KR20240118122A - 전자 부품 포장용 커버 테이프 및 전자 부품 포장체 - Google Patents

전자 부품 포장용 커버 테이프 및 전자 부품 포장체 Download PDF

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Publication number
KR20240118122A
KR20240118122A KR1020247021926A KR20247021926A KR20240118122A KR 20240118122 A KR20240118122 A KR 20240118122A KR 1020247021926 A KR1020247021926 A KR 1020247021926A KR 20247021926 A KR20247021926 A KR 20247021926A KR 20240118122 A KR20240118122 A KR 20240118122A
Authority
KR
South Korea
Prior art keywords
cover tape
electronic components
layer
packaging
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020247021926A
Other languages
English (en)
Korean (ko)
Inventor
히로키 아베
요시카즈 가미무라
Original Assignee
스미또모 베이크라이트 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 스미또모 베이크라이트 가부시키가이샤 filed Critical 스미또모 베이크라이트 가부시키가이샤
Publication of KR20240118122A publication Critical patent/KR20240118122A/ko
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D73/00—Packages comprising articles attached to cards, sheets or webs
    • B65D73/02—Articles, e.g. small electrical components, attached to webs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D65/00—Wrappers or flexible covers; Packaging materials of special type or form
    • B65D65/38—Packaging materials of special type or form
    • B65D65/40—Applications of laminates for particular packaging purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D77/00—Packages formed by enclosing articles or materials in preformed containers, e.g. boxes, cartons, sacks or bags
    • B65D77/10—Container closures formed after filling
    • B65D77/20—Container closures formed after filling by applying separate lids or covers, i.e. flexible membrane or foil-like covers
    • H01L21/00—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Packages (AREA)
  • Wrappers (AREA)
  • Laminated Bodies (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
KR1020247021926A 2022-03-30 2023-03-23 전자 부품 포장용 커버 테이프 및 전자 부품 포장체 Ceased KR20240118122A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022055535A JP2023147816A (ja) 2022-03-30 2022-03-30 電子部品包装用カバーテープおよび電子部品包装体
JPJP-P-2022-055535 2022-03-30
PCT/JP2023/011528 WO2023190041A1 (ja) 2022-03-30 2023-03-23 電子部品包装用カバーテープおよび電子部品包装体

Publications (1)

Publication Number Publication Date
KR20240118122A true KR20240118122A (ko) 2024-08-02

Family

ID=88202028

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247021926A Ceased KR20240118122A (ko) 2022-03-30 2023-03-23 전자 부품 포장용 커버 테이프 및 전자 부품 포장체

Country Status (5)

Country Link
JP (3) JP2023147816A (cg-RX-API-DMAC7.html)
KR (1) KR20240118122A (cg-RX-API-DMAC7.html)
CN (1) CN118946507A (cg-RX-API-DMAC7.html)
TW (1) TWI863199B (cg-RX-API-DMAC7.html)
WO (1) WO2023190041A1 (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2026091440A (ja) * 2024-11-25 2026-06-04 デンカ株式会社 カバーフィルム及び電子部品包装体

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003508253A (ja) 1999-08-31 2003-03-04 電気化学工業株式会社 透明ヒートシールフィルム
JP2007045513A (ja) 2005-08-12 2007-02-22 Shin Etsu Polymer Co Ltd 電子部品包装用カバーテープ
JP2017171393A (ja) 2017-05-31 2017-09-28 ローム株式会社 電子部品包装体

