WO2023190041A1 - 電子部品包装用カバーテープおよび電子部品包装体 - Google Patents

電子部品包装用カバーテープおよび電子部品包装体 Download PDF

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Publication number
WO2023190041A1
WO2023190041A1 PCT/JP2023/011528 JP2023011528W WO2023190041A1 WO 2023190041 A1 WO2023190041 A1 WO 2023190041A1 JP 2023011528 W JP2023011528 W JP 2023011528W WO 2023190041 A1 WO2023190041 A1 WO 2023190041A1
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WIPO (PCT)
Prior art keywords
cover tape
packaging
electronic components
electronic component
tape
Prior art date
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Ceased
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PCT/JP2023/011528
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English (en)
French (fr)
Japanese (ja)
Inventor
皓基 阿部
祥司 上村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
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Sumitomo Bakelite Co Ltd
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Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to KR1020247021926A priority Critical patent/KR20240118122A/ko
Priority to CN202380030407.6A priority patent/CN118946507A/zh
Publication of WO2023190041A1 publication Critical patent/WO2023190041A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D73/00—Packages comprising articles attached to cards, sheets or webs
    • B65D73/02—Articles, e.g. small electrical components, attached to webs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D65/00—Wrappers or flexible covers; Packaging materials of special type or form
    • B65D65/38—Packaging materials of special type or form
    • B65D65/40—Applications of laminates for particular packaging purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D77/00—Packages formed by enclosing articles or materials in preformed containers, e.g. boxes, cartons, sacks or bags
    • B65D77/10—Container closures formed after filling
    • B65D77/20—Container closures formed after filling by applying separate lids or covers, i.e. flexible membrane or foil-like covers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Definitions

  • the present invention relates to a cover tape for packaging electronic components and an electronic component package.
  • Carrier tapes and cover tapes are often used when transporting, storing, etc. electronic components. Specifically, first, an electronic component (such as a semiconductor chip) is placed in a recess formed in a carrier tape, and then a cover tape is heat-sealed to the top surface of the carrier tape to encapsulate the electronic component.
  • an electronic component such as a semiconductor chip
  • a cover tape is heat-sealed to the top surface of the carrier tape to encapsulate the electronic component.
  • the thus obtained carrier tape-cover tape composite in which electronic components are encapsulated is wound onto a reel and transported/stored.
  • cover tapes suitable for packaging small electronic components have not been sufficiently developed. In other words, there is room for improvement in cover tapes suitable for packaging small electronic components.
  • the present invention has been made in view of these circumstances.
  • One of the objects of the present invention is to provide a cover tape suitable for packaging small electronic components.
  • a cover tape for packaging electronic components is provided, which has a breaking strength of 10 N or more as measured in accordance with JIS K 6734.
  • An electronic component package includes a carrier tape storing electronic components and the above electronic component packaging cover tape adhered to the carrier tape so as to seal the electronic components.
  • a cover tape for packaging electronic components is provided that is suitable for packaging small electronic components.
  • FIG. 1 is a diagram schematically showing an example of the cover tape (cover tape for electronic component packaging) of the present embodiment. It is a figure which shows an example of the state in which the cover tape for electronic component packaging was adhere
  • FIG. 3 is a diagram for explaining the "lifting amount" of the cover tape.
  • FIG. 1 schematically shows an example of a cover tape for packaging electronic components (also simply referred to as "cover tape") according to the present embodiment.
  • the cover tape preferably comprises a base layer 1 and a sealant layer 3 present on one side of the base layer 1. Further, the cover tape can include an intermediate layer 2 between the base layer 1 and the sealant layer 3. This intermediate layer 2 is clearly shown in FIG.
  • Sealant layer 3 is usually present on the outermost surface of the cover tape.
  • the sealant layer 3 is usually provided entirely on one side of the base layer 1 . In other words, the sealant layer 3 usually exists on one side of the base layer 1 with substantially the same width and length as the base layer 1 without any cuts or divisions.
  • the sealant layer 3 of the cover tape is adhered to the carrier tape. In other words, the lower surface side of the cover tape shown in FIG. 1 is usually adhered to the carrier tape.
