CN103554844B - 一种热固性树脂组合物及其用途 - Google Patents

一种热固性树脂组合物及其用途 Download PDF

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CN103554844B
CN103554844B CN201310526318.9A CN201310526318A CN103554844B CN 103554844 B CN103554844 B CN 103554844B CN 201310526318 A CN201310526318 A CN 201310526318A CN 103554844 B CN103554844 B CN 103554844B
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thermosetting resin
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tungsten compound
tungsten
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CN103554844A (zh
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杜翠鸣
柴颂刚
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Shengyi Technology Co Ltd
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Priority to US15/033,299 priority patent/US10053547B2/en
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Abstract

本发明涉及一种热固性树脂组合物。该组合物包括20~70wt%热固性树脂,1~30wt%固化剂,0~10wt%促进剂,钨化合物及无机填料,可通过含浸方式制成预浸料或通过涂布方式制成涂成物。该组合物可以明显降低层压板的热膨胀系数,而且能有效的阻挡UV光和降低光透射率。

Description

一种热固性树脂组合物及其用途
技术领域
本发明涉及一种热固性树脂组合物及其用途,具体涉及一种热固性树脂组合物及由该热固性树脂组合物制备得到的预浸料和层压板。
背景技术
随着电子产品向小型化、多功能化、高性能化及高可靠性方面的迅速发展,印制电路板开始朝着高精度、高密度、高性能、微孔化、薄型化和多层化方向迅猛发展,其应用范围越来越广泛,已从工业用大型电子计算机、通讯仪表、电气测量、国防及航空、航天等部门迅速进入到民用电器及其相关产品。而基体材料在很大程度上决定了印制电路板的性能,因此迫切需要开发新一代的基体材料。作为未来新一代的基体材料必须具备高的耐热性、低的热膨胀系数以及优异的化学稳定性和机械性能。
为了降低层压板的热膨胀系数,通常会选用低热膨胀系数的树脂或提高无机填料的含量。但是低热膨胀系数树脂结构较为特殊,成本较高;而采用提高无机填料含量的方式不仅能有效降低复合物的热膨胀系数,而且成本也能大大降低。但高填充化树脂会明显降低层压板的钻孔加工性。因此有人采用加入滑石等块状填料作为润滑剂,改善加工性,但是效果不明显,而且这些块状填料的加入更进一步恶化了层间粘合力。
