KR20240136993A - 열전도성 부가경화형 실리콘 조성물, 및 그의 경화물 - Google Patents

열전도성 부가경화형 실리콘 조성물, 및 그의 경화물 Download PDF

Info

Publication number
KR20240136993A
KR20240136993A KR1020247025133A KR20247025133A KR20240136993A KR 20240136993 A KR20240136993 A KR 20240136993A KR 1020247025133 A KR1020247025133 A KR 1020247025133A KR 20247025133 A KR20247025133 A KR 20247025133A KR 20240136993 A KR20240136993 A KR 20240136993A
Authority
KR
South Korea
Prior art keywords
group
curable silicone
thermally conductive
conductive addition
silicone composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247025133A
Other languages
English (en)
Korean (ko)
Inventor
케이타 키타자와
마사유키 이케노
코지 하세가와
시오리 노나카
Original Assignee
신에쓰 가가꾸 고교 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 신에쓰 가가꾸 고교 가부시끼가이샤 filed Critical 신에쓰 가가꾸 고교 가부시끼가이샤
Publication of KR20240136993A publication Critical patent/KR20240136993A/ko
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C08G77/08—Preparatory processes characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C08K5/136—Phenols containing halogens
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5425—Silicon-containing compounds containing oxygen containing at least one C=C bond

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020247025133A 2022-01-31 2023-01-12 열전도성 부가경화형 실리콘 조성물, 및 그의 경화물 Pending KR20240136993A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022012772A JP7644726B2 (ja) 2022-01-31 2022-01-31 熱伝導性付加硬化型シリコーン組成物、及びその硬化物
JPJP-P-2022-012772 2022-01-31
PCT/JP2023/000506 WO2023145438A1 (ja) 2022-01-31 2023-01-12 熱伝導性付加硬化型シリコーン組成物、及びその硬化物

Publications (1)

Publication Number Publication Date
KR20240136993A true KR20240136993A (ko) 2024-09-19

Family

ID=87471228

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247025133A Pending KR20240136993A (ko) 2022-01-31 2023-01-12 열전도성 부가경화형 실리콘 조성물, 및 그의 경화물

Country Status (7)

Country Link
US (1) US20250171673A1 (enExample)
EP (1) EP4474428A4 (enExample)
JP (1) JP7644726B2 (enExample)
KR (1) KR20240136993A (enExample)
CN (1) CN118591594A (enExample)
TW (1) TW202342693A (enExample)
WO (1) WO2023145438A1 (enExample)

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002327116A (ja) 2001-05-01 2002-11-15 Shin Etsu Chem Co Ltd 熱伝導性シリコーン組成物及び半導体装置
JP2004130646A (ja) 2002-10-10 2004-04-30 Shin Etsu Chem Co Ltd 熱伝導性シート
JP2007177001A (ja) 2005-12-27 2007-07-12 Shin Etsu Chem Co Ltd 熱伝導性シリコーングリース組成物
JP2008031336A (ja) 2006-07-31 2008-02-14 Shin Etsu Chem Co Ltd 放熱用シリコーングリース組成物及びその製造方法
JP2008260798A (ja) 2007-04-10 2008-10-30 Shin Etsu Chem Co Ltd 熱伝導性硬化物及びその製造方法
JP2009209230A (ja) 2008-03-03 2009-09-17 Shin Etsu Chem Co Ltd 熱伝導性シリコーングリース組成物
JP2009209165A (ja) 2008-02-29 2009-09-17 Shin Etsu Chem Co Ltd 熱伝導性硬化物及びその製造方法
JP2009234112A (ja) 2008-03-27 2009-10-15 Shin Etsu Chem Co Ltd 熱伝導性積層体およびその製造方法
JP2010095730A (ja) 2010-01-18 2010-04-30 Shin-Etsu Chemical Co Ltd 硬化性オルガノポリシロキサン組成物および半導体装置
JP2016053140A (ja) 2014-09-04 2016-04-14 信越化学工業株式会社 シリコーン組成物

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2868986B2 (ja) * 1993-10-06 1999-03-10 東レ・ダウコーニング・シリコーン株式会社 導電性シリコーンゴム組成物
JP4676671B2 (ja) 2002-11-21 2011-04-27 東レ・ダウコーニング株式会社 熱伝導性シリコーンエラストマー組成物
JP5943485B2 (ja) * 2013-05-09 2016-07-05 信越化学工業株式会社 シリコーンエラストマー粒子および該シリコーンエラストマー粒子を含む水分散液
JP6194861B2 (ja) * 2014-07-28 2017-09-13 信越化学工業株式会社 熱伝導性シリコーン組成物及び熱伝導性シリコーン成型物
CN109679352A (zh) 2018-12-28 2019-04-26 深圳德邦界面材料有限公司 一种导电泡棉及其制备方法
JP7262417B2 (ja) * 2020-04-27 2023-04-21 デクセリアルズ株式会社 熱伝導性樹脂組成物及びこれを用いた熱伝導性シート
JP7355708B2 (ja) * 2020-05-25 2023-10-03 信越化学工業株式会社 熱伝導性付加硬化型シリコーン組成物
US12215243B2 (en) 2020-11-20 2025-02-04 Shin-Etsu Chemical Co., Ltd. Phenol compound, conductive paste composition, method for producing conductive paste composition, conductive wire, and method for producing conductive wire