  • the cover tape has a long shape.
  • the width of the cover tape (indicated by the symbol W in FIG. 1) is 3 mm or less, preferably 2.4 to 3 mm, more preferably 2.5 to 3 mm. Further, the breaking strength of the cover tape measured according to JIS K 6734 is 10N or more, preferably 10 to 30N, and more preferably 12 to 25N.
  • the cover tape of this embodiment can be easily adhered to a narrow carrier tape for accommodating small electronic components.
  • the cover tape is designed so that the breaking strength measured according to JIS K 6734 is 10 N or more. As described above, the cover tape of this embodiment is suitable for packaging small electronic components.
  • the breaking strength measured according to JIS K 6734 is usually the strength "per unit cross-sectional area" of the tape to be measured.
  • the breaking strength of the cover tape itself is 10 N or more, not per unit cross-sectional area.
  • the breaking strength measured according to JIS K 6734 it is preferable to appropriately select the material and layer structure constituting the cover tape.
  • the details will be explained below, but examples include selecting appropriate materials for the base layer and intermediate layer, and appropriately adjusting the thickness of these layers.
  • the material constituting the base layer 1 is not particularly limited. Typically, the mechanical strength is sufficient to withstand when producing the cover tape, when adhering the cover tape to the carrier tape, when peeling the cover tape during the mounting process, and when external force is applied. A strong material is preferred. Further, it is preferable to use a material that has enough heat resistance to withstand the heat generated when adhering the cover tape to the carrier tape.
  • the material constituting the base layer 1 is preferably in the form of a film in terms of ease of processing.
  • the material constituting the base layer 1 include polyester resin, nylon resin, polyolefin resin, polyacrylate resin, polymethacrylate resin, polyimide resin, polycarbonate resin, ABS resin, and the like.
  • polyester resins include polyethylene terephthalate (PET), polybutylene terephthalate (PBT), and the like. Among these, polyethylene terephthalate is preferable in terms of cost and strength balance.
  • Specific examples of the nylon resin include nylon 6, nylon 66, and the like.
  • Specific examples of polyolefin resins include polyethylene and polypropylene.
  • the base material layer contains at least one selected from the group consisting of nylon resin, polyester resin, and polypropylene resin.
  • the base layer contains nylon resin. As shown in the Examples below, when the base layer contains a nylon resin, breakage can be particularly suppressed.
  • the base material layer 1 may have only one layer, or may have two or more layers.
  • the base material layer 1 may be formed of a multilayer film in which the above-mentioned materials are laminated.
  • the base layer includes at least two layers: a layer containing nylon resin and a layer containing polyester resin.
  • the layer containing the polyester resin be the outermost layer of the cover tape.
  • polyester resin breaking strength and heat resistance can be improved.
  • Polyester resin is suitable for the outermost layer because it is resistant to external forces when peeling the cover tape and heat from a sealing iron.
  • Nylon resin does not have as high heat resistance as polyester resin, has appropriate flexibility, and has high breaking strength. Therefore, heat and pressure from the sealing iron can be appropriately transmitted to the intermediate layer and the sealant layer. This means that the cover tape can be adhered to the carrier tape with shorter heating times. Additionally, nylon resin is strong against external forces during peeling.
  • cover tape By combining polyester resin, which has particularly high heat resistance, and nylon resin, which can appropriately transmit heat and pressure from the sealing iron to the intermediate layer and sealant layer, cover tape can be created in a shorter heating time while suppressing deformation due to heat. can be glued to carrier tape. This is a desirable characteristic in packaging small electronic components where pocket deformation of the carrier tape due to heat tends to lead to mounting defects.
  • the base material layer can be a layered layer of polyethylene resins having different densities.
  • the base material layer is a laminate of two or more layers: (i) a layer containing high-density polyethylene, and (ii) a layer containing linear low-density polyethylene and/or low-density polyethylene. It is preferable that By forming the base material layer by laminating polyethylene resins having different densities, the rigidity of the film may be adjusted and the processability during lamination may be controlled.
  • the base layer 1 may or may not contain additives such as lubricants.