此外,近年来,由于LED(发光二极管)的低能耗、高效率的突出特点,已被广泛应用于电器指示、LED显示屏、LED背光源、景观照明、室内装饰等领域。LED的高速发展,也推动了功能性覆铜板和覆盖膜的发展。该覆铜板和覆盖膜除了具有的绝缘等性能以外,还需要具有良好的遮光功能,尽可能地避免LED光源的光线从板材背面透过、浪费能源、降低光亮度。为了赋予覆铜板和覆盖膜以黑色特性,目前业界较常使用炭黑和苯胺黑等材料添加到覆铜板和覆盖膜中以赋予板材黑色功能。
CN102190865A公开了一种制作覆铜板的环氧树脂组合物,其主要利用苯胺黑赋予覆铜板以黑色特性。专利CN101851390A公开了一种黑色覆盖膜,其主要利用炭黑粉赋予覆盖膜以黑色特性。然而,黑色颜料也经常带来种种问题:以碳为主的黑色颜料炭黑会显著影响覆铜板和覆盖膜的绝缘性能,而以苯环和氮元素组成的黑色颜料苯胺黑则会显著影响覆铜板和覆盖膜尤其是有卤体系覆铜板和覆盖膜的耐热性能。
发明内容
针对现有技术中存在的问题,本发明的目的之一在于提供一种热固性树脂组合物,所述热固性树脂组合物即便高填充化无机填料也能抑制钻孔加工性以及层间粘合力的恶化,采用该热固性树脂组合物得到的层压板具有低的热膨胀系数、优异的钻孔加工性和耐热性、高的层间粘合力以及优异的机械性能和化学稳定性。
为了达到上述目的,本发明采用了如下技术方案:
一种热固性树脂组合物,所述热固性树脂组合物包括:热固性树脂、无机填料以及钨化合物。
本发明在热固性树脂中添加钨化合物和无机填料,不仅可以降低层压板的热膨胀系数及提高层压板的机械性能,以及明显改善层压板的钻孔加工性,而且能明显改善热固性树脂与无机填料间的相容性和层压板的层间粘合力,实现了即便高填充化无机填料也能抑制钻孔加工性以及层间粘合力的恶化,得到的层压板具有低的热膨胀系数、优异的钻孔加工性和耐热性、高的层间粘合力以及优异的机械性能和化学稳定性。而且,添加钨化合物的热固性树脂适应任意层压板制作、PCB制作等生产工艺,配方、工艺改善操作简便。
由于钨化合物摩擦系数低,润滑性好,添加钨化合物的热固性树脂组合物对钻刀的磨损能明显降低。
优选地,所述钨化合物选自有机钨化合物或/和无机钨化合物。
优选地,所述钨化合物选自二硫化钨、四硫代钨酸胺、四溴氧化钨、四氯化钨、四溴化钨、钨酸锌、钨酸钙、钨酸镁、钨酸铵、硒化钨、氧化钨、二辛基二硫代氨基甲酸钨、二硫酚合钨、3,4-二巯基甲苯合钨、胺基二异丙基二硫代磷酸钨、有机钨钼配合物、二硫代氨基甲酸钨化合物、芳烃钨化合物或烷(芳)基胺基硫代磷酸钨中的任意一种或者至少两种的混合物。所述混合物例如二硫化钨和四硫代钨酸胺的混合物,四溴氧化钨和四氯化钨的混合物,四溴化钨和钨酸锌的混合物,钨酸钙和钨酸镁的混合物,钨酸铵和硒化钨的混合物,氧化钨和二辛基二硫代氨基甲酸钨的混合物,二硫酚合钨和3,4-二巯基甲苯合钨的混合物,胺基二异丙基二硫代磷酸钨和有机钨钼配合物的混合物,二硫代氨基甲酸钨化合物、芳烃钨化合物和烷(芳)基胺基硫代磷酸钨的混合物。
优选地,所述钨化合物含有S和P元素,则润滑效果更佳,对钻孔加工性的改善更加优异。分子中含有S和P等极性原子,这些活性较强的组分受金属表面能的影响,能与金属表面发生亲和、牢固地吸附在金属表面上,实质上是和金属表面发生了半化学和半物理性的吸附。当机械运动进行后,摩擦金属表面负荷压力升高,极性分子就会在摩擦环境中特殊的高温、高压和催化等作用下,迅速发生一系列复杂的化学反应,钨化合物中的钨元素也会合理而有效的吸收组分中特定元素,形成类似于层状减摩剂的覆盖膜,该减磨剂粒度小而且吸附力强。