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002327116A (ja) 2001-05-01 2002-11-15 Shin Etsu Chem Co Ltd 熱伝導性シリコーン組成物及び半導体装置
JP2004130646A (ja) 2002-10-10 2004-04-30 Shin Etsu Chem Co Ltd 熱伝導性シート
JP2007177001A (ja) 2005-12-27 2007-07-12 Shin Etsu Chem Co Ltd 熱伝導性シリコーングリース組成物
JP2008031336A (ja) 2006-07-31 2008-02-14 Shin Etsu Chem Co Ltd 放熱用シリコーングリース組成物及びその製造方法
JP2008260798A (ja) 2007-04-10 2008-10-30 Shin Etsu Chem Co Ltd 熱伝導性硬化物及びその製造方法
JP2009209165A (ja) 2008-02-29 2009-09-17 Shin Etsu Chem Co Ltd 熱伝導性硬化物及びその製造方法
JP2009209230A (ja) 2008-03-03 2009-09-17 Shin Etsu Chem Co Ltd 熱伝導性シリコーングリース組成物
JP2009234112A (ja) 2008-03-27 2009-10-15 Shin Etsu Chem Co Ltd 熱伝導性積層体およびその製造方法
JP2010095730A (ja) 2010-01-18 2010-04-30 Shin-Etsu Chemical Co Ltd 硬化性オルガノポリシロキサン組成物および半導体装置
JP2016053140A (ja) 2014-09-04 2016-04-14 信越化学工業株式会社 シリコーン組成物

Also Published As

Publication number Publication date
CN118591594A (zh) 2024-09-03
US20250171673A1 (en) 2025-05-29
TW202342693A (zh) 2023-11-01
EP4474428A4 (en) 2026-01-28
JP2023111110A (ja) 2023-08-10
JP7644726B2 (ja) 2025-03-12
WO2023145438A1 (ja) 2023-08-03
EP4474428A1 (en) 2024-12-11

Similar Documents

Publication Publication Date Title
KR102683945B1 (ko) 실리콘 조성물
KR102202959B1 (ko) 실리콘조성물 및 열전도성 실리콘조성물의 제조방법
KR20120051585A (ko) 열전도성 실리콘 그리스 조성물
TWI679246B (zh) 一液附加硬化型矽氧組成物、其保存方法及硬化方法
KR102831956B1 (ko) 부가 경화형 실리콘 조성물 및 그 제조 방법
KR102861271B1 (ko) 열전도성 실리콘 조성물 및 그 제조 방법
EP4169978A1 (en) Silicone composition and thermally conductive silicone cured product having high thermal conductivity
KR20150009944A (ko) 열전도성 실리콘 그리스 조성물
JP7325324B2 (ja) 熱伝導性シリコーン組成物
KR102806614B1 (ko) 실리콘 조성물
JP7355708B2 (ja) 熱伝導性付加硬化型シリコーン組成物
JP2015004043A (ja) 熱伝導性シリコーン組成物
KR20230015340A (ko) 고열전도성 실리콘 조성물
WO2020031669A1 (ja) シリコーン組成物及びその製造方法
JP7514804B2 (ja) 熱伝導性シリコーン組成物及び熱伝導性シリコーン硬化物
JP7335678B2 (ja) 熱伝導性付加硬化型シリコーン組成物及びその硬化物
KR102937544B1 (ko) 열전도성 2액부가경화형 실리콘 조성물 및 그의 제조방법
CN117881746A (zh) 导热有机硅橡胶组合物
KR20240136993A (ko) 열전도성 부가경화형 실리콘 조성물, 및 그의 경화물
KR20260022317A (ko) 2환식 아세틸렌알코올 화합물, 부가경화형 실리콘 조성물, 및 열전도성 부가경화형 실리콘 조성물
JP2025092146A (ja) 熱伝導性付加硬化型シリコーン組成物、及び熱伝導性付加硬化型シリコーン組成物の製造方法
JP2022184636A (ja) 熱伝導性シリコーン組成物及びその硬化物

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20240724

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application