JP7606802B2 - アミンイミド化合物、アミンイミド組成物、硬化剤、エポキシ樹脂組成物、アミンイミド化合物の製造方法、封止材、及び接着剤 - Google Patents

アミンイミド化合物、アミンイミド組成物、硬化剤、エポキシ樹脂組成物、アミンイミド化合物の製造方法、封止材、及び接着剤 Download PDF

Info

Publication number
JP7606802B2
JP7606802B2 JP2022536424A JP2022536424A JP7606802B2 JP 7606802 B2 JP7606802 B2 JP 7606802B2 JP 2022536424 A JP2022536424 A JP 2022536424A JP 2022536424 A JP2022536424 A JP 2022536424A JP 7606802 B2 JP7606802 B2 JP 7606802B2
Authority
JP
Japan
Prior art keywords
amine imide
epoxy resin
group
compound
imide compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022536424A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2022014646A1 (enExample
Inventor
直弥 上村
輝久 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei Corp
Original Assignee
Asahi Kasei Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei Corp filed Critical Asahi Kasei Corp
Publication of JPWO2022014646A1 publication Critical patent/JPWO2022014646A1/ja
Priority to JP2024217022A priority Critical patent/JP2025041699A/ja
Application granted granted Critical
Publication of JP7606802B2 publication Critical patent/JP7606802B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D295/00—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms
    • C07D295/22—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms with hetero atoms directly attached to ring nitrogen atoms
    • C07D295/28—Nitrogen atoms
    • C07D295/32—Nitrogen atoms acylated with carboxylic or carbonic acids, or their nitrogen or sulfur analogues
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/506—Amines heterocyclic containing only nitrogen as a heteroatom having one nitrogen atom in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
    • C09J161/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
    • C09J161/30—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic and acyclic or carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Materials Engineering (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Plural Heterocyclic Compounds (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Indole Compounds (AREA)
JP2022536424A 2020-07-15 2021-07-14 アミンイミド化合物、アミンイミド組成物、硬化剤、エポキシ樹脂組成物、アミンイミド化合物の製造方法、封止材、及び接着剤 Active JP7606802B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024217022A JP2025041699A (ja) 2020-07-15 2024-12-11 アミンイミド化合物、アミンイミド組成物、硬化剤、エポキシ樹脂組成物、アミンイミド化合物の製造方法、封止材、及び接着剤

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020121122 2020-07-15
JP2020121122 2020-07-15
PCT/JP2021/026500 WO2022014646A1 (ja) 2020-07-15 2021-07-14 アミンイミド化合物、アミンイミド組成物、硬化剤、エポキシ樹脂組成物、アミンイミド化合物の製造方法、封止材、及び接着剤

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024217022A Division JP2025041699A (ja) 2020-07-15 2024-12-11 アミンイミド化合物、アミンイミド組成物、硬化剤、エポキシ樹脂組成物、アミンイミド化合物の製造方法、封止材、及び接着剤

Publications (2)

Publication Number Publication Date
JPWO2022014646A1 JPWO2022014646A1 (enExample) 2022-01-20
JP7606802B2 true JP7606802B2 (ja) 2024-12-26

Family

ID=79554637

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022536424A Active JP7606802B2 (ja) 2020-07-15 2021-07-14 アミンイミド化合物、アミンイミド組成物、硬化剤、エポキシ樹脂組成物、アミンイミド化合物の製造方法、封止材、及び接着剤
JP2024217022A Pending JP2025041699A (ja) 2020-07-15 2024-12-11 アミンイミド化合物、アミンイミド組成物、硬化剤、エポキシ樹脂組成物、アミンイミド化合物の製造方法、封止材、及び接着剤

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024217022A Pending JP2025041699A (ja) 2020-07-15 2024-12-11 アミンイミド化合物、アミンイミド組成物、硬化剤、エポキシ樹脂組成物、アミンイミド化合物の製造方法、封止材、及び接着剤

Country Status (6)

