WO2015062115A1 - 一种热固性树脂组合物及其用途 - Google Patents
一种热固性树脂组合物及其用途 Download PDFInfo
- Publication number
- WO2015062115A1 WO2015062115A1 PCT/CN2013/086617 CN2013086617W WO2015062115A1 WO 2015062115 A1 WO2015062115 A1 WO 2015062115A1 CN 2013086617 W CN2013086617 W CN 2013086617W WO 2015062115 A1 WO2015062115 A1 WO 2015062115A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- thermosetting resin
- resin composition
- tungsten
- composition according
- total mass
- Prior art date
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 92
- 229920001187 thermosetting polymer Polymers 0.000 title claims abstract description 90
- 150000003658 tungsten compounds Chemical class 0.000 claims abstract description 48
- 239000000203 mixture Substances 0.000 claims abstract description 44
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 37
- 239000011256 inorganic filler Substances 0.000 claims abstract description 37
- 229920005989 resin Polymers 0.000 claims abstract description 28
- 239000011347 resin Substances 0.000 claims abstract description 28
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 9
- 239000000843 powder Substances 0.000 claims description 24
- 239000011521 glass Substances 0.000 claims description 18
- -1 tungsten dioctyldithiocarbamate Chemical compound 0.000 claims description 15
- 239000002245 particle Substances 0.000 claims description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 8
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 8
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims description 8
- 229910001593 boehmite Inorganic materials 0.000 claims description 8
- FAHBNUUHRFUEAI-UHFFFAOYSA-M hydroxidooxidoaluminium Chemical compound O[Al]=O FAHBNUUHRFUEAI-UHFFFAOYSA-M 0.000 claims description 8
- 239000002904 solvent Substances 0.000 claims description 8
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 8
- ITRNXVSDJBHYNJ-UHFFFAOYSA-N tungsten disulfide Chemical compound S=[W]=S ITRNXVSDJBHYNJ-UHFFFAOYSA-N 0.000 claims description 7
- 150000001412 amines Chemical class 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 6
- YXPHMGGSLJFAPL-UHFFFAOYSA-J tetrabromotungsten Chemical compound Br[W](Br)(Br)Br YXPHMGGSLJFAPL-UHFFFAOYSA-J 0.000 claims description 6
- PBYZMCDFOULPGH-UHFFFAOYSA-N tungstate Chemical compound [O-][W]([O-])(=O)=O PBYZMCDFOULPGH-UHFFFAOYSA-N 0.000 claims description 6
- YOUIDGQAIILFBW-UHFFFAOYSA-J Tungsten(IV) chloride Inorganic materials Cl[W](Cl)(Cl)Cl YOUIDGQAIILFBW-UHFFFAOYSA-J 0.000 claims description 5
- BGRYSGVIVVUJHH-UHFFFAOYSA-N prop-2-ynyl propanoate Chemical compound CCC(=O)OCC#C BGRYSGVIVVUJHH-UHFFFAOYSA-N 0.000 claims description 5
- 239000000377 silicon dioxide Substances 0.000 claims description 5
- 239000000454 talc Substances 0.000 claims description 5
- 229910052623 talc Inorganic materials 0.000 claims description 5
- 229910052721 tungsten Inorganic materials 0.000 claims description 5
- 239000010937 tungsten Substances 0.000 claims description 5
- 239000005995 Aluminium silicate Substances 0.000 claims description 4
- 229910052582 BN Inorganic materials 0.000 claims description 4
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 4
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 4
- 235000012211 aluminium silicate Nutrition 0.000 claims description 4
- 125000003118 aryl group Chemical group 0.000 claims description 4
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims description 4
- 229910002113 barium titanate Inorganic materials 0.000 claims description 4
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 4
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 claims description 4
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims description 4
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 4
- 239000000347 magnesium hydroxide Substances 0.000 claims description 4
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 4
- 239000010445 mica Substances 0.000 claims description 4