  • the film used to form the base layer 1 may be an unstretched film, or a film stretched uniaxially or biaxially. From the viewpoint of further improving the mechanical strength of the cover tape, it is preferable that the film be uniaxially or biaxially stretched.
  • the thickness of the base material layer 1 is not particularly limited.
  • the thickness of the base material layer 1 is preferably 3 ⁇ m or more, more preferably 5 ⁇ m or more. Further, the thickness of the base material layer 1 is preferably 30 ⁇ m or less, more preferably 25 ⁇ m or less.
  • the thickness of the base layer 1 is 30 ⁇ m or less, the rigidity of the cover tape does not become too high. Thereby, even if twisting stress is applied to the carrier tape after sealing, the cover tape can easily follow the deformation of the carrier tape. Therefore, it is possible to prevent the cover tape from unintentionally peeling off from the carrier tape.
  • the thickness of the base layer 1 is 3 ⁇ m or more, the mechanical strength of the cover tape can be made sufficiently good. Therefore, even when the cover tape is peeled off from the carrier tape at high speed, it is possible to prevent the cover tape from breaking.
  • the cushioning properties, impact resistance, etc. of the cover tape can be improved.
  • the material forming the intermediate layer 2 include olefin resins, styrene resins, cyclic olefin resins, and the like. Among these, olefin resins are preferred from the viewpoint of improving the cushioning properties of the entire cover tape.
  • the olefin resin include polyethylene and polypropylene, with polyethylene being preferred.
  • LDPE low density polyethylene
  • L-LDPE linear low density polyethylene
  • the intermediate layer 2 contains linear low-density polyethylene.
  • linear low-density polyethylene based on the density of polyethylene distributed on the market called "linear low density polyethylene", in this specification, straight chain polyethylene with a density of 0.880 g/ cm3 or more and less than 0.930 g/ cm3 is used.
  • linear polyethylene be linear low density polyethylene.
  • the intermediate layer 2 may be composed of (i) only linear low-density polyethylene, or (ii) composed of linear low-density polyethylene and other polyethylene such as low-density polyethylene or high-density polyethylene. may have been done.
  • (ii) an embodiment in which the intermediate layer 2 has a multilayer structure including a layer made of linear low-density polyethylene and a layer made of other polyethylene;
  • (ii-2) Examples include an embodiment in which the intermediate layer 2 includes a layer made of a mixture of linear low-density polyethylene and other polyethylene (single layer or multilayer).
  • the cover tape can be made even more suitable for packaging small electronic components.
  • the flow direction (MD direction) of the intermediate layer is expressed by the following formula (1).
  • the dimensional change rate in the width direction (TD direction) is, for example, -4 to 4%, preferably -3 to 3%, and the dimensional change rate in the width direction (TD direction) is, for example, 0 to 2%, preferably 0.1 to 1%.
  • Dimensional change rate (%) ⁇ (T 0 - T 1 )/T 0 ⁇ 100
  • the intermediate layer 2 may have only one layer, or may have two or more layers.
  • the intermediate layer 2 may be formed of a multilayer film in which the above-mentioned materials are laminated.
  • the intermediate layer 2 may or may not contain various additives.
  • its thickness is preferably 10 to 55 ⁇ m, more preferably 15 to 50 ⁇ m, and even more preferably 20 to 45 ⁇ m, from the viewpoint of improving the cushioning properties of the entire cover tape.
  • the material constituting the sealant layer 3 is not particularly limited.
  • the sealant layer 3 may be made of a material that can be bonded to the carrier tape by applying heat.
  • materials for forming the sealant layer 3 include (meth)acrylic resins, styrene resins, olefin resins, urethane resins, ester resins, and copolymers thereof.
  • a styrene resin, a (meth)acrylic resin, and an ester resin is included.
  • the sealant layer 3 can further contain an antistatic agent from the viewpoint of reducing the surface resistance value of the sealant layer 3, suppressing the generation of static electricity accompanying peeling, and maintaining sealing properties.
  • an antistatic agent is preferably dissolved or dispersed in the resin.
  • the antistatic agent examples include (i) particulate metal-containing substances and (ii) conductive polymers.