优选地,所述钨化合物选自二硫化钨、四硫代钨酸胺、四溴氧化钨、四氯化钨、四溴化钨或烷(芳)基胺基硫代磷酸钨中的任意一种或者至少两种的混合物。在热固性树脂中添加上述钨化合物,不仅可以明显改善层压板的钻孔加工性和改善热固性树脂与无机填料间的相容性以及层压板的层间粘合力,实现即便高填充化无机填料也能抑制钻孔加工性以及层间粘合力的恶化,还可以有效的阻挡UV光及降低光透过率,在不恶化绝缘性的情况下,实现黑色覆铜板的制备。上述钨化合物与苯胺黑等黑色颜料相比,其耐热性好,物理化学性能稳定,耐化学性强,分散性好,同时对热固性树脂的反应性等无副作用,特别适合用于层压板用热固性树脂组合物的使用。
优选地,所述钨化合物的含量为热固性树脂组合物总质量的0.001~30wt%,优选0.1~15wt%。所述钨化合物的含量为热固性树脂组合物总质量的质量百分比例如为1wt%、3wt%、5wt%、7wt%、9wt%、11wt%、13wt%、17wt%、19wt%、21wt%、23wt%、25wt%、27wt%或29wt%。该用量若低于树脂组合物总质量的0.001wt%,不能产生明显的效果,若高于树脂组合物总质量的30wt%,则会影响树脂组合物的原有的整体性能。使用量为树脂组合物总质量的0.1~15wt%时钨化合物的性能发挥的最好,而且树脂组合物的分散性和流动性也最佳。
优选地,所述无机填料选自二氧化硅、勃姆石、氧化铝、滑石、云母、高岭土、氢氧化铝、氢氧化镁、硼酸锌、锡酸锌、氧化锌、氧化钛、氮化硼、碳酸钙、硫酸钡、钛酸钡、硼酸铝、钛酸钾、E玻璃粉、S玻璃粉、D玻璃粉、NE玻璃粉、中空微粉或勃姆石中的任意一种或者至少两种的混合物。所述混合物例如二氧化硅和勃姆石的混合物,氧化铝和滑石的混合物,云母和高岭土的混合物,氢氧化铝和氢氧化镁的混合物,硼酸锌和锡酸锌的混合物,氧化锌和氧化钛的混合物,氮化硼和碳酸钙的混合物,硫酸钡和钛酸钡的混合物,硼酸铝和钛酸钾的混合物,E玻璃粉和S玻璃粉的混合物,D玻璃粉和NE玻璃粉的混合物,中空微粉和勃姆石的混合物,二氧化硅、勃姆石和氧化铝的混合物,滑石、云母和高岭土的混合物,氢氧化铝、氢氧化镁和硼酸锌的混合物,锡酸锌、氧化锌和氧化钛的混合物,氮化硼、碳酸钙和硫酸钡的混合物,钛酸钡、硼酸铝和钛酸钾的混合物,E玻璃粉、S玻璃粉和D玻璃粉的混合物,NE玻璃粉、中空微粉和勃姆石的混合物。
优选地,所述无机填料的含量为热固性树脂组合物总质量的10~80wt%,优选20~60wt%。通过将无机填充材料的含量设为热固性树脂组合物总质量的20~60wt%,可以良好地保持热固性树脂组合物的成形性和低热膨胀。采用本发明的技术方案,实现了高填充化无机填料的情况下,也能抑制钻孔加工性以及层间粘合力的恶化,得到的层压板具有低的热膨胀系数、优异的钻孔加工性和耐热性、高的层间粘合力以及优异的机械性能和化学稳定性。
所述无机填料的含量为热固性树脂组合物总质量的质量百分比例如为23wt%、28wt%、32wt%、37wt%、42wt%、47wt%、52wt%、57wt%、62wt%、67wt%、72wt%、76wt%或78wt%。
优选地,所述无机填料的平均粒径为0.1~100μm,优选为0.5~20μm。通过将无机填料平均粒径设为0.1μm以上,可以良好地保持热固性树脂组合物中高填充时的流动性。通过设为100μm以下,可以减少粗大粒子的混入概率且抑制引起粗大粒子不良的发生。在此,平均粒径是指将粒子的总体积作为100%而求出基于粒径的累积度数分布曲线时,刚好相当于体积为50%的点的粒径,可以以使用激光衍射散射法的粒度分布测定。