- 229910052618 mica group Inorganic materials 0.000 claims description 4
- 239000011701 zinc Substances 0.000 claims description 4
- 229910052725 zinc Inorganic materials 0.000 claims description 4
- 239000011787 zinc oxide Substances 0.000 claims description 4
- BNEMLSQAJOPTGK-UHFFFAOYSA-N zinc;dioxido(oxo)tin Chemical compound [Zn+2].[O-][Sn]([O-])=O BNEMLSQAJOPTGK-UHFFFAOYSA-N 0.000 claims description 4
- SDDGNMXIOGQCCH-UHFFFAOYSA-N 3-fluoro-n,n-dimethylaniline Chemical compound CN(C)C1=CC=CC(F)=C1 SDDGNMXIOGQCCH-UHFFFAOYSA-N 0.000 claims description 3
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910052791 calcium Inorganic materials 0.000 claims description 3
- 239000011575 calcium Substances 0.000 claims description 3
- DJZHPOJZOWHJPP-UHFFFAOYSA-N magnesium;dioxido(dioxo)tungsten Chemical compound [Mg+2].[O-][W]([O-])(=O)=O DJZHPOJZOWHJPP-UHFFFAOYSA-N 0.000 claims description 3
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 claims description 3
- 229910052698 phosphorus Inorganic materials 0.000 claims description 3
- 229910052717 sulfur Inorganic materials 0.000 claims description 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 3
- 229910001930 tungsten oxide Inorganic materials 0.000 claims description 3
- OJMOMXZKOWKUTA-UHFFFAOYSA-N aluminum;borate Chemical compound [Al+3].[O-]B([O-])[O-] OJMOMXZKOWKUTA-UHFFFAOYSA-N 0.000 claims description 2
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 claims description 2
- 239000004327 boric acid Substances 0.000 claims description 2
- MGRWKWACZDFZJT-UHFFFAOYSA-N molybdenum tungsten Chemical compound [Mo].[W] MGRWKWACZDFZJT-UHFFFAOYSA-N 0.000 claims description 2
- 239000012779 reinforcing material Substances 0.000 claims description 2
- 125000000217 alkyl group Chemical group 0.000 claims 2
- KRUHLWBBMXMBNR-UHFFFAOYSA-J P(=S)(SC(C)C)(OC(C)C)[O-].[W+4].C(C)(C)SP(=S)(OC(C)C)[O-].C(C)(C)SP(=S)(OC(C)C)[O-].C(C)(C)SP(=S)(OC(C)C)[O-] Chemical compound P(=S)(SC(C)C)(OC(C)C)[O-].[W+4].C(C)(C)SP(=S)(OC(C)C)[O-].C(C)(C)SP(=S)(OC(C)C)[O-].C(C)(C)SP(=S)(OC(C)C)[O-] KRUHLWBBMXMBNR-UHFFFAOYSA-J 0.000 claims 1
- 239000007788 liquid Substances 0.000 claims 1
- 239000011248 coating agent Substances 0.000 abstract description 3
- 238000000576 coating method Methods 0.000 abstract description 3
- 238000005470 impregnation Methods 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 29
- 229910052802 copper Inorganic materials 0.000 description 22
- 239000010949 copper Substances 0.000 description 22
- 238000005553 drilling Methods 0.000 description 19
- 238000002834 transmittance Methods 0.000 description 19
- 238000011156 evaluation Methods 0.000 description 17
- 230000000052 comparative effect Effects 0.000 description 15
- 239000011229 interlayer Substances 0.000 description 11
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 10
- 239000000126 substance Substances 0.000 description 10
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- FWLHAQYOFMQTHQ-UHFFFAOYSA-N 2-N-[8-[[8-(4-aminoanilino)-10-phenylphenazin-10-ium-2-yl]amino]-10-phenylphenazin-10-ium-2-yl]-8-N,10-diphenylphenazin-10-ium-2,8-diamine hydroxy-oxido-dioxochromium Chemical compound O[Cr]([O-])(=O)=O.O[Cr]([O-])(=O)=O.O[Cr]([O-])(=O)=O.Nc1ccc(Nc2ccc3nc4ccc(Nc5ccc6nc7ccc(Nc8ccc9nc%10ccc(Nc%11ccccc%11)cc%10[n+](-c%10ccccc%10)c9c8)cc7[n+](-c7ccccc7)c6c5)cc4[n+](-c4ccccc4)c3c2)cc1 FWLHAQYOFMQTHQ-UHFFFAOYSA-N 0.000 description 7
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 3
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 3
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- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 3
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- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
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- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 1
- 230000001050 lubricating effect Effects 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- OXKUGIFNIUUKAW-UHFFFAOYSA-N n,n-dimethylformamide;hydrazine Chemical compound NN.CN(C)C=O OXKUGIFNIUUKAW-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 231100000989 no adverse effect Toxicity 0.000 description 1