  • Specific examples of the antistatic agent include metal oxide particles such as antimony-doped tin oxide, phosphorus-doped tin oxide, and fluorine-doped tin oxide, conductive polymers, and carbon nanotubes.
  • the antistatic agent preferably contains one or more of the group consisting of antimony-doped tin oxide (ATO), phosphorous-doped tin oxide, fluorine-doped tin oxide, and a conductive polymer.
  • Preferred examples of the conductive polymer include polythiophene and polythiophene derivatives.
  • More specific examples include polythiophene, poly(3,4)-ethylenedioxythiophene, poly(3-thiophene- ⁇ -ethanesulfonic acid), and the like.
  • poly3,4-ethylenedioxythiophene or its derivatives are preferred from the viewpoint of maintaining even better antistatic properties and sealing properties.
  • the sealant layer 3 may also contain, as other additives, a dispersant for improving the dispersibility of the antistatic agent, silica sol, a leveling agent, a conductive aid, and the like.
  • the thickness of the sealant layer 3 is preferably 0.02 to 20 ⁇ m, more preferably 0.03 to 15 ⁇ m, from the viewpoint of suitably performing sealing work and peeling work.
  • the cover tape may comprise additional layers other than the base layer 1, the intermediate layer 2 and the sealant layer 3. Additional layers can include, for example, adhesive layers that adhere the two layers.
  • the thickness of the cover tape is preferably from 25 to 80 ⁇ m, more preferably from 35 to 70 ⁇ m, from the viewpoint of a balance between ensuring film strength and handling properties.
  • An electronic component package can be obtained from the above-mentioned cover tape and a carrier tape in which electronic components are accommodated in the recesses. This will be explained with reference to FIG. 2.
  • the cover tape 10 is used as a lid material for a band-shaped carrier tape 20 in which concave pockets 21 are continuously provided to match the shape of the electronic component. Specifically, the cover tape 10 is adhered (usually heat-sealed) to the surface of the carrier tape 20 so as to cover the entire opening of the pocket 21 of the carrier tape 20 . Note that hereinafter, the structure obtained by bonding the cover tape 10 and the carrier tape 20 will be referred to as an electronic component package 100.
  • the electronic component package 100 can be produced, for example, by the following procedure. First, electronic components are accommodated in the pockets 21 of the carrier tape 20. Next, the cover tape 10 is adhered to the surface of the carrier tape 20 by heat sealing so as to cover the entire opening of the pocket 21 of the carrier tape 20. At this time, the sealant layer 3 of the cover tape 10 is brought into contact with the carrier tape 20 (that is, heat sealing is performed so that the "back side" of the cover tape 10 in FIG. 2 becomes the sealant layer 3). By doing so, a structure (electronic component package 100) in which electronic components are hermetically housed is obtained.
  • the specific method and conditions for heat sealing are not particularly limited as long as the cover tape 10 adheres to the carrier tape 20 sufficiently strongly. Typically, it can be carried out using a known taping machine at a temperature of 100 to 240°C, a load of 0.1 to 10 kgf, and a time of 0.0001 to 1 second.
  • the material of the carrier tape 20 is not particularly limited as long as it can adhere the cover tape 10 by heat sealing. It is usually made of resin or paper, preferably resin.
  • the carrier tape 20 is made of a material containing polystyrene resin, a material containing polycarbonate resin, a material containing polyethylene terephthalate resin, or the like.
  • the electronic component package 100 is wound onto a reel, for example, and then transported to a work area where electronic components are mounted on electronic circuit boards and the like.
  • the material of the reel can be metal, paper, plastic, etc.
  • the cover tape 10 is peeled off from the carrier tape 20, and the contained electronic components are taken out.
  • the cover tape described above is particularly suitable for packaging small electronic components.
  • the size of the electronic component for example, 1005 (1.0 mm x 0.5 mm) size or less, preferably 0603 (0.6 mm x 0.3 mm) size or less, more preferably 0402 (0.4 mm x 0 .2mm) size or less.
  • the type of electronic component is not particularly limited. Examples include semiconductor chips, transistors, diodes, capacitors, piezoelectric elements, optical elements, LED-related members, connectors, electrodes, and other parts used in the manufacture of electrical and electronic equipment.
