JPWO2024070802A1 - - Google Patents
Info
- Publication number
- JPWO2024070802A1 JPWO2024070802A1 JP2023560968A JP2023560968A JPWO2024070802A1 JP WO2024070802 A1 JPWO2024070802 A1 JP WO2024070802A1 JP 2023560968 A JP2023560968 A JP 2023560968A JP 2023560968 A JP2023560968 A JP 2023560968A JP WO2024070802 A1 JPWO2024070802 A1 JP WO2024070802A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0395—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having a backbone with alicyclic moieties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/22—Polybenzoxazoles
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/22—Compounds containing nitrogen bound to another nitrogen atom
- C08K5/23—Azo-compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces
- H05B33/22—Light sources with substantially two-dimensional [2D] radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022153266 | 2022-09-27 | ||
| PCT/JP2023/033868 WO2024070802A1 (ja) | 2022-09-27 | 2023-09-19 | 樹脂組成物、硬化物および有機el表示装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024070802A1 true JPWO2024070802A1 (https=) | 2024-04-04 |
Family
ID=90477550
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023560968A Pending JPWO2024070802A1 (https=) | 2022-09-27 | 2023-09-19 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2024070802A1 (https=) |
| KR (1) | KR20250076526A (https=) |
| CN (1) | CN119768471A (https=) |
| WO (1) | WO2024070802A1 (https=) |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001089658A (ja) | 1999-09-21 | 2001-04-03 | Toray Ind Inc | 感光性ポリイミド前駆体組成物 |
| JP4982928B2 (ja) | 2000-06-28 | 2012-07-25 | 東レ株式会社 | 表示装置 |
| JP4982927B2 (ja) | 2000-06-28 | 2012-07-25 | 東レ株式会社 | 表示装置 |
| KR20080030671A (ko) * | 2005-07-18 | 2008-04-04 | 아크론 폴리머 시스템즈 | Lcd의 음성 복굴절 필름용 폴리(아릴에테르이미드) |
| JP5212692B6 (ja) * | 2006-11-13 | 2018-06-27 | 東レ・ファインケミカル株式会社 | 2,2’−ビス(トリフルオロメチル)−4,4’−ジアミノビフェニルの製造方法 |
| JP5381491B2 (ja) * | 2009-08-19 | 2014-01-08 | 東レ株式会社 | 樹脂およびポジ型感光性樹脂組成物 |
| JP2011202059A (ja) * | 2010-03-26 | 2011-10-13 | Toray Ind Inc | 樹脂およびポジ型感光性樹脂組成物 |
| KR101626587B1 (ko) * | 2014-07-02 | 2016-06-02 | 주식회사 이녹스 | 에스테르기를 포함하는 폴리아믹산, 이의 제조방법 및 이를 포함하여 경화된 폴리이미드를 포함하는 폴리이미드 필름 |
| CN106515130B (zh) * | 2016-12-27 | 2019-04-30 | 广东生益科技股份有限公司 | 一种低吸水率的聚酰亚胺及其制备的无胶板材,以及该无胶板材的制备方法 |
| KR20210088551A (ko) | 2018-11-09 | 2021-07-14 | 도레이 카부시키가이샤 | 폴리이미드 전구체, 폴리이미드, 폴리이미드 수지막 및 플렉시블 디바이스 |
| JP7392657B2 (ja) | 2018-12-13 | 2023-12-06 | 三菱瓦斯化学株式会社 | ポリイミド樹脂組成物及びポリイミドフィルム |
| KR20220025694A (ko) | 2020-08-24 | 2022-03-03 | 주식회사 동진쎄미켐 | 포지티브형 감광성 수지 조성물 |
| CN112940316B (zh) * | 2021-02-19 | 2022-07-29 | 上海八亿时空先进材料有限公司 | 一种聚酰亚胺薄膜及其制备方法与应用 |
-
2023
- 2023-09-19 JP JP2023560968A patent/JPWO2024070802A1/ja active Pending
- 2023-09-19 CN CN202380061426.5A patent/CN119768471A/zh active Pending
- 2023-09-19 KR KR1020257008311A patent/KR20250076526A/ko active Pending
- 2023-09-19 WO PCT/JP2023/033868 patent/WO2024070802A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| CN119768471A (zh) | 2025-04-04 |
| WO2024070802A1 (ja) | 2024-04-04 |
| KR20250076526A (ko) | 2025-05-29 |
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