CN109679352A - 一种导电泡棉及其制备方法 - Google Patents
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Abstract
本发明属于导电材料技术领域,尤其涉及一种导电泡棉及其制备方法。本发明的导电泡棉是由有机硅树脂经过加成反应在室温下发泡固化的一种泡棉,具有质地柔软、泡孔均匀、压缩形变性好、各向同性导电性能佳等特点,阻燃效果能够达到UL‑94VO级别,固化过程中没有副产物,不会污染环境。本发明的导电泡棉在应用时,使用点胶机直接涂覆在部件表面,室温下发泡成型,能很好的粘接在器件表面。该导电泡棉制作和使用工艺简单,原料价格低廉,来源稳定,安装方便,能够大大节约劳动成本。
Description
技术领域
本发明属于导电材料技术领域,尤其涉及一种导电泡棉及其制备方法。
背景技术
目前,市场上主要用于微电子装配的导电材料有常规的导电泡棉和导电胶两种材料。常规的导电泡棉是在阻燃海绵上包裹导电布或者能导电的金属薄膜,使其具有良好的表面导电性,达到导电的目的,由于自身不具有粘接性,在使用时需要用双面胶带将其固定在器件上面;导电胶是一种固化或干燥后具有一定导电性能的胶粘剂,它通常以基体树脂和导电填料即导电粒子为主要组成成分,通过基体树脂的粘接作用把导电粒子结合在一起,形成导电通路,实现被粘材料的导电连接,由于导电胶自身的特性,为了降低其粘度,生产时需要添加一部分可挥发的稀释剂,在导电胶固化的过程中,稀释剂逐渐挥发掉,然而因为此类稀释剂的存在,导电胶在使用过程中不但会污染环境,还影响导电性和力学性能。
发明内容
本发明针对上述现有技术存在的不足,提供一种导电泡棉及其制备方法。
本发明解决上述技术问题的技术方案如下:一种导电泡棉,其组分按重量份数计包括:基础树脂A 5-25份、基础树脂B 10-30份、交联剂5-15份、补强剂3-10份、阻燃剂10-25份、抗老化剂0-0.4份、催化剂0.3-0.6份、抑制剂0.5-2份和导电粉体35-65份。
进一步,所述基础树脂A为粘度5000-100000cps的羟基硅油,羟基含量为0.3%-0.8%;
所述基础树脂B为粘度10000-700000cps的乙烯基硅油,乙烯基含量为0.08%-0.32%;
所述交联剂为粘度200-2000cps的含氢硅油,氢含量为0.18%-1.6%;
所述补强剂为气相白炭黑、沉淀白炭黑、纳米碳酸钙或MQ硅树脂中的一种或两种以上混合;
所述阻燃剂为三聚氰胺磷酸盐、聚多磷酸盐、三氧化二锑或氢氧化铝粉中的一种或两种以上,粒径为0.1-30μm;
所述抗老化剂为2,8-二叔丁基-4-甲基苯酚;
所述催化剂为铂金络合物,铂金含量为1000ppm-10000ppm;
所述抑制剂为炔基环己醇;
所述导电粉体为纯银导电粉、纯铜导电粉、纯镍导电粉、镍铜导电粉、银镍导电粉、复合导电云母粉、导电钛白粉、导电钛酸钾、导电硫酸钡、导电石墨粉、导电炭黑、导电碳纤维、银包铜粉或导电聚苯胺中的一种或两种以上。
本发明的第二个目的在于提供上述导电泡棉的制备方法:将基础树脂A、基础树脂B、交联剂、补强剂、阻燃剂、抗老化剂、抑制剂、导电粉体依次加入到搅拌釜中搅拌100-150min,转速为35-65rpm,控制温度为25℃;然后加入催化剂,搅拌10-30min,转速为35-40rpm;抽真空脱去气泡,将物料用灌装机压入300cc的包装管中封口保存,制得泡棉原材料,放置在-4℃环境中保存;成型时,使用点胶机将泡棉原材料点在器件表面,放置在10-25℃环境状态下15min,物料逐渐发泡成型,形成泡孔细小均匀的导电泡棉。
本发明的特点和有益效果在于:
本发明的导电泡棉是由有机硅树脂经过加成反应在室温下发泡固化的一种泡棉,具有质地柔软、泡孔均匀、压缩形变性好、各向同性导电性能佳等特点,阻燃效果能够达到UL-94VO级别,固化过程中没有副产物,不会污染环境。本发明的导电泡棉在应用时,使用点胶机直接涂覆在部件表面,室温下发泡成型,能很好的粘接在器件表面。该导电泡棉制作和使用工艺简单,原料价格低廉,来源稳定,安装方便,能够大大节约劳动成本。