- WSGCRAOTEDLMFQ-UHFFFAOYSA-N nonan-5-one Chemical compound CCCCC(=O)CCCC WSGCRAOTEDLMFQ-UHFFFAOYSA-N 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000000790 scattering method Methods 0.000 description 1
- 239000011863 silicon-based powder Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
Classifications
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- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
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Definitions
- thermosetting resin composition and use thereof
- the present invention relates to a thermosetting resin composition and use thereof, and in particular to a thermosetting resin composition and a prepreg and a laminate prepared from the thermosetting resin composition.
- the low thermal expansion coefficient resin structure is special and the cost is high; and the method of increasing the inorganic filler content can not only effectively reduce the thermal expansion coefficient of the composite, but also the cost can be greatly reduced.
- highly filled resins can significantly reduce the drilling processability of the laminate. Therefore, the use of a block filler such as talc as a lubricant improves the workability, but the effect is not remarkable, and the addition of these block fillers further deteriorates the interlayer adhesion.
- LEDs light-emitting diodes
- the copper clad laminate and the cover film In addition to the insulation properties, the copper clad laminate and the cover film also need to have a good shading function, avoiding as much as possible Light from the LED source is transmitted from the back of the board, wasting energy, and reducing brightness.
- materials such as carbon black and aniline black are often used in the industry to add to the copper clad laminate and the cover film to impart black function to the sheet.
- CN 102190865 A discloses a copper clad laminate-forming epoxy resin composition which imparts black characteristics to a copper clad laminate mainly by using aniline black.
- Patent CN 101851390 A discloses a black cover film which mainly imparts black characteristics to a cover film by using carbon black powder.
- black pigments often cause problems: Carbon-based black pigment carbon black can significantly affect the insulation properties of copper clad laminates and cover films, while black pigment aniline black composed of benzene rings and nitrogen elements can significantly affect the coverage.
- one of the objects of the present invention is to provide a thermosetting resin composition capable of suppressing drilling processability and interlayer adhesion even with a highly filled inorganic filler. Deterioration, the laminate obtained by using the thermosetting resin composition has a low coefficient of thermal expansion, excellent drilling processability and heat resistance, high interlayer adhesion, and excellent mechanical properties and chemical stability.
- thermosetting resin composition comprising: a thermosetting resin, an inorganic filler, and a tungsten compound.
- the invention adds a tungsten compound and an inorganic filler to the thermosetting resin, which not only can reduce the thermal expansion coefficient of the laminate and improve the mechanical properties of the laminate, but also significantly improve the drilling processability of the laminate, and can obviously improve the between the thermosetting resin and the inorganic filler.
- the compatibility and the interlayer adhesion of the laminate realize that the high-filled inorganic filler can suppress the drilling processability and the deterioration of the interlayer adhesion, and the obtained laminate has a low coefficient of thermal expansion and is excellent. Drilling processability and heat resistance, high interlayer adhesion And excellent mechanical properties and chemical stability.