  • Example 1 a cover tape was manufactured that included a base layer having a two-layer structure of a PET film and a nylon film, an intermediate layer, and a sealant layer.
  • the specific manufacturing procedure is as follows.
  • a biaxially stretched polyester film (Toyobo Co., Ltd., trade name: T6140) having a thickness of 12 ⁇ m was prepared.
  • a laminating agent Mitsubishi Chemicals, Inc., Takelac A-520
  • a 12 ⁇ m thick biaxially oriented nylon film (Koron, trade name: NT02) was laminated by a dry lamination method. In this way, a two-layer base material layer was obtained.
  • a laminating agent (Takelac A-520, manufactured by Mitsui Chemicals, Inc.) was applied to the biaxially stretched nylon film side of the base layer, and a 30 ⁇ m thick polyethylene film (manufactured by Tamapori Co., Ltd., trade name: SE605M) was applied. They were laminated by a dry lamination method to form an intermediate layer. Thereafter, a coating solution containing antimony-doped tin oxide was applied onto the exposed surface of the intermediate layer by gravure coating. The coating liquid was a uniform mixture of 60% by mass of (C-1) antistatic agent, 24% by mass of (B) poly(meth)acrylic acid derivative, and 16% by mass of (A) styrene resin. Using.
  • a laminate including a base layer, an intermediate layer, and a sealant layer was obtained.
  • the obtained laminate was cut into a width of 2.6 mm to obtain a long cover tape.
  • Example 2 Example 1 except that a 15 ⁇ m thick biaxially stretched nylon film (Toyobo Co., Ltd., trade name: N1202) was used instead of a 12 ⁇ m thick biaxially stretched nylon film (Koron Co., Ltd., trade name: NT02). A cover tape was obtained in the same manner as above.
  • Example 3 A cover was prepared in the same manner as in Example 1, except that a 25 ⁇ m thick polyethylene film (Wako Co., Ltd.: LM-015) was used instead of a 30 ⁇ m thick polyethylene film (Tamapoly Co., Ltd., trade name: SE605M). Got the tape.
  • Example 4 The procedure was the same as in Example 1, except that a 40 ⁇ m thick polyethylene film (manufactured by Tamapoly Co., Ltd., trade name: SE605M) was used instead of a 30 ⁇ m thick polyethylene film (manufactured by Tamapoly Co., Ltd., trade name: SE605M). A cover tape was obtained.
  • a 40 ⁇ m thick polyethylene film manufactured by Tamapoly Co., Ltd., trade name: SE605M
  • SE605M 30 ⁇ m thick polyethylene film
  • Example 5 A cover tape was obtained in the same manner as in Example 1, except that a 30 ⁇ m thick laminated polyethylene film was used instead of the 30 ⁇ m thick polyethylene film (manufactured by Tamapoly Co., Ltd., trade name: SE605M).
  • the laminated film used here had a layered structure of linear low density polyethylene/high density polyethylene/linear low density polyethylene, each layer having a thickness of 10 ⁇ m and a total thickness of 30 ⁇ m.
  • the linear low-density polyethylene was Ube Maruzen Polyethylene Co., Ltd.: Umerit 0540F
  • the high-density polyethylene was Nippon Polyethylene Co., Ltd.: Novatec HF111K.
  • the laminated film used here was manufactured by laminating and extruding at an extrusion temperature of 200° C. using a coextrusion inflation molding machine.
  • Example 6 A cover tape was obtained in the same manner as in Example 1, except that the base material layer was a single layer of biaxially oriented polybutylene terephthalate (manufactured by Kojin Film & Chemicals Co., Ltd., Boblet ST) having a thickness of 20 ⁇ m.
  • the base material layer was a single layer of biaxially oriented polybutylene terephthalate (manufactured by Kojin Film & Chemicals Co., Ltd., Boblet ST) having a thickness of 20 ⁇ m.
  • Example 7 A cover tape was obtained in the same manner as in Example 1, except that the base material layer was a single layer of biaxially oriented polyethylene terephthalate (Futamura Chemical Co., Ltd., FE2301) having a thickness of 25 ⁇ m.