优选地,所述热固性树脂占热固性树脂组合物总质量的20~70wt%,优选25~65wt%,进一步优选30~60wt%。所述热固性树脂占热固性树脂组合物总质量的质量百分比例如为23wt%、26wt%、31wt%、35wt%、39wt%、43wt%、47wt%、51wt%、55wt%、59wt%、63wt%或67wt%。
优选地,所述热固性树脂组合物还包括固化剂,所述固化剂占热固性树脂组合物总质量的1~30wt%,优选4~25wt%,进一步优选10~20wt%。所述固化剂占热固性树脂组合物总质量的质量百分比例如为2wt%、5wt%、8wt%、11wt%、14wt%、17wt%、19wt%、22wt%、26wt%或28wt%。
优选地,所述热固性树脂组合物还包括促进剂,所述促进剂占热固性树脂组合物总质量的0~10wt%,不包括0,优选1~10wt%,进一步优选2~8wt%。所述促进剂占热固性树脂组合物总质量的质量百分比例如为0.5wt%、1.5wt%、2.5wt%、3.5wt%、4.5wt%、5.5wt%、6.5wt%、7.5wt%、8.5wt%或9.5wt%。
优选地,所述热固性树脂组合物还包括硅烷偶联剂或/和润湿分散剂。作为这些硅烷偶联剂,只要是通常在无机条理俺表面处理中所使用的硅烷偶联剂即可,其并没有特别的限定。作为具体例可列举出,γ-氨丙基三乙氧基硅烷、N-β-(氨乙基)-γ-氨丙基三甲氧基硅烷等氨硅烷系、γ-缩水甘油醚氧丙基三甲氧基硅烷等环氧硅烷系、γ-甲基丙烯酰氧丙基三甲氧基硅烷等乙烯基硅烷系、N-β-(N-乙烯基苯偶酰基氨乙基)-γ-氨丙基三甲氧基硅烷盐酸盐等阴离子硅烷系、苯基硅烷系等,可以选择其中的1种或者至少2种适当组合使用。另外,湿润分散剂只要是在涂料中使用的分散稳定剂,就没有特别的限定。可列举出例如BYKChemieJapan制的Disperbyk-110、111、180、161、BYK-W996、W9010、W903等湿润分散剂。
本发明所述的“包括”,意指其除所述组份外,还可以包括其他组份,这些其他组份赋予所述树脂组合物不同的特性。除此之外,本发明所述的“包括”,还可以替换为封闭式的“为”或“由……组成”。不管所述热固性树脂组合物包含何种成分,所述热固性组合物的各组分占热固性树脂组合物的质量百分比之和为100%。
例如,所述热固性树脂组合物还可以含有各种添加剂,作为具体例,可以举出阻燃剂、抗氧剂、热稳定剂、抗静电剂、紫外线吸收剂、颜料、着色剂或润滑剂等。这些各种添加剂可以单独使用,也可以两种或者两种以上混合使用。
作为本发明树脂组合物之一的制备方法,可以通过公知的方法配合、搅拌、混合所述的热固性树脂、无机填料、钨化合物、、固化剂和促进剂,以及各种添加剂,来制备。
本发明的目的之二在于提供一种树脂胶液,其是将如上所述的热固性树脂组合物溶解或分散在溶剂中得到。
作为本发明中的溶剂,没有特别限定,作为具体例,可以举出甲醇、乙醇、丁醇等醇类,乙基溶纤剂、丁基溶纤剂、乙二醇-甲醚、卡必醇、丁基卡必醇等醚类,丙酮、丁酮、甲基乙基甲酮、甲基异丁基甲酮、环己酮等酮类,甲苯、二甲苯、均三甲苯等芳香族烃类,乙氧基乙基乙酸酯、醋酸乙酯等酯类,N,N-二甲基甲酰胺、N,N-二甲基乙酰胺、N-甲基-2-吡咯烷酮等含氮类溶剂。上述溶剂可以单独使用一种,也可以两种或者两种以上混合使用,优选甲苯、二甲苯、均三甲苯等芳香族烃类溶剂与丙酮、丁酮、甲基乙基甲酮、甲基异丁基甲酮、环己酮等酮类熔剂混合使用。所述溶剂的使用量本领域技术人员可以根据自己的经验来选择,使得到的树脂胶液达到适于使用的粘度即可。
在如上所述的树脂组合物溶解或分散在溶剂的过程中,可以添加乳化剂。通过乳化剂进行分散,可以使填料等在胶液中分散均匀。