- the thermosetting resin to which the tungsten compound is added is suitable for any production process such as laminate production, PCB production, etc., and the formulation and process are improved and the operation is simple.
- the wear resistance of the drill is significantly reduced by the thermosetting resin composition to which the tungsten compound is added.
- the tungsten compound is selected from the group consisting of an organic tungsten compound or/and an inorganic tungsten compound.
- the tungsten compound is selected from the group consisting of tungsten disulfide, tetrathiotungstic acid amine, tungsten tetrabromide oxide, tungsten tetrachloride, tungsten tetrabromide, zinc tungstate, calcium tungstate, magnesium tungstate, ammonium tungstate , tungsten selenide, tungsten oxide, tungsten dioctyldithiocarbamate, dithiophenol tungsten, 3,4-didecyltoluene tungsten, ammonium diisopropyl dithiophosphate, organic tungsten molybdenum Any one or a mixture of at least two of a tungsten compound of a dithiocarbamate, an aromatic tungsten compound or a lanthanum aryl thiophosphate.
- the mixture is, for example, a mixture of tungsten disulfide and tetrathiotungstic acid amine, a mixture of tungsten tetrabromide and tungsten tetrachloride, a mixture of tungsten tetrabromide and zinc tungstate, a mixture of calcium tungstate and magnesium tungstate, a mixture of ammonium tungstate and tungsten selenide, a mixture of tungsten oxide and tungsten dioctyldithiocarbamate, a mixture of tungsten disulfide and 3,4-didecyltoluene, an amine diisopropyl
- the tungsten compound contains S and P elements, and the lubricating effect is further improved, and the improvement in drilling processability is further excellent.
- the molecule contains polar atoms such as S and P. These more active components are affected by the surface energy of the metal, and can be affinity-affected with the metal surface and firmly adsorbed on the metal surface, which is substantially half of the metal surface. Chemical and semi-physical adsorption. When the mechanical movement is carried out, the frictional metal surface load pressure rises, and the polar molecules will rapidly undergo a series of complicated chemical reactions under the special high temperature, high pressure and catalysis in the friction environment.
- the tungsten element in the tungsten compound also A specific element in the component is absorbed reasonably and effectively to form a cover film similar to a layered friction reducer, which has a small particle size and a strong adsorption force.
- the tungsten compound is selected from the group consisting of tungsten disulfide, tetrathiotungstic acid amine, tungsten tetrabromide oxide, tungsten tetrachloride, tungsten tetrabromide or tungsten arsenyl thiophosphate.
- tungsten disulfide tetrathiotungstic acid amine
- tungsten tetrabromide oxide tungsten tet
- thermosetting resin can not only significantly improve the drilling processability of the laminate, but also improve the compatibility between the thermosetting resin and the inorganic filler and the interlayer adhesion of the laminate, thereby realizing even the highly filled inorganic filler. It is possible to suppress the deterioration of the drilling processability and the adhesion between the layers, and it is also possible to effectively block the UV light and reduce the light transmittance, and to realize the preparation of the black copper clad laminate without deteriorating the insulation property.
- the above-mentioned tungsten compound Compared with a black pigment such as aniline black, the above-mentioned tungsten compound has good heat resistance, stable physical and chemical properties, strong chemical resistance, good dispersibility, and no adverse effect on reactivity of a thermosetting resin, and is particularly suitable for use in a laminate. Use of a thermosetting resin composition.
- the content of the tungsten compound is 0.001 to 30% by weight, preferably 0.1 to 15% by weight based on the total mass of the thermosetting resin composition.
- the content of the tungsten compound is a mass percentage of the total mass of the thermosetting resin composition, for example, 1 wt%, 3 wt%, 5 wt%, 7 wt%, 9 wt%, 11 wt%, 13 wt%, 17 wt%, 19 wt%, 21 wt%, 23 wt% 25 wt%, 27 wt% or 29 wt%. If the amount is less than 0.001% by weight based on the total mass of the resin composition, no significant effect can be obtained.