Country Link
US (1) US20230212132A1 (enExample)
JP (2) JP7606802B2 (enExample)
KR (2) KR20250164337A (enExample)
CN (2) CN120698950A (enExample)
TW (2) TWI787910B (enExample)
WO (1) WO2022014646A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20250034319A1 (en) * 2021-12-28 2025-01-30 Asahi Kasei Kabushiki Kaisha Epoxy resin composition, cured product, encapsulant and adhesive
JPWO2025028605A1 (enExample) * 2023-08-01 2025-02-06
JPWO2025028598A1 (enExample) * 2023-08-01 2025-02-06
TW202511344A (zh) * 2023-08-01 2025-03-16 日商旭化成股份有限公司 環氧樹脂用硬化劑、環氧樹脂組合物、硬化物、密封材料及接著劑

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000229927A (ja) 1999-02-09 2000-08-22 Three Bond Co Ltd アミンイミド化合物およびそれを用いたエポキシ樹脂組成物
JP2003055638A (ja) 2001-08-21 2003-02-26 Three Bond Co Ltd フィルム状接着剤
JP2003096061A (ja) 2001-09-25 2003-04-03 Otsuka Chem Co Ltd アミンイミド化合物及びそれを含有するエポキシ樹脂用硬化剤
JP2008001857A (ja) 2006-06-26 2008-01-10 Three Bond Co Ltd 活性エネルギー線の照射により活性化するアミンイミド化合物、それを用いた組成物およびその硬化方法
JP2009120683A (ja) 2007-11-13 2009-06-04 Three Bond Co Ltd 硬化性樹脂組成物および硬化方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4843089B1 (enExample) * 1969-12-20 1973-12-17
JPS5550050B2 (enExample) * 1972-11-20 1980-12-16
JPS5615652B2 (enExample) * 1973-11-12 1981-04-11
GB1465905A (en) * 1973-11-30 1977-03-02 Ici Ltd Ammonioamidates
US4005055A (en) * 1975-05-22 1977-01-25 Skeist Laboratories, Incorporated Anaerobic aminimide curing compositions
JPS61231020A (ja) * 1985-04-04 1986-10-15 Shigeo Tatsuki 低摩擦低摩耗性複合材料
JP2597137B2 (ja) * 1988-03-18 1997-04-02 三洋化成工業株式会社 反応性乳化剤及び水分散型樹脂組成物
JPH01304033A (ja) * 1988-05-30 1989-12-07 Lion Corp 二疎水鎖二親水基型界面活性剤
JP2594341B2 (ja) * 1988-11-28 1997-03-26 ユニチカ株式会社 ホツトメルト接着剤組成物
JP2004284955A (ja) * 2003-03-19 2004-10-14 Arakawa Chem Ind Co Ltd アミンイミド化合物及びその製造方法
EP2199313A1 (en) * 2007-12-28 2010-06-23 Mitsui Chemicals, Inc. Latent curing agents, epoxy resin compositions conating the same, sealing materials, and organic el displays
JP6282515B2 (ja) 2014-04-07 2018-02-21 旭化成株式会社 エポキシ樹脂及びその製造方法、エポキシ樹脂組成物及びその硬化物
JP2015231020A (ja) * 2014-06-06 2015-12-21 株式会社ニューフレアテクノロジー 露光システム及び露光方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000229927A (ja) 1999-02-09 2000-08-22 Three Bond Co Ltd アミンイミド化合物およびそれを用いたエポキシ樹脂組成物
JP2003055638A (ja) 2001-08-21 2003-02-26 Three Bond Co Ltd フィルム状接着剤
JP2003096061A (ja) 2001-09-25 2003-04-03 Otsuka Chem Co Ltd アミンイミド化合物及びそれを含有するエポキシ樹脂用硬化剤
JP2008001857A (ja) 2006-06-26 2008-01-10 Three Bond Co Ltd 活性エネルギー線の照射により活性化するアミンイミド化合物、それを用いた組成物およびその硬化方法
JP2009120683A (ja) 2007-11-13 2009-06-04 Three Bond Co Ltd 硬化性樹脂組成物および硬化方法