本发明的目的之三在于提供一种预浸料,其包括增强材料及通过浸渍干燥后附着在其上的如上所述的热固性树脂组合物。
本发明的目的之四在于提供一种层压板,所述层压板含有至少一张如上所述的预浸料。
与已有技术相比,本发明具有如下有益效果:
本发明在热固性树脂中添加钨化合物和无机填料,不仅可以降低层压板的热膨胀系数及提高的层压板的机械性能,以及明显改善层压板的钻孔加工性,而且能明显改善热固性树脂与无机填料间的相容性和层压板的层间粘合力,实现了即便高填充化无机填料也能抑制钻孔加工性以及层间粘合力的恶化,得到的层压板具有低的热膨胀系数、优异的钻孔加工性和耐热性、高的层间粘合力以及优异的机械性能和化学稳定性。
此外,通过选择一定的钨化合物,还可以有效的阻挡UV光及降低光透过率,在不恶化绝缘性的情况下,实现耐热性优异的黑色覆铜板的制备。
具体实施方式
为更好地说明本发明,便于理解本发明的技术方案,本发明的典型但非限制性的实施例如下:
将溴化双酚A型环氧树脂(陶氏化学,环氧当量435,溴含量19%,产品名DER530)、双氰胺,2-甲基咪唑,钨化合物,无机填料,溶于有机溶剂中,机械搅拌、乳化配制成65wt%的胶液,然后含浸玻璃纤维布,经过加热干燥后形成预浸料(prepreg),两面放置铜箔,加压加热制成铜箔基板。
使用得到的覆铜层压板,用以下示出的方法,热膨胀系数、UV透过率、透射率、分散性效果评价、体积电阻率、钻刀加工性,结果见表1。
A)钨化合物:
A-1二硫化钨,长沙市华京粉体材料科技有限公司
A-2四硫代钨酸胺,昊睿化学有限公司
A-3烷(芳)基胺基硫代磷酸钨,上海东理科技有限公司
B)无机填料
B-1熔融球形硅微粉,电气化学工业株式会社,SFP30M,平均粒径0.5um
B-2熔融不规则二氧化硅,新加坡矽比科,525,平均粒径2um
B-3复合硅微粉,新加坡矽比科,G2C,平均粒径2um
B-4勃姆石,Nabaltec,AOH30
B-5勃姆石,Nabaltec,AOH60
C)颜料
C-1炭黑粉,德国德古萨公司,FW200
C-2苯胺黑,德国德古萨公司,BS890
比较例1
除了使用炭黑粉替代钨化合物使用外,用于实施例1同样的方法,得到使用树脂组合物的覆铜板。测定、评价结果示于表2。
比较例2
除了使用苯胺黑替代钨化合物使用外,用于实施例1同样的方法,得到使用树脂组合物的覆铜板。测定、评价结果示于表2。
比较例3
除了不配合钨化合物外,用于实施例1同样的方法,得到使用树脂组合物的覆铜板。测定、评价结果示于表2。
比较例4
除了不配合钨化合物、无机填料和颜料外,用于实施例1同样的方法,得到使用树脂组合物的覆铜板。测定、评价结果示于表2。
1、热膨胀率的测定
利用蚀刻液去除覆铜层叠板的铜箔后,切成5mm×5mm见方的大小制作试验片。使用TMA试验装置以升温速度10℃/min,测定该试验片在30~260℃下的Z轴方向(玻璃布垂直方向)的平均线热膨胀率。热膨胀率越小,效果越好。
2、UV透过率
利用蚀刻液去除覆铜层叠板的铜箔后,切成100mm×100mm的试验片。使用波长为365nm的3kW的紫外光灯进行照射。把照度计探头放置于光源的玻璃平台上并对准紫外光,记录光度计上所显示的光强度达到25mv/cm2时的值,空白样的值为A,测试样的值为B,根据以下公式计算紫外光透过率:γ=B/A×100%,透过率越小,说明对紫外光的阻挡能力越好。
3、透射率
使用美国蓝菲公司生产的透射反射率测试仪使用积分球法测试。
4、填料与树脂间的结合界面评价