- the original overall properties of the resin composition are affected.
- the amount used is 0.1 to 15% by weight based on the total mass of the resin composition, the performance of the tungsten compound is best, and the dispersibility and fluidity of the resin composition are also optimum.
- the inorganic filler is selected from the group consisting of silica, boehmite, alumina, talc, mica, kaolin, aluminum hydroxide, magnesium hydroxide, zinc borate, zinc stannate, zinc oxide, titanium oxide, boron nitride Any one or at least two of calcium carbonate, barium sulfate, barium titanate, aluminum borate, potassium titanate, E glass powder, S glass powder, D glass powder, NE glass powder, hollow fine powder or boehmite mixture.
- the mixture such as a mixture of silica and boehmite, a mixture of alumina and talc, a mixture of mica and kaolin, a mixture of aluminum hydroxide and magnesium hydroxide, a mixture of zinc borate and zinc stannate, zinc oxide and oxidation a mixture of titanium, a mixture of boron nitride and calcium carbonate, a mixture of barium sulfate and barium titanate, boron a mixture of aluminum acid and potassium titanate, a mixture of E glass powder and S glass powder, a mixture of D glass powder and NE glass powder, a mixture of hollow fine powder and boehmite, a mixture of silica, boehmite and alumina, a mixture of talc, mica and kaolin, a mixture of aluminum hydroxide, magnesium hydroxide and zinc borate, a mixture of zinc stannate, zinc oxide and titanium oxide, a mixture of boron nitride, calcium carbonate and barium s
- the inorganic filler is contained in an amount of 10 to 80% by weight, preferably 20 to 60% by weight based on the total mass of the thermosetting resin composition.
- the content of the inorganic filler is set to 20 to 60% by weight based on the total mass of the thermosetting resin composition, the formability and low thermal expansion of the thermosetting resin composition can be favorably maintained.
- the highly filled inorganic filler is realized, the drilling processability and the interlaminar adhesion are also suppressed, and the obtained laminate has a low coefficient of thermal expansion and excellent drilling processability. And heat resistance, high interlayer adhesion, and excellent mechanical properties and chemical stability.
- the content of the inorganic filler is, for example, 23% by weight, 28% by weight, 32% by weight, 37% by weight, 42% by weight, 47% by weight, 52% by weight, 57% by weight, 62% by weight, 67% by weight, and 72% by weight based on the total mass of the thermosetting resin composition. , 76wt 0 /c ⁇ 78wt%.
- the inorganic filler has an average particle diameter of 0.1 to 100 ⁇ m, preferably 0.5 to 20 ⁇ m.
- the average particle diameter of the inorganic filler By setting the average particle diameter of the inorganic filler to ⁇ . ⁇ or more, the fluidity at the time of high filling in the thermosetting resin composition can be favorably maintained. By setting it to ⁇ or less, the probability of mixing coarse particles can be reduced and the occurrence of coarse particle defects can be suppressed.
- the average particle diameter refers to a particle diameter at a point corresponding to a volume of 50% when the cumulative volume distribution curve based on the particle diameter is obtained by taking the total volume of the particles as 100%, and the laser diffraction scattering method can be used. Particle size distribution determination.
- the thermosetting resin accounts for 20 to 70% by weight, preferably 25 to 65% by weight, and further preferably 30 to 60% by weight based on the total mass of the thermosetting resin composition.
- the thermosetting resin accounts for the total quality of the thermosetting resin composition
- the mass percentage of the amount is, for example, 23 wt%, 26 wt%, 31 wt%, 35 wt%, 39 wt%, 43 wt%, 47 wt%, 51 wt%, 55 wt%, 59 wt%, 63 wt% or 67 wt%.
- the thermosetting resin composition further comprises a curing agent, wherein the curing agent accounts for 1 to 30% by weight, preferably 4 to 25% by weight, more preferably 10 to 20% by weight based on the total mass of the thermosetting resin composition.