具体实施方式
以下结合实例对本发明的原理和特征进行描述,所举实例只用于解释本发明,并非用于限定本发明的范围。
实施例1
一种导电泡棉,其组分按重量份数计包括:羟基含量为0.5%的羟基硅油(粘度为20000cps)30g、乙烯基含量为0.08%的乙烯基硅油(粘度为50000cps)90g、含氢量为1.6%的含氢硅油(粘度为2000cps)48g、粒径为20μm的气相白炭黑30g、阻燃剂三聚氰胺磷酸盐90g、抗老化剂2,8-二叔丁基-4-甲基苯酚2.0g、催化剂铂金络合物3.0g、抑制剂炔基环己醇6g和银镍导电粉300g。
上述导电泡棉的制备方法:将羟基含量为0.5%的羟基硅油(粘度为20000cps)30g、乙烯基含量为0.08%的乙烯基硅油(粘度为50000cps)90g、含氢量为1.6%的含氢硅油(粘度为2000cps)48g、粒径为20μm的气相白炭黑30g、阻燃剂三聚氰胺磷酸盐90g、抗老化剂2,8-二叔丁基-4-甲基苯酚2.0g、抑制剂炔基环己醇6g和银镍导电粉300g依次加入到搅拌釜中搅拌120min,转速为35-65rpm,控制温度为25℃;然后加入催化剂铂金络合物3.0g,搅拌30min,转速为35-40rpm;抽真空脱去气泡,将物料用灌装机压入300cc的包装管中封口保存,制得泡棉原材料,放置在-4℃环境中保存;成型时,使用点胶机将泡棉原材料点在器件表面,放置在25℃环境状态下15min,物料逐渐发泡成型,形成泡孔细小均匀的导电泡棉。
将所得导电泡棉进行性能测试,见表1。
实施例2
一种导电泡棉,其组分按重量份数计包括:羟基含量为0.8%的羟基硅油(粘度为20000cps)72g、乙烯基含量为0.32%的乙烯基硅油(粘度为100000cps)48g、含氢量为1.6%的含氢硅油(粘度为2000cps)60g、粒径为20μm的气相白炭黑30g、阻燃剂三聚氰胺磷酸盐60g、阻燃剂三氧化二锑30g、催化剂铂金络合物1.2g、抑制剂炔基环己醇6g、粒径为2μm的银包铜粉150g和粒径为0.5μm的导电炭黑10g。
上述导电泡棉的制备方法:将羟基含量为0.8%的羟基硅油(粘度为20000cps)72g、乙烯基含量为0.32%的乙烯基硅油(粘度为100000cps)48g、含氢量为1.6%的含氢硅油(粘度为2000cps)60g、粒径为20μm的气相白炭黑30g、阻燃剂三聚氰胺磷酸盐60g、阻燃剂三氧化二锑30g、抑制剂炔基环己醇6g、粒径为2μm的银包铜粉150g和粒径为0.5μm的导电炭黑10g依次加入到搅拌釜中搅拌120min,转速为35-65rpm,控制温度为25℃;然后加入催化剂铂金络合物1.2g,搅拌30min,转速为35-40rpm;抽真空脱去气泡,将物料用灌装机压入300cc的包装管中封口保存,制得泡棉原材料,放置在-4℃环境中保存;成型时,使用点胶机将泡棉原材料点在器件表面,放置在25℃环境状态下15min,物料逐渐发泡成型,形成泡孔细小均匀的导电泡棉。
将所得导电泡棉进行性能测试,见表1。
表1性能测试对比
性能指标﹨样品 | 实施例1 | 实施例2 | 常规导电泡棉 | 导电胶 |
表面电阻率Ω/cm<sup>2</sup> | 0.08 | 0.085 | 0.07 | / |
体积电阻率Ω.cm | 0.007 | 0.008 | / | 0.008 |
阻燃性UL-94 | V0 | V0 | HB | / |
通过表1可以看出,相比于常规导电泡棉和导电胶,本发明实施例1和实施例2制得的导电泡棉在阻燃性、导电性等性能方面具有明显地改善。
以上所述仅为本发明的较佳实施例,并不用以限制本发明,凡在本发明的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。
Claims (3)
1.一种导电泡棉,其特征在于,其组分按重量份数计包括:基础树脂A 5-25份、基础树脂B 10-30份、交联剂5-15份、补强剂3-10份、阻燃剂10-25份、抗老化剂0-0.4份、催化剂0.3-0.6份、抑制剂0.5-2份和导电粉体35-65份。