将层压板进行剥离后切断5mm见方的大小,置于导电胶上、喷金,制成观察用试验片。用扫描电子显微镜观察,观察填料与树脂间的界面,并对其进行评价。
5、填料在树脂中的分散均匀性评价
层压板切断成5mm见方的大小,以树脂进行注型,置于导电胶上、喷金,制成观察用试验片。用扫描电子显微镜观察,观察填料在树脂中的分散情况,并对其进行评价。
6、树脂组合物的稳定性评价
将100ml树脂组合物置于100ml的带塞量筒内,于25℃的室温中静置,测定沉淀物滞留至沉降管的底部的时间,评价稳定性。
7、电绝缘性的测定
将层压板切成100mm×100mm的试验片,将其表面铜箔制备成特定图案,经高温处理后,使用高阻计在试样上施加500V直流电压并经60s稳定后读数,并计算得到体积电阻率,数值越大,体积电阻率越大,说明层压板的电绝缘性越好。
8、钻孔加工性的评价
选用6轴钻床中两个效果较为相近的钻轴进行钻孔,每块板钻6把新刀,每把刀钻3000个孔,然后使用检测显微镜观察钻头刀刃部分,测定刀刃尖端磨损后退量以测量垂直线与中轴线交点与磨损上边缘的距离为钻刀尺寸,通过以下公式计算钻刀磨损率来评价钻孔加工性。
磨损率%=钻孔后边缘与中轴线距离/钻孔前边缘与中轴线距离×100%
表1
表2
表1和表2备注:“○”表示优,“△”表示良好,“×”表示差。
实施例7-12
100重量份溴化双酚A型环氧树脂(陶氏化学,环氧当量435,溴含量19%,产品名DER530)、24重量份线型酚醛树脂(日本群荣,羟基当量105,产品名TD2090),0.05重量份2-甲基咪唑,钨化合物,溶于有机溶剂中,机械搅拌乳化配制成65wt%的胶水,然后含浸玻璃纤维布,经过加热干燥后形成预浸料(prepreg),两面放置铜箔,加压加热制成铜箔基板。
使用得到的覆铜层压板,用上述示出的方法,对热膨胀系数、UV透过率、体积电阻率、分散性效果评价、钻孔加工性,结果见表3。
比较例5
除了使用炭黑粉替代钨化合物使用外,用于实施例7同样的方法,得到使用树脂组合物的覆铜板。测定、评价结果示于表4。
比较例6
除了使用苯胺黑替代钨化合物使用外,用于实施例7同样的方法,得到使用树脂组合物的覆铜板。测定、评价结果示于表4。
比较例7
除了不配合钨化合物外,用于实施例7同样的方法,得到使用树脂组合物的覆铜板。测定、评价结果示于表4。
比较例8
除了不配合钨化合物、无机填料和颜料外,用于实施例7同样的方法,得到使用树脂组合物的覆铜板。测定、评价结果示于表4。
表3
表4
表3和表4备注:“○”表示优,“△”表示良好,“×”表示差。
从表1~表4可以看出,不管是在DICY固化还是酚醛固化的热固性树脂组合物,使用添加钨化合物不仅能明显改善层压板的钻孔加工性,而且能效阻挡UV光和降低光透射率,添加少量的钨化合物,即可将层压板的UV光透过率从35~46%降低至0.01~0.6%,而光透射率则可从3~4%降低至0.1~0.8%,其效果相当明显,且其综合性能优异。另外,从表1~表4可以看出,添加钨化合物的树脂组合物的分散性与稳定性也明显优于没有添加钨化合物的树脂组合物分散性与稳定性。从对比例4和8可以看出,由于组合物中没有添加无机填料,其热膨胀系数明显增加,可见无机填料的加入可明显降低复合材料的热膨胀系数,与比较例3和7相比照,还可看出,无机填料对UV光透过率和光透射率也有协同阻挡改善的作用。对于比较例1和5而言,由于含有炭黑粉,所以电绝缘性明显劣化。
申请人声明,本发明通过上述实施例来说明本发明的详细方法,但本发明并不局限于上述详细方法,即不意味着本发明必须依赖上述详细方法才能实施。所属技术领域的技术人员应该明了,对本发明的任何改进,对本发明产品各原料的等效替换及辅助成分的添加、具体方式的选择等,均落在本发明的保护范围和公开范围之内。