  • the base material layer was a single layer of biaxially oriented polyethylene terephthalate (Futamura Chemical Co., Ltd., FE2301) having a thickness of 25 ⁇ m.
  • a cover tape was obtained in the same manner as in Example 1, except that the base material layer was a single layer of biaxially oriented polyethylene terephthalate (Toyobo Co., Ltd., trade name: T6140) having a thickness of 12 ⁇ m.
  • the base material layer was a single layer of biaxially oriented polyethylene terephthalate (Toyobo Co., Ltd., trade name: T6140) having a thickness of 12 ⁇ m.
  • a cover tape was obtained in the same manner as in Example 1, except that the base material layer was a single layer of biaxially oriented polyethylene terephthalate (Toyobo Co., Ltd., trade name: E7415) having a thickness of 16 ⁇ m.
  • the base material layer was a single layer of biaxially oriented polyethylene terephthalate (Toyobo Co., Ltd., trade name: E7415) having a thickness of 16 ⁇ m.
  • the breaking strength of the cover tapes of each example and comparative example was measured in accordance with JIS K 6734. Regarding the measurement, a tensile test was conducted on a cover tape slit to a width of 2.6 mm at a tensile strength of 50 mm/min using an Autograph manufactured by Shimadzu Corporation. Then, the load at break was determined as the breaking strength.
  • Evaluation was performed using the following procedure. (1) Using a taping machine, apply the sealant layer side of the obtained evaluation cover tape (2.6 mm width) to the surface of a 4 mm wide polystyrene resin carrier tape at 170°C, 4 kgf, Heat sealing was performed for 0.005 seconds to produce a band-shaped package. (2) Using a tape feeder (manufactured by Panasonic, product name: Intelligent Tape Feeder), remove the evaluation cover tape from the carrier tape at a conveyance speed (peel speed) of 2400 mm/min and a peel angle of approximately 170°. Continuously peeled off. Then, it was evaluated whether or not the peeled cover tape would break when it was sandwiched between two gears in the tape feeder. In the table below, cases where no breakage occurred were indicated as good, and cases where breakage occurred were indicated as poor.
  • peel speed conveyance speed
  • the breaking strength of the cover tapes of Examples 1 to 7 measured according to JIS K 6734 was 10N or more. Further, no breakage occurred in the breakage evaluation using a tape feeder. In other words, the cover tapes of Examples 1 to 7 are difficult to break despite their narrow widths, and can be said to be suitable for packaging small electronic components. Furthermore, in the cover tapes of Examples 1 to 7, the "lifting amount" was relatively small. This is considered to be due to the relatively small dimensional change rate of the intermediate layer. In addition, in ⁇ Evaluation of Peel Strength>, the cover tapes of Examples 1 to 5 all showed values of 30 gf or more, showing better peel strength than the cover tapes of Examples 6 and 7. This is considered to be due to the difference in the base material layers.
  • Base material layer 1 Base material layer 2 Intermediate layer 3 Sealant layer 10 Cover tape 20 Carrier tape 21 Pocket 100 Electronic component package

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Packaging Frangible Articles (AREA)
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  • Laminated Bodies (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
PCT/JP2023/011528 2022-03-30 2023-03-23 電子部品包装用カバーテープおよび電子部品包装体 Ceased WO2023190041A1 (ja)

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CN202380030407.6A CN118946507A (zh) 2022-03-30 2023-03-23 电子部件包装用盖带及电子部件包装体

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Cited By (1)

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Publication number Priority date Publication date Assignee Title
WO2026110662A1 (ja) * 2024-11-25 2026-05-28 デンカ株式会社 カバーフィルム及び電子部品包装体

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JPH11105181A (ja) * 1997-09-30 1999-04-20 Dainippon Printing Co Ltd 電子部品包装用カバーテープ
JP2003341720A (ja) * 2002-05-29 2003-12-03 Nitto Denko Corp 電子部品搬送用キャリア基体および電子部品搬送体
WO2010018791A1 (ja) * 2008-08-12 2010-02-18 住友ベークライト株式会社 電子部品包装用カバーテープおよび電子部品包装体
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