KR20240037880A - 적층체 및 적층체를 구비한 전자 기기 - Google Patents
적층체 및 적층체를 구비한 전자 기기 Download PDFInfo
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- KR20240037880A KR20240037880A KR1020237043520A KR20237043520A KR20240037880A KR 20240037880 A KR20240037880 A KR 20240037880A KR 1020237043520 A KR1020237043520 A KR 1020237043520A KR 20237043520 A KR20237043520 A KR 20237043520A KR 20240037880 A KR20240037880 A KR 20240037880A
- Authority
- KR
- South Korea
- Prior art keywords
- laminate
- resin
- primer layer
- layer
- mass
- Prior art date
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Classifications
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- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
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- C08J7/04—Coating
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- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/044—Forming conductive coatings; Forming coatings having anti-static properties
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
- C08K5/3477—Six-membered rings
- C08K5/3492—Triazines
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
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- C09D171/00—Coating compositions based on polyethers obtained by reactions forming an ether link in the main chain; Coating compositions based on derivatives of such polymers
- C09D171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C09D171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
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- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
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- C09D7/60—Additives non-macromolecular
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- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
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- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
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PCT/JP2022/027941 WO2023286872A1 (ja) | 2021-07-15 | 2022-07-15 | 積層体および積層体を備えた電子機器 |
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JP2015118044A (ja) | 2013-12-19 | 2015-06-25 | 住友金属鉱山株式会社 | 金属薄膜/ポリイミド積層体の密着強度判定方法、及び、それを用いた金属化ポリイミドフィルム基板 |
JP2017218664A (ja) | 2016-06-10 | 2017-12-14 | 株式会社C−Ink | めっき下地用の組成物及びそれによるめっき下地 |
WO2019013038A1 (ja) | 2017-07-10 | 2019-01-17 | Dic株式会社 | 積層体、それを用いたプリント配線板、フレキシブルプリント配線板及び成形品 |
JP2020059185A (ja) | 2018-10-09 | 2020-04-16 | Dic株式会社 | 積層体、電子機器及びこれらの製造方法 |
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JP6418435B2 (ja) * | 2014-02-21 | 2018-11-07 | Dic株式会社 | 積層体、導電性パターン及び電子回路 |
JP6460383B2 (ja) * | 2014-12-11 | 2019-01-30 | Dic株式会社 | 導電性積層体及びその製造方法 |
JP2019014188A (ja) * | 2017-07-10 | 2019-01-31 | Dic株式会社 | 積層体、それを用いたプリント配線板、フレキシブルプリント配線板及び成形品 |
JP6579293B2 (ja) * | 2017-07-10 | 2019-09-25 | Dic株式会社 | 積層体、それを用いたプリント配線板、フレキシブルプリント配線板及び成形品 |
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JP2015118044A (ja) | 2013-12-19 | 2015-06-25 | 住友金属鉱山株式会社 | 金属薄膜/ポリイミド積層体の密着強度判定方法、及び、それを用いた金属化ポリイミドフィルム基板 |
JP2017218664A (ja) | 2016-06-10 | 2017-12-14 | 株式会社C−Ink | めっき下地用の組成物及びそれによるめっき下地 |
WO2019013038A1 (ja) | 2017-07-10 | 2019-01-17 | Dic株式会社 | 積層体、それを用いたプリント配線板、フレキシブルプリント配線板及び成形品 |
JP2020059185A (ja) | 2018-10-09 | 2020-04-16 | Dic株式会社 | 積層体、電子機器及びこれらの製造方法 |
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TW202327876A (zh) | 2023-07-16 |
CN117561164A (zh) | 2024-02-13 |
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