- the mass percentage of the curing agent to the total mass of the thermosetting resin composition is, for example, 2 wt%, 5 wt%, 8 wt%, 11 wt%, 14 wt%, 17 wt%, 19 wt%, 22 wt%, 26 wt% or 28 wt%.
- the thermosetting resin composition further comprises an accelerator, the accelerator comprising 0 to 10% by weight of the total mass of the thermosetting resin composition, excluding 0, preferably 1 to 10% by weight, further preferably 2 to 8% by weight.
- the mass percentage of the accelerator to the total mass of the thermosetting resin composition is, for example, 0.5 wt%, 1.5 wt%, 2.5 wt%, 3.5 wt%, 4.5 wt%, 5.5 wt%, 6.5 wt%, 7.5 wt%, 8.5 wt%. 0 /c ⁇ 9.5wt%.
- the thermosetting resin composition further comprises a silicon germanium coupling agent or/and a wetting and dispersing agent.
- the silicon germanium coupling agent is not particularly limited as long as it is a silicon germanium coupling agent which is usually used in the surface treatment of inorganic barium. Specific examples include ⁇ -aminopropyltriethoxysilane,
- Ammonia-silicone system such as ⁇ - ⁇ -(aminoethyl:)- ⁇ -aminopropyltrimethoxysilane, ⁇ -glycidyloxypropyltrimethoxysilane, etc., ⁇ - ⁇ Anionic silicon such as vinyl silane based on acryloxypropyltrimethoxysilane and ⁇ ⁇ _( ⁇ _vinyl phenyl acylaminoethyl) _ ⁇ _ aminopropyltrimethoxysilane hydrazine hydrochloride
- phenylsilicone, and the like one or at least two of them may be selected and used in appropriate combination.
- the wetting dispersant is not particularly limited as long as it is a dispersion stabilizer used in the coating material.
- a wet dispersing agent such as Disperbyk-110, 111, 180, 161, BYK-W996, W9010, W903 manufactured by BYK Chemie Japan can be cited.
- thermosetting resin composition means that it may include other components in addition to the components, and these other components impart different characteristics to the resin composition.
- the "include” of the present invention may be replaced by a closed “for” or “consisting of”. Regardless of the thermosetting resin composition package What component is contained, and the sum of the components of the thermosetting composition as a percentage by mass of the thermosetting resin composition is 100%.
- thermosetting resin composition may further contain various additives, and specific examples thereof include flame retardants, antioxidants, heat stabilizers, antistatic agents, ultraviolet absorbers, pigments, colorants, lubricants, and the like. . These various additives may be used singly or in combination of two or more kinds.
- the preparation method of one of the resin compositions of the present invention can be prepared by mixing, stirring, and mixing the above-mentioned thermosetting resin, inorganic filler, tungsten compound, curing agent and accelerator, and various additives by a known method.
- Another object of the present invention is to provide a resin glue obtained by dissolving or dispersing a thermosetting resin composition as described above in a solvent.
- the solvent in the present invention is not particularly limited, and specific examples thereof include alcohols such as methanol, ethanol, and butanol, ethyl cellosolve, butyl cellosolve, ethylene glycol-methyl ether, carbitol, and butyl.
- Ethers such as carbitol, ketones such as acetone, butanone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, aromatic hydrocarbons such as toluene, xylene, and mesitylene, ethoxylate
- An ester such as ethyl acetate or ethyl acetate; a nitrogen-containing solvent such as hydrazine, hydrazine-dimethylformamide, hydrazine, hydrazine-dimethylacetamide or hydrazine-methyl-2-pyrrolidone.
- solvents may be used singly or in combination of two or more.
- aromatic hydrocarbon solvents such as toluene, xylene, and mesitylene, and acetone, butanone, methyl ethyl ketone, and methyl group.
- a ketone flux such as butyl ketone or cyclohexanone is used in combination.