2.根据权利要求1所述的导电泡棉,其特征在于,所述基础树脂A为粘度5000-100000cps的羟基硅油,羟基含量为0.3%-0.8%;
所述基础树脂B为粘度10000-700000cps的乙烯基硅油,乙烯基含量为0.08%-0.32%;
所述交联剂为粘度200-2000cps的含氢硅油,氢含量为0.18%-1.6%;
所述补强剂为气相白炭黑、沉淀白炭黑、纳米碳酸钙或MQ硅树脂中的一种或两种以上混合;
所述阻燃剂为三聚氰胺磷酸盐、聚多磷酸盐、三氧化二锑或氢氧化铝粉中的一种或两种以上,粒径为0.1-30μm;
所述抗老化剂为2,8-二叔丁基-4-甲基苯酚;
所述催化剂为铂金络合物,铂金含量为1000ppm-10000ppm;
所述抑制剂为炔基环己醇;
所述导电粉体为纯银导电粉、纯铜导电粉、纯镍导电粉、镍铜导电粉、银镍导电粉、复合导电云母粉、导电钛白粉、导电钛酸钾、导电硫酸钡、导电石墨粉、导电炭黑、导电碳纤维、银包铜粉或导电聚苯胺中的一种或两种以上。
3.一种权利要求1所述导电泡棉的制备方法,其特征在于,将基础树脂A、基础树脂B、交联剂、补强剂、阻燃剂、抗老化剂、抑制剂、导电粉体依次加入到搅拌釜中搅拌100-150min,转速为35-65rpm,控制温度为25℃;然后加入催化剂,搅拌10-30min,转速为35-40rpm;抽真空脱去气泡,将物料用灌装机压入300cc的包装管中封口保存,制得泡棉原材料,放置在-4℃环境中保存;成型时,使用点胶机将泡棉原材料点在器件表面,放置在10-25℃环境状态下15min,物料逐渐发泡成型,形成泡孔细小均匀的导电泡棉。
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Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109651821A (zh) * | 2018-12-28 | 2019-04-19 | 深圳德邦界面材料有限公司 | 一种有机硅泡棉及其制备方法 |
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WO2023145438A1 (ja) * | 2022-01-31 | 2023-08-03 | 信越化学工業株式会社 | 熱伝導性付加硬化型シリコーン組成物、及びその硬化物 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007114529A1 (en) * | 2006-03-31 | 2007-10-11 | Korea Kumho Petrochemical Co., Ltd | Method for manufacturing expandable polystyrene particles with excellent thermal insulation capability |
CN101280111A (zh) * | 2007-03-01 | 2008-10-08 | 信越化学工业株式会社 | 硅橡胶海绵组合物 |
CN101479342A (zh) * | 2006-06-26 | 2009-07-08 | 陶氏康宁公司 | 硅橡胶弹性体的制备 |
CN102585738A (zh) * | 2012-02-20 | 2012-07-18 | 深圳德邦界面材料有限公司 | 一种高性能压敏导电胶水及其制备方法 |
CN102604392A (zh) * | 2012-02-20 | 2012-07-25 | 深圳德邦界面材料有限公司 | 一种高性能阻燃导电橡胶及其制备方法 |
CN103436023A (zh) * | 2013-08-31 | 2013-12-11 | 青岛承天伟业机械制造有限公司 | 一种新型导电橡胶 |
CN106633918A (zh) * | 2017-01-13 | 2017-05-10 | 山东船舶技术研究院 | 一种高强度高耐热阻燃硅橡胶材料及其制备方法 |