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
Journal of Applied Polymer Science，1982年，27，2361-2368
Journal of Fluorine Chemistry，1991年，51，419-431
REGISTRY（STN）［online］，2004年，CAS 登録番号：791721-38-5など多数

Also Published As

Publication number Publication date
TWI836648B (zh) 2024-03-21
KR102886585B1 (ko) 2025-11-14
CN120698950A (zh) 2025-09-26
JP2025041699A (ja) 2025-03-26
CN115803323A (zh) 2023-03-14
KR20230024366A (ko) 2023-02-20
TW202206416A (zh) 2022-02-16
TWI787910B (zh) 2022-12-21
KR20250164337A (ko) 2025-11-24
JPWO2022014646A1 (enExample) 2022-01-20
CN115803323B (zh) 2025-05-16
TW202302547A (zh) 2023-01-16
US20230212132A1 (en) 2023-07-06
WO2022014646A1 (ja) 2022-01-20

Similar Documents

Publication Publication Date Title
JP7606802B2 (ja) アミンイミド化合物、アミンイミド組成物、硬化剤、エポキシ樹脂組成物、アミンイミド化合物の製造方法、封止材、及び接着剤
CN103221451B (zh) 透明片材用环氧树脂组合物及其固化物
JP6461170B2 (ja) 熱硬化性樹脂組成物
TWI890251B (zh) 環氧樹脂組合物、硬化物、密封材料及接著劑
JP4655490B2 (ja) エポキシ樹脂組成物及びその硬化体
JP2009051937A (ja) エポキシ樹脂組成物、その硬化物、及び新規エポキシ樹脂
JP4354242B2 (ja) 新規結晶性エポキシ樹脂、硬化性エポキシ樹脂組成物およびその硬化体
KR20140118800A (ko) 폴리하이드록시폴리에테르 수지의 제조 방법, 폴리하이드록시폴리에테르 수지, 그 수지 조성물 및 그 경화물
JPH09268220A (ja) エポキシ樹脂の製造方法、エポキシ樹脂組成物及びその硬化物
WO2025028598A1 (ja) エポキシ樹脂用硬化剤、エポキシ樹脂組成物、硬化物、封止材及び接着剤
KR20220007073A (ko) 잠재성 경화 촉매 및 그것을 포함하는 수지 조성물
JP6705262B2 (ja) アニオン硬化性化合物用硬化剤、硬化性組成物、および硬化物
JP2015067806A (ja) プリント配線板形成用硬化性組成物およびプリント配線板形成用積層体の製造方法
TW202513647A (zh) 硬化劑、環氧樹脂組合物、硬化物、密封材料及接著劑
CA2394053A1 (en) Epoxy resin, epoxy resin mixtures, epoxy resin compositions and products of curing of the same
TW202544172A (zh) 環氧樹脂組合物、硬化物、密封材料及接著劑
JP2024110452A (ja) 半導体装置、及び、半導体装置の製造方法
JP2000001525A (ja) 液状エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
TW202225256A (zh) 酯化合物、聚酯樹脂、硬化性組合物、硬化物、預浸體、印刷配線基板、增層膜、半導體密封材料及半導體裝置
KR20250089395A (ko) 이소프탈로일 유닛 및 알콕시실릴기를 갖는 신규한 화합물, 이의 제조방법, 이를 포함하는 에폭시 조성물, 경화물 및 물품
TW202432540A (zh) 酯化合物、樹脂原料用酯化合物組成物
WO2025028611A1 (ja) エポキシ樹脂用硬化剤、エポキシ樹脂組成物、硬化物、封止材及び接着剤
JPH10139853A (ja) シリコン変性エポキシ樹脂、及びエポキシ樹脂組成物及びその硬化物
JPH09272729A (ja) エポキシ樹脂、エポキシ樹脂組成物及びその硬化物

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20221216

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20240110

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20240306

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240509

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20240703

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240829

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20241111

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20241211

R150 Certificate of patent or registration of utility model

Ref document number: 7606802

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150