- the amount of the solvent to be used can be selected by those skilled in the art according to their own experience, so that the obtained resin glue can reach a viscosity suitable for use.
- An emulsifier may be added during the process of dissolving or dispersing the resin composition as described above in a solvent. By dispersing by an emulsifier, the filler or the like can be uniformly dispersed in the glue.
- a third object of the present invention is to provide a prepreg comprising a reinforcing material and a thermosetting resin composition as described above adhered thereto by dipping and drying.
- a fourth object of the present invention is to provide a laminate comprising at least one prepreg as described above.
- the present invention has the following beneficial effects:
- the invention adds a tungsten compound and an inorganic filler to the thermosetting resin, can not only reduce the thermal expansion coefficient of the laminate and the mechanical properties of the laminate, but also significantly improve the drilling processability of the laminate, and can obviously improve the thermosetting resin and the inorganic filler.
- the compatibility between the interlayer and the interlayer adhesion of the laminate enables the deterioration of the drilling processability and the adhesion between the layers even if the highly filled inorganic filler is obtained, and the obtained laminate has a low coefficient of thermal expansion and is excellent. Drilling processability and heat resistance, high interlayer adhesion, and excellent mechanical properties and chemical stability.
- Brominated bisphenol A type epoxy resin (Dow Chemical, epoxy equivalent 435, bromine content 19%, product name DER530), dicyandiamide, 2-methylimidazole, tungsten compound, inorganic filler, soluble in organic solvent Medium, mechanically stirred and emulsified to prepare 65wt% of glue, then impregnated with glass fiber cloth, heated to dry to form prepreg, copper foil placed on both sides, and heated to form a copper foil substrate.
- the thermal expansion coefficient, the UV transmittance, the transmittance, the dispersibility effect evaluation, the volume resistivity, and the drill processability were as follows, and the results are shown in Table 1.
- a copper clad laminate using a resin composition was obtained in the same manner as in Example 1 except that carbon black powder was used instead of the tungsten compound.
- the measurement and evaluation results are shown in Table 2.
- a copper clad laminate using a resin composition was obtained in the same manner as in Example 1 except that aniline black was used instead of the tungsten compound.
- the measurement and evaluation results are shown in Table 2.
- a copper clad laminate using a resin composition was obtained in the same manner as in Example 1 except that the tungsten compound was not blended.
- the measurement and evaluation results are shown in Table 2.
- a copper clad laminate using a resin composition was obtained in the same manner as in Example 1 except that the tungsten compound, the inorganic filler and the pigment were not blended.
- the measurement and evaluation results are shown in Table 2.
- the integrated sphere method was used using a transmission reflectance tester manufactured by American Lanfei Company.
- the laminate was peeled off, cut into a size of 5 mm square, placed on a conductive paste, and sprayed with gold to prepare a test piece for observation.
- the interface between the filler and the resin was observed by a scanning electron microscope and evaluated.
- the laminate was cut into a size of 5 mm square, injection molded with a resin, placed on a conductive paste, and sprayed with gold to prepare a test piece for observation.
- the dispersion of the filler in the resin was observed by a scanning electron microscope and evaluated.
- 100 ml of the resin composition was placed in a 100 ml stopper cylinder, and allowed to stand at room temperature of 25 ° C to measure the time during which the precipitate was retained to the bottom of the settling tube, and the stability was evaluated.
- the laminate was cut into test pieces of 100 mm ⁇ 100 mm, and the surface copper foil was prepared into a specific pattern. After high temperature treatment, 500 V DC voltage was applied to the sample using a high resistance meter and stabilized after 60 s, and the volume resistance was calculated. The higher the value, the larger the volume resistivity, indicating that the electrical insulation of the laminate is better.
- Two well-drilled drill shafts in a 6-axis drilling machine are used for drilling.
- Six new knives are drilled per plate, and each hole is drilled with 3000 holes.
- the cutting edge of the drill is observed using a test microscope, and the blade tip wear and tear is measured.
