JP7644726B2 - 熱伝導性付加硬化型シリコーン組成物、及びその硬化物 - Google Patents

熱伝導性付加硬化型シリコーン組成物、及びその硬化物 Download PDF

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JP7644726B2
JP7644726B2 JP2022012772A JP2022012772A JP7644726B2 JP 7644726 B2 JP7644726 B2 JP 7644726B2 JP 2022012772 A JP2022012772 A JP 2022012772A JP 2022012772 A JP2022012772 A JP 2022012772A JP 7644726 B2 JP7644726 B2 JP 7644726B2
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thermally conductive
curable silicone
conductive addition
group
cured product
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Japanese (ja)
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JP2023111110A5 (enExample
JP2023111110A (ja
Inventor
啓太 北沢
正行 池野
幸士 長谷川
汐里 野中
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Shin Etsu Chemical Co Ltd
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Shin Etsu Chemical Co Ltd
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Priority to JP2022012772A priority Critical patent/JP7644726B2/ja
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Priority to KR1020247025133A priority patent/KR20240136993A/ko
Priority to CN202380017826.6A priority patent/CN118591594A/zh
Priority to EP23746653.7A priority patent/EP4474428A4/en
Priority to US18/727,511 priority patent/US20250171673A1/en
Priority to PCT/JP2023/000506 priority patent/WO2023145438A1/ja
Priority to TW112101678A priority patent/TW202342693A/zh
Publication of JP2023111110A publication Critical patent/JP2023111110A/ja
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C08G77/08—Preparatory processes characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C08K5/136—Phenols containing halogens
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5425—Silicon-containing compounds containing oxygen containing at least one C=C bond

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2022012772A 2022-01-31 2022-01-31 熱伝導性付加硬化型シリコーン組成物、及びその硬化物 Active JP7644726B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2022012772A JP7644726B2 (ja) 2022-01-31 2022-01-31 熱伝導性付加硬化型シリコーン組成物、及びその硬化物
CN202380017826.6A CN118591594A (zh) 2022-01-31 2023-01-12 导热性加成固化型有机硅组合物及其固化物
EP23746653.7A EP4474428A4 (en) 2022-01-31 2023-01-12 Composition of silicone hardenable by the addition of a heat-conducting agent and the hardened product thereof
US18/727,511 US20250171673A1 (en) 2022-01-31 2023-01-12 Thermal conductive addition-curable silicone composition and cured product thereof
KR1020247025133A KR20240136993A (ko) 2022-01-31 2023-01-12 열전도성 부가경화형 실리콘 조성물, 및 그의 경화물
PCT/JP2023/000506 WO2023145438A1 (ja) 2022-01-31 2023-01-12 熱伝導性付加硬化型シリコーン組成物、及びその硬化物
TW112101678A TW202342693A (zh) 2022-01-31 2023-01-16 導熱性加成硬化型矽氧組成物、及其硬化物

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JP2022012772A JP7644726B2 (ja) 2022-01-31 2022-01-31 熱伝導性付加硬化型シリコーン組成物、及びその硬化物

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JP2023111110A JP2023111110A (ja) 2023-08-10
JP2023111110A5 JP2023111110A5 (enExample) 2024-07-10
JP7644726B2 true JP7644726B2 (ja) 2025-03-12

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US (1) US20250171673A1 (enExample)
EP (1) EP4474428A4 (enExample)
JP (1) JP7644726B2 (enExample)
KR (1) KR20240136993A (enExample)
CN (1) CN118591594A (enExample)
TW (1) TW202342693A (enExample)
WO (1) WO2023145438A1 (enExample)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004168920A (ja) 2002-11-21 2004-06-17 Dow Corning Toray Silicone Co Ltd 熱伝導性シリコーンエラストマー組成物
CN109679352A (zh) 2018-12-28 2019-04-26 深圳德邦界面材料有限公司 一种导电泡棉及其制备方法
WO2022107511A1 (ja) 2020-11-20 2022-05-27 信越化学工業株式会社 フェノール化合物、導電性ペースト組成物、導電性ペースト組成物の製造方法、導電配線及びその製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2868986B2 (ja) * 1993-10-06 1999-03-10 東レ・ダウコーニング・シリコーン株式会社 導電性シリコーンゴム組成物
JP3580366B2 (ja) 2001-05-01 2004-10-20 信越化学工業株式会社 熱伝導性シリコーン組成物及び半導体装置
JP3952184B2 (ja) 2002-10-10 2007-08-01 信越化学工業株式会社 熱伝導性シート
JP4933094B2 (ja) 2005-12-27 2012-05-16 信越化学工業株式会社 熱伝導性シリコーングリース組成物
JP4917380B2 (ja) 2006-07-31 2012-04-18 信越化学工業株式会社 放熱用シリコーングリース組成物及びその製造方法
JP5283346B2 (ja) 2007-04-10 2013-09-04 信越化学工業株式会社 熱伝導性硬化物及びその製造方法
JP5233325B2 (ja) 2008-02-29 2013-07-10 信越化学工業株式会社 熱伝導性硬化物及びその製造方法
JP4656340B2 (ja) 2008-03-03 2011-03-23 信越化学工業株式会社 熱伝導性シリコーングリース組成物
JP4572243B2 (ja) 2008-03-27 2010-11-04 信越化学工業株式会社 熱伝導性積層体およびその製造方法
JP4913874B2 (ja) 2010-01-18 2012-04-11 信越化学工業株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP5943485B2 (ja) * 2013-05-09 2016-07-05 信越化学工業株式会社 シリコーンエラストマー粒子および該シリコーンエラストマー粒子を含む水分散液
JP6194861B2 (ja) * 2014-07-28 2017-09-13 信越化学工業株式会社 熱伝導性シリコーン組成物及び熱伝導性シリコーン成型物
JP6149831B2 (ja) 2014-09-04 2017-06-21 信越化学工業株式会社 シリコーン組成物
JP7262417B2 (ja) * 2020-04-27 2023-04-21 デクセリアルズ株式会社 熱伝導性樹脂組成物及びこれを用いた熱伝導性シート
JP7355708B2 (ja) * 2020-05-25 2023-10-03 信越化学工業株式会社 熱伝導性付加硬化型シリコーン組成物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004168920A (ja) 2002-11-21 2004-06-17 Dow Corning Toray Silicone Co Ltd 熱伝導性シリコーンエラストマー組成物
CN109679352A (zh) 2018-12-28 2019-04-26 深圳德邦界面材料有限公司 一种导电泡棉及其制备方法
WO2022107511A1 (ja) 2020-11-20 2022-05-27 信越化学工業株式会社 フェノール化合物、導電性ペースト組成物、導電性ペースト組成物の製造方法、導電配線及びその製造方法

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Publication number Publication date
CN118591594A (zh) 2024-09-03
US20250171673A1 (en) 2025-05-29
TW202342693A (zh) 2023-11-01
EP4474428A4 (en) 2026-01-28
JP2023111110A (ja) 2023-08-10
WO2023145438A1 (ja) 2023-08-03
EP4474428A1 (en) 2024-12-11
KR20240136993A (ko) 2024-09-19

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