JPWO2024070802A1 - - Google Patents

Info

Publication number
JPWO2024070802A1
JPWO2024070802A1 JP2023560968A JP2023560968A JPWO2024070802A1 JP WO2024070802 A1 JPWO2024070802 A1 JP WO2024070802A1 JP 2023560968 A JP2023560968 A JP 2023560968A JP 2023560968 A JP2023560968 A JP 2023560968A JP WO2024070802 A1 JPWO2024070802 A1 JP WO2024070802A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023560968A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024070802A1 publication Critical patent/JPWO2024070802A1/ja
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0395Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having a backbone with alicyclic moieties
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/22Polybenzoxazoles
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/22Compounds containing nitrogen bound to another nitrogen atom
    • C08K5/23Azo-compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/022Quinonediazides
    • G03F7/023Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/12Light sources with substantially two-dimensional [2D] radiating surfaces
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/12Light sources with substantially two-dimensional [2D] radiating surfaces
    • H05B33/22Light sources with substantially two-dimensional [2D] radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/10OLEDs or polymer light-emitting diodes [PLED]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
JP2023560968A 2022-09-27 2023-09-19 Pending JPWO2024070802A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022153266 2022-09-27
PCT/JP2023/033868 WO2024070802A1 (ja) 2022-09-27 2023-09-19 樹脂組成物、硬化物および有機el表示装置

Publications (1)

Publication Number Publication Date
JPWO2024070802A1 true JPWO2024070802A1 (https=) 2024-04-04

Family

ID=90477550

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023560968A Pending JPWO2024070802A1 (https=) 2022-09-27 2023-09-19

Country Status (4)

Country Link
JP (1) JPWO2024070802A1 (https=)
KR (1) KR20250076526A (https=)
CN (1) CN119768471A (https=)
WO (1) WO2024070802A1 (https=)

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001089658A (ja) 1999-09-21 2001-04-03 Toray Ind Inc 感光性ポリイミド前駆体組成物
JP4982928B2 (ja) 2000-06-28 2012-07-25 東レ株式会社 表示装置
JP4982927B2 (ja) 2000-06-28 2012-07-25 東レ株式会社 表示装置
KR20080030671A (ko) * 2005-07-18 2008-04-04 아크론 폴리머 시스템즈 Lcd의 음성 복굴절 필름용 폴리(아릴에테르이미드)
JP5212692B6 (ja) * 2006-11-13 2018-06-27 東レ・ファインケミカル株式会社 2,2’−ビス(トリフルオロメチル)−4,4’−ジアミノビフェニルの製造方法
JP5381491B2 (ja) * 2009-08-19 2014-01-08 東レ株式会社 樹脂およびポジ型感光性樹脂組成物
JP2011202059A (ja) * 2010-03-26 2011-10-13 Toray Ind Inc 樹脂およびポジ型感光性樹脂組成物
KR101626587B1 (ko) * 2014-07-02 2016-06-02 주식회사 이녹스 에스테르기를 포함하는 폴리아믹산, 이의 제조방법 및 이를 포함하여 경화된 폴리이미드를 포함하는 폴리이미드 필름
CN106515130B (zh) * 2016-12-27 2019-04-30 广东生益科技股份有限公司 一种低吸水率的聚酰亚胺及其制备的无胶板材,以及该无胶板材的制备方法
KR20210088551A (ko) 2018-11-09 2021-07-14 도레이 카부시키가이샤 폴리이미드 전구체, 폴리이미드, 폴리이미드 수지막 및 플렉시블 디바이스
JP7392657B2 (ja) 2018-12-13 2023-12-06 三菱瓦斯化学株式会社 ポリイミド樹脂組成物及びポリイミドフィルム
KR20220025694A (ko) 2020-08-24 2022-03-03 주식회사 동진쎄미켐 포지티브형 감광성 수지 조성물
CN112940316B (zh) * 2021-02-19 2022-07-29 上海八亿时空先进材料有限公司 一种聚酰亚胺薄膜及其制备方法与应用

Also Published As

Publication number Publication date
CN119768471A (zh) 2025-04-04
WO2024070802A1 (ja) 2024-04-04
KR20250076526A (ko) 2025-05-29

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