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US5132160A (en) * 1991-02-21 1992-07-21 Minnesota Mining And Manufacturing Company Component carrier tape
JP3029891B2 (ja) * 1991-08-26 2000-04-10 ソニーケミカル株式会社 耐熱カバーテープ
TW379182B (en) * 1997-07-23 2000-01-11 Matsushita Electric Industrial Co Ltd Packing materials for small parts, packing method and packing apparatus as well as the packing method for electronic parts
JPH11105181A (ja) * 1997-09-30 1999-04-20 Dainippon Printing Co Ltd 電子部品包装用カバーテープ
US6027802A (en) * 1997-10-23 2000-02-22 Four Piliars Enterprise Co., Ltd. Cover tape for packaging
JP4001774B2 (ja) * 2002-05-29 2007-10-31 日東電工株式会社 電子部品搬送用キャリア基体および電子部品搬送体
JP2004083065A (ja) * 2002-08-27 2004-03-18 Sumitomo Bakelite Co Ltd 電子部品搬送用容器及びシート
US20060199005A1 (en) * 2003-04-24 2006-09-07 Dai Nippon Painting Co., Ltd. Electronic part taping packaging cover tape
JP4159979B2 (ja) * 2003-12-22 2008-10-01 住友ベークライト株式会社 電子部品包装用カバーテープ
WO2008018473A1 (en) * 2006-08-10 2008-02-14 Denki Kagaku Kogyo Kabushiki Kaisha Conductive sheet
CN101544294A (zh) 2008-03-27 2009-09-30 3M创新有限公司 电子器件封装装置、电子器件封装方法及其封装设备
EP2311749B1 (en) * 2008-08-12 2013-04-17 Sumitomo Bakelite Co., Ltd. Cover tape for electronic component packing body and electronic component packing body
CN103260873B (zh) * 2010-12-17 2015-09-23 3M创新有限公司 用于包装电子部件的热封膜及包覆带
CN105934396B (zh) * 2014-01-29 2018-12-18 住友电木株式会社 电子部件包装用盖带
WO2016024529A1 (ja) * 2014-08-15 2016-02-18 電気化学工業株式会社 カバーフィルムおよびそれを用いた電子部品包装体
JP2016182989A (ja) * 2015-03-27 2016-10-20 住友ベークライト株式会社 電子部品包装用カバーテープ、電子部品包装用包材、および電子部品包装体
TW202017752A (zh) 2017-03-28 2020-05-16 日商住化積水薄膜股份有限公司 承載帶用頂覆帶及其製造方法
JP6566149B2 (ja) * 2017-06-22 2019-08-28 住友ベークライト株式会社 カバーテープおよび電子部品包装体
US11240947B2 (en) * 2018-06-28 2022-02-01 Taiwan Semiconductor Manufacturing Co., Ltd. Carrier tape system and components and methods of use
JP7177265B2 (ja) * 2019-10-11 2022-11-22 大日本印刷株式会社 電子部品包装用カバーテープ、包装体、および包装体用セット
WO2021095638A1 (ja) * 2019-11-15 2021-05-20 住友ベークライト株式会社 カバーテープおよび電子部品包装体
JP7308807B2 (ja) * 2020-01-31 2023-07-14 住友ベークライト株式会社 電子部品包装用カバーテープ、電子部品包装体およびその製造方法
JP2021001028A (ja) * 2020-09-03 2021-01-07 大日本印刷株式会社 電子部品包装用カバーテープおよび包装体
CN114055890A (zh) * 2021-10-19 2022-02-18 厦门长塑实业有限公司 一种可热封抗静电聚酰胺共挤复合薄膜及其制备方法和应用

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003508253A (ja) 1999-08-31 2003-03-04 電気化学工業株式会社 透明ヒートシールフィルム
JP2007045513A (ja) 2005-08-12 2007-02-22 Shin Etsu Polymer Co Ltd 電子部品包装用カバーテープ
JP2017171393A (ja) 2017-05-31 2017-09-28 ローム株式会社 電子部品包装体

Also Published As

Publication number Publication date
JP2023153139A (ja) 2023-10-17
JP7517557B2 (ja) 2024-07-17
JP2023147816A (ja) 2023-10-13
CN118946507A (zh) 2024-11-12
WO2023190041A1 (ja) 2023-10-05
TW202406807A (zh) 2024-02-16
JP2024124497A (ja) 2024-09-12
TWI863199B (zh) 2024-11-21

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