KR20250076526A - 수지 조성물, 경화물 및 유기 el 표시 장치 - Google Patents

수지 조성물, 경화물 및 유기 el 표시 장치 Download PDF

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Publication number
KR20250076526A
KR20250076526A KR1020257008311A KR20257008311A KR20250076526A KR 20250076526 A KR20250076526 A KR 20250076526A KR 1020257008311 A KR1020257008311 A KR 1020257008311A KR 20257008311 A KR20257008311 A KR 20257008311A KR 20250076526 A KR20250076526 A KR 20250076526A
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South Korea
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formula
resin composition
component
mol
residue
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Pending
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KR1020257008311A
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English (en)
Korean (ko)
Inventor
오사무 바바
가즈토 미요시
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도레이 카부시키가이샤
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Publication of KR20250076526A publication Critical patent/KR20250076526A/ko
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0395—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having a backbone with alicyclic moieties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/22—Polybenzoxazoles
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/22—Compounds containing nitrogen bound to another nitrogen atom
    • C08K5/23—Azo-compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces
    • H05B33/22—Light sources with substantially two-dimensional [2D] radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
KR1020257008311A 2022-09-27 2023-09-19 수지 조성물, 경화물 및 유기 el 표시 장치 Pending KR20250076526A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022153266 2022-09-27
JPJP-P-2022-153266 2022-09-27
PCT/JP2023/033868 WO2024070802A1 (ja) 2022-09-27 2023-09-19 樹脂組成物、硬化物および有機ｅｌ表示装置

Publications (1)

Publication Number Publication Date
KR20250076526A true KR20250076526A (ko) 2025-05-29

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Family Applications (1)

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KR1020257008311A Pending KR20250076526A (ko) 2022-09-27 2023-09-19 수지 조성물, 경화물 및 유기 el 표시 장치

Country Status (4)

Country Link
JP (1) JPWO2024070802A1 (https=)
KR (1) KR20250076526A (https=)
CN (1) CN119768471A (https=)
WO (1) WO2024070802A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001089658A (ja) 1999-09-21 2001-04-03 Toray Ind Inc 感光性ポリイミド前駆体組成物
JP2002091343A (ja) 2000-06-28 2002-03-27 Toray Ind Inc 表示装置
JP2002116715A (ja) 2000-06-28 2002-04-19 Toray Ind Inc 表示装置
WO2020095693A1 (ja) 2018-11-09 2020-05-14 東レ株式会社 ポリイミド前駆体、ポリイミド、ポリイミド樹脂膜、およびフレキシブルデバイス
WO2020121949A1 (ja) 2018-12-13 2020-06-18 三菱瓦斯化学株式会社 ポリイミド樹脂組成物及びポリイミドフィルム
WO2022045737A1 (ko) 2020-08-24 2022-03-03 주식회사 동진쎄미켐 포지티브형 감광성 수지 조성물

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080030671A (ko) * 2005-07-18 2008-04-04 아크론 폴리머 시스템즈 Ｌｃｄ의 음성 복굴절 필름용 폴리(아릴에테르이미드)
JP5212692B6 (ja) * 2006-11-13 2018-06-27 東レ・ファインケミカル株式会社 ２，２’−ビス（トリフルオロメチル）−４，４’−ジアミノビフェニルの製造方法
JP5381491B2 (ja) * 2009-08-19 2014-01-08 東レ株式会社 樹脂およびポジ型感光性樹脂組成物
JP2011202059A (ja) * 2010-03-26 2011-10-13 Toray Ind Inc 樹脂およびポジ型感光性樹脂組成物
KR101626587B1 (ko) * 2014-07-02 2016-06-02 주식회사 이녹스 에스테르기를 포함하는 폴리아믹산, 이의 제조방법 및 이를 포함하여 경화된 폴리이미드를 포함하는 폴리이미드 필름
CN106515130B (zh) * 2016-12-27 2019-04-30 广东生益科技股份有限公司 一种低吸水率的聚酰亚胺及其制备的无胶板材，以及该无胶板材的制备方法
CN112940316B (zh) * 2021-02-19 2022-07-29 上海八亿时空先进材料有限公司 一种聚酰亚胺薄膜及其制备方法与应用

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001089658A (ja) 1999-09-21 2001-04-03 Toray Ind Inc 感光性ポリイミド前駆体組成物
JP2002091343A (ja) 2000-06-28 2002-03-27 Toray Ind Inc 表示装置
JP2002116715A (ja) 2000-06-28 2002-04-19 Toray Ind Inc 表示装置
WO2020095693A1 (ja) 2018-11-09 2020-05-14 東レ株式会社 ポリイミド前駆体、ポリイミド、ポリイミド樹脂膜、およびフレキシブルデバイス
WO2020121949A1 (ja) 2018-12-13 2020-06-18 三菱瓦斯化学株式会社 ポリイミド樹脂組成物及びポリイミドフィルム
WO2022045737A1 (ko) 2020-08-24 2022-03-03 주식회사 동진쎄미켐 포지티브형 감광성 수지 조성물

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CN119768471A (zh) 2025-04-04
WO2024070802A1 (ja) 2024-04-04
JPWO2024070802A1 (https=) 2024-04-04

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Patent event date: 20250313

Patent event code: PA01051R01D

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