Claims (20)

1.一种热固性树脂组合物,其特征在于,所述热固性树脂组合物包括:热固性树脂、无机填料以及钨化合物,所述钨化合物含有S和P元素;所述钨化合物的含量为热固性树脂组合物总质量的0.001~30wt%,所述无机填料的含量为热固性树脂组合物总质量的10~80wt%,所述无机填料的平均粒径为0.1~100μm。
2.如权利要求1所述的热固性树脂组合物,其特征在于,所述钨化合物选自有机钨化合物或/和无机钨化合物。
3.如权利要求1或2所述的热固性树脂组合物,其特征在于,所述钨化合物选自烷基胺基硫代磷酸钨或/和芳基胺基硫代磷酸钨。
4.如权利要求3所述的热固性树脂组合物,其特征在于,所述钨化合物选自胺基二异丙基二硫代磷酸钨。
5.如权利要求1所述的热固性树脂组合物,其特征在于,所述钨化合物的含量为热固性树脂组合物总质量的0.1~15wt%。
6.如权利要求1-2之一所述的热固性树脂组合物,其特征在于,所述无机填料选自二氧化硅、氧化铝、滑石、云母、高岭土、氢氧化铝、氢氧化镁、硼酸锌、锡酸锌、氧化锌、氧化钛、氮化硼、碳酸钙、硫酸钡、钛酸钡、硼酸铝、钛酸钾、E玻璃粉、S玻璃粉、D玻璃粉、NE玻璃粉、中空微粉或勃姆石中的任意一种或者至少两种的混合物。
7.如权利要求1所述的热固性树脂组合物,其特征在于,所述无机填料的含量为热固性树脂组合物总质量的20~60wt%。
8.如权利要求1所述的热固性树脂组合物,其特征在于,所述无机填料的平均粒径为0.5~20μm。
9.如权利要求1-2之一所述的热固性树脂组合物,其特征在于,所述热固性树脂占热固性树脂组合物总质量的20~70wt%。
10.如权利要求9所述的热固性树脂组合物,其特征在于,所述热固性树脂占热固性树脂组合物总质量的25~65wt%。
11.如权利要求10所述的热固性树脂组合物,其特征在于,所述热固性树脂占热固性树脂组合物总质量的30~60wt%。
12.如权利要求1-2之一所述的热固性树脂组合物,其特征在于,所述热固性树脂组合物还包括固化剂,所述固化剂占热固性树脂组合物总质量的1~30wt%。
13.如权利要求12所述的热固性树脂组合物,其特征在于,所述热固性树脂组合物还包括固化剂,所述固化剂占热固性树脂组合物总质量的4~25wt%。
14.如权利要求13所述的热固性树脂组合物,其特征在于,所述热固性树脂组合物还包括固化剂,所述固化剂占热固性树脂组合物总质量的10~20wt%。
15.如权利要求1-2之一所述的热固性树脂组合物,其特征在于,所述热固性树脂组合物还包括促进剂,所述促进剂占热固性树脂组合物总质量的0~10wt%,不包括0。
16.如权利要求15所述的热固性树脂组合物,其特征在于,所述热固性树脂组合物还包括促进剂,所述促进剂占热固性树脂组合物总质量的1~10wt%。
17.如权利要求16所述的热固性树脂组合物,其特征在于,所述热固性树脂组合物还包括促进剂,所述促进剂占热固性树脂组合物总质量的2~8wt%。
18.一种树脂胶液,其特征在于,其是将如权利要求1-17之一所述的热固性树脂组合物溶解或分散在溶剂中得到。
19.一种预浸料,其特征在于,其包括增强材料及通过浸渍干燥后附着在其上的如权利要求1-17之一所述的热固性树脂组合物。
20.一种层压板,其特征在于,所述层压板含有至少一张如权利要求19所述的预浸料。
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