- the distance between the intersection of the vertical line and the central axis and the upper edge of the wear is measured as the size of the drill, and the wear rate of the drill is calculated by the following formula to evaluate the workability of the drill.
- Wear rate% distance between the trailing edge of the borehole and the center axis / distance between the front edge of the borehole and the central axis X 100%
- brominated bisphenol quinone type epoxy resin (Dow Chemical, epoxy equivalent 435, bromine content 19%, Product name DER530), 24 parts by weight of novolac resin (Japan Group Rong, hydroxyl equivalent 105, product name TD2090), 0.05 parts by weight of 2-methylimidazole, tungsten compound, dissolved in organic solvent, mechanically stirred and emulsified to make 65wt % of the glue, then impregnated with a glass fiber cloth, dried and dried to form a prepreg, placed on both sides of the copper foil, and heated to form a copper foil substrate.
- a copper clad laminate using the resin composition was obtained in the same manner as in Example 7 except that carbon black powder was used instead of the tungsten compound.
- the results of the measurement and evaluation are shown in Table 4. Comparative example 6
- a copper clad laminate using the resin composition was obtained in the same manner as in Example 7 except that aniline black was used instead of the tungsten compound.
- the results of the measurement and evaluation are shown in Table 4. Comparative example 7
- a copper clad laminate using a resin composition was obtained in the same manner as in Example 7 except that the tungsten compound was not blended.
- the results of the measurement and evaluation are shown in Table 4. Comparative Example 8
- Example 12 A copper clad laminate using a resin composition was obtained in the same manner as in Example 7 except that the tungsten compound, the inorganic filler and the pigment were not blended. The results of the measurement and evaluation are shown in Table 4. Table 3 Ingredients / parts by mass Example 7 Example 8 Example 9 Example 10 Example 11 Example 12
- the addition of a tungsten compound not only can significantly improve the drilling processability of the laminate, but also effectively block UV light and reduce light transmittance, regardless of whether it is a DICY curing or a phenolic curing thermosetting resin composition.
- the UV transmittance of the laminate can be reduced from 35 to 46% to 0.01 to 0.6%, and the light transmittance can be reduced from 3 to 4% to 0.1 to 0.8%. Quite obvious, and its comprehensive performance is excellent.
- the dispersibility and stability of the resin composition to which the tungsten compound is added are also remarkably superior to those of the resin composition to which the tungsten compound is not added.
- Comparative Examples 4 and 8 it can be seen from Comparative Examples 4 and 8 that since the inorganic filler is not added to the composition, the thermal expansion coefficient thereof is remarkably increased, and it can be seen that the addition of the inorganic filler can significantly reduce the thermal expansion coefficient of the composite material, and can be compared with Comparative Examples 3 and 7, It can be seen that the inorganic filler also has a synergistic barrier effect on UV light transmittance and light transmittance. In Comparative Examples 1 and 5, since the carbon black powder was contained, the electrical insulating properties were remarkably deteriorated.
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Abstract
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TWI675907B (zh) * | 2015-01-21 | 2019-11-01 | 日商Jsr股份有限公司 | 固體攝像裝置 |
EP3434734A4 (en) * | 2016-04-05 | 2019-09-25 | Hitachi Chemical Co., Ltd. | RESIN COMPOSITION, BARRIER MATERIAL AGAINST HYDROGEN GAS, CURED PRODUCT, COMPOSITE MATERIAL, AND STRUCTURE |
CN106739220A (zh) * | 2016-12-28 | 2017-05-31 | 江阴市明康绝缘玻纤有限公司 | 耐热性酚醛纸紫外光屏蔽覆铜板 |
CN111902469B (zh) * | 2018-03-20 | 2023-04-14 | 东丽株式会社 | 预浸料坯及纤维增强复合材料 |
CN109796729A (zh) * | 2019-02-21 | 2019-05-24 | 莫爱军 | 一种纳米复合吸波材料及其制备方法 |
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