CN106832956A (zh) * | 2017-02-10 | 2017-06-13 | 深圳市森日有机硅材料股份有限公司 | 一种阻燃型室温固化发泡液体硅橡胶的制备方法 |
-
2018
- 2018-12-28 CN CN201811620085.8A patent/CN109679352A/zh active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007114529A1 (en) * | 2006-03-31 | 2007-10-11 | Korea Kumho Petrochemical Co., Ltd | Method for manufacturing expandable polystyrene particles with excellent thermal insulation capability |
CN101479342A (zh) * | 2006-06-26 | 2009-07-08 | 陶氏康宁公司 | 硅橡胶弹性体的制备 |
CN101280111A (zh) * | 2007-03-01 | 2008-10-08 | 信越化学工业株式会社 | 硅橡胶海绵组合物 |
CN102585738A (zh) * | 2012-02-20 | 2012-07-18 | 深圳德邦界面材料有限公司 | 一种高性能压敏导电胶水及其制备方法 |
CN102604392A (zh) * | 2012-02-20 | 2012-07-25 | 深圳德邦界面材料有限公司 | 一种高性能阻燃导电橡胶及其制备方法 |
CN103436023A (zh) * | 2013-08-31 | 2013-12-11 | 青岛承天伟业机械制造有限公司 | 一种新型导电橡胶 |
CN106633918A (zh) * | 2017-01-13 | 2017-05-10 | 山东船舶技术研究院 | 一种高强度高耐热阻燃硅橡胶材料及其制备方法 |
CN106832956A (zh) * | 2017-02-10 | 2017-06-13 | 深圳市森日有机硅材料股份有限公司 | 一种阻燃型室温固化发泡液体硅橡胶的制备方法 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109651821A (zh) * | 2018-12-28 | 2019-04-19 | 深圳德邦界面材料有限公司 | 一种有机硅泡棉及其制备方法 |
CN110606972A (zh) * | 2019-09-28 | 2019-12-24 | 苏州万合电子有限公司 | 一种导电泡棉制造工艺 |
CN111019356A (zh) * | 2019-12-20 | 2020-04-17 | 佛山国防科技工业技术成果产业化应用推广中心 | 压力敏感型多孔导电橡胶及其制备方法 |
CN111253715A (zh) * | 2020-02-17 | 2020-06-09 | 宁国市千洪电子有限公司 | 一种高弹性导电泡棉及其制备方法 |
CN111417295A (zh) * | 2020-03-06 | 2020-07-14 | 南昌欧菲生物识别技术有限公司 | 导电泡棉、超声波指纹模组、显示屏组件和电子设备 |
CN111592706A (zh) * | 2020-05-29 | 2020-08-28 | 深圳市长园特发科技有限公司 | 辐射交联聚乙烯泡棉及其制备方法和应用 |
WO2023145438A1 (ja) * | 2022-01-31 | 2023-08-03 | 信越化学工業株式会社 | 熱伝導性付加硬化型シリコーン組成物、及びその硬化物 |
CN115534456A (zh) * | 2022-09-16 | 2022-12-30 | 苏州旺顺源光电科技有限公司 | 一种阻燃型导电泡棉及其制备工艺 |
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