉재, 및 접착제

Country Status (6)

Country Link
US (1) US20230212132A1 (enExample)
JP (2) JP7606802B2 (enExample)
KR (2) KR20250164337A (enExample)
CN (2) CN120698950A (enExample)
TW (2) TWI787910B (enExample)
WO (1) WO2022014646A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20250034319A1 (en) * 2021-12-28 2025-01-30 Asahi Kasei Kabushiki Kaisha Epoxy resin composition, cured product, encapsulant and adhesive
JPWO2025028605A1 (enExample) * 2023-08-01 2025-02-06
JPWO2025028598A1 (enExample) * 2023-08-01 2025-02-06
TW202511344A (zh) * 2023-08-01 2025-03-16 日商旭化成股份有限公司 環氧樹脂用硬化劑、環氧樹脂組合物、硬化物、密封材料及接著劑

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4843089B1 (enExample) * 1969-12-20 1973-12-17
JPS5550050B2 (enExample) * 1972-11-20 1980-12-16
JPS5615652B2 (enExample) * 1973-11-12 1981-04-11
GB1465905A (en) * 1973-11-30 1977-03-02 Ici Ltd Ammonioamidates
US4005055A (en) * 1975-05-22 1977-01-25 Skeist Laboratories, Incorporated Anaerobic aminimide curing compositions
JPS61231020A (ja) * 1985-04-04 1986-10-15 Shigeo Tatsuki 低摩擦低摩耗性複合材料
JP2597137B2 (ja) * 1988-03-18 1997-04-02 三洋化成工業株式会社 反応性乳化剤及び水分散型樹脂組成物
JPH01304033A (ja) * 1988-05-30 1989-12-07 Lion Corp 二疎水鎖二親水基型界面活性剤
JP2594341B2 (ja) * 1988-11-28 1997-03-26 ユニチカ株式会社 ホツトメルト接着剤組成物
JP2000229927A (ja) 1999-02-09 2000-08-22 Three Bond Co Ltd アミンイミド化合物およびそれを用いたエポキシ樹脂組成物
JP2003055638A (ja) * 2001-08-21 2003-02-26 Three Bond Co Ltd フィルム状接着剤
JP2003096061A (ja) * 2001-09-25 2003-04-03 Otsuka Chem Co Ltd アミンイミド化合物及びそれを含有するエポキシ樹脂用硬化剤
JP2004284955A (ja) * 2003-03-19 2004-10-14 Arakawa Chem Ind Co Ltd アミンイミド化合物及びその製造方法
JP5057016B2 (ja) * 2006-06-26 2012-10-24 株式会社スリーボンド 活性エネルギー線の照射により活性化するアミンイミド化合物、それを用いた組成物およびその硬化方法
JP4973868B2 (ja) * 2007-11-13 2012-07-11 株式会社スリーボンド 硬化性樹脂組成物および硬化方法
EP2199313A1 (en) * 2007-12-28 2010-06-23 Mitsui Chemicals, Inc. Latent curing agents, epoxy resin compositions conating the same, sealing materials, and organic el displays
JP6282515B2 (ja) 2014-04-07 2018-02-21 旭化成株式会社 エポキシ樹脂及びその製造方法、エポキシ樹脂組成物及びその硬化物
JP2015231020A (ja) * 2014-06-06 2015-12-21 株式会社ニューフレアテクノロジー 露光システム及び露光方法

Also Published As

Publication number Publication date
TWI836648B (zh) 2024-03-21
JP7606802B2 (ja) 2024-12-26
KR102886585B1 (ko) 2025-11-14
CN120698950A (zh) 2025-09-26
JP2025041699A (ja) 2025-03-26
CN115803323A (zh) 2023-03-14
KR20230024366A (ko) 2023-02-20
TW202206416A (zh) 2022-02-16
TWI787910B (zh) 2022-12-21
JPWO2022014646A1 (enExample) 2022-01-20
CN115803323B (zh) 2025-05-16
TW202302547A (zh) 2023-01-16
US20230212132A1 (en) 2023-07-06
WO2022014646A1 (ja) 2022-01-20

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