KR20240026123A - 폴리아미드산, 폴리이미드 및 그 용도 - Google Patents
폴리아미드산, 폴리이미드 및 그 용도 Download PDFInfo
- Publication number
- KR20240026123A KR20240026123A KR1020237025632A KR20237025632A KR20240026123A KR 20240026123 A KR20240026123 A KR 20240026123A KR 1020237025632 A KR1020237025632 A KR 1020237025632A KR 20237025632 A KR20237025632 A KR 20237025632A KR 20240026123 A KR20240026123 A KR 20240026123A
- Authority
- KR
- South Korea
- Prior art keywords
- group
- general formula
- substituted
- unsubstituted
- silsesquioxane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
- C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/42—Block-or graft-polymers containing polysiloxane sequences
- C08G77/452—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences
- C08G77/455—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences containing polyamide, polyesteramide or polyimide sequences
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021107533 | 2021-06-29 | ||
JPJP-P-2021-107533 | 2021-06-29 | ||
PCT/JP2022/025342 WO2023276887A1 (ja) | 2021-06-29 | 2022-06-24 | ポリアミド酸、ポリイミド、及びその用途 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20240026123A true KR20240026123A (ko) | 2024-02-27 |
Family
ID=84691423
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020237025632A Pending KR20240026123A (ko) | 2021-06-29 | 2022-06-24 | 폴리아미드산, 폴리이미드 및 그 용도 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2023276887A1 (enrdf_load_stackoverflow) |
KR (1) | KR20240026123A (enrdf_load_stackoverflow) |
CN (1) | CN116964131A (enrdf_load_stackoverflow) |
TW (1) | TW202319443A (enrdf_load_stackoverflow) |
WO (1) | WO2023276887A1 (enrdf_load_stackoverflow) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20250128950A (ko) * | 2022-12-23 | 2025-08-28 | 도요보 가부시키가이샤 | 폴리이미드 필름, 적층체, 플렉시블 전자 디바이스 및 플렉시블 전자 디바이스의 제조 방법 |
TWI879063B (zh) * | 2023-09-04 | 2025-04-01 | 奇美實業股份有限公司 | 光吸收離型組成物的使用方法及半導體裝置的製備方法 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002146021A (ja) | 2000-11-10 | 2002-05-22 | Ube Ind Ltd | 可溶性、透明なポリイミドおよびその製造法 |
JP2002348374A (ja) | 2001-05-25 | 2002-12-04 | Hitachi Cable Ltd | ポリアミック酸又はポリイミド及び液晶配向剤 |
WO2003024870A1 (fr) | 2001-09-18 | 2003-03-27 | Chisso Corporation | Derives silsesquioxane et procede de fabrication |
JP2004331647A (ja) | 2003-03-13 | 2004-11-25 | Chisso Corp | シルセスキオキサン骨格を有する重合体および化合物 |
JP3653976B2 (ja) | 1997-08-11 | 2005-06-02 | 東亞合成株式会社 | 光カチオン硬化性樹脂組成物 |
JP2006265243A (ja) | 2005-02-28 | 2006-10-05 | Chisso Corp | カゴ型ケイ素骨格を有する有機ケイ素化合物及び高分子化合物 |
JP2007302635A (ja) | 2006-05-15 | 2007-11-22 | Chisso Corp | シルセスキオキサン骨格を有する酸無水物および重合体 |
WO2008146637A1 (ja) | 2007-05-24 | 2008-12-04 | Mitsubishi Gas Chemical Company, Inc. | 無色透明樹脂フィルムの製造方法及び製造装置 |
CN110106508A (zh) | 2019-05-14 | 2019-08-09 | 中国科学院海洋研究所 | 一种用于海洋浪花飞溅区光生阴极保护的Bi2O2CO3/TiO2复合材料及方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4552489B2 (ja) * | 2003-05-16 | 2010-09-29 | チッソ株式会社 | 液晶配向膜形成用ワニス、液晶配向膜および液晶表示素子 |
JP4281444B2 (ja) * | 2003-08-12 | 2009-06-17 | チッソ株式会社 | 液晶配向膜形成用ワニス、液晶配向膜および液晶表示素子 |
US7619042B2 (en) * | 2007-09-07 | 2009-11-17 | Nexolve Corporation | Polyimide polymer with oligomeric silsesquioxane |
CN101372534B (zh) * | 2007-08-24 | 2012-04-11 | 东丽纤维研究所(中国)有限公司 | 一种低介电常数聚酰亚胺/低聚倍半硅氧烷纳米杂化膜及其制备方法 |
CN101412847A (zh) * | 2007-10-18 | 2009-04-22 | 东丽纤维研究所(中国)有限公司 | 耐热型聚酰亚胺/多面体低聚倍半硅氧烷纳米杂化材料 |
CN104356413A (zh) * | 2014-11-11 | 2015-02-18 | 西北工业大学 | 一类包含八聚笼型倍半硅氧烷结构的抗原子氧聚酰亚胺杂化薄膜制备方法 |
JP2019128411A (ja) * | 2018-01-23 | 2019-08-01 | シャープ株式会社 | 配向膜付き基板、及び、液晶表示装置 |
JP2020033540A (ja) * | 2018-08-28 | 2020-03-05 | 日立化成株式会社 | シルセスキオキサン含有ポリイミド |
CN109228586B (zh) * | 2018-08-31 | 2021-06-15 | 株洲时代华鑫新材料技术有限公司 | 一种低介电聚酰亚胺复合薄膜及其制备方法 |
CN109825079B (zh) * | 2019-01-16 | 2021-08-17 | 复旦大学 | 一种浅色透明耐高温形状记忆聚酰亚胺薄膜材料及其制备方法 |
CN111430642B (zh) * | 2020-05-08 | 2022-06-10 | 乌海瑞森新能源材料有限公司 | 一种改性聚酰亚胺锂离子电池隔膜的制备方法 |
CN116171222A (zh) * | 2020-09-29 | 2023-05-26 | 东洋纺株式会社 | 无机基板和聚酰胺酸固化物的层叠体 |
-
2022
- 2022-06-24 JP JP2023531904A patent/JPWO2023276887A1/ja not_active Withdrawn
- 2022-06-24 KR KR1020237025632A patent/KR20240026123A/ko active Pending
- 2022-06-24 CN CN202280020731.5A patent/CN116964131A/zh active Pending
- 2022-06-24 WO PCT/JP2022/025342 patent/WO2023276887A1/ja active Application Filing
- 2022-06-24 TW TW111123598A patent/TW202319443A/zh unknown
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3653976B2 (ja) | 1997-08-11 | 2005-06-02 | 東亞合成株式会社 | 光カチオン硬化性樹脂組成物 |
JP2002146021A (ja) | 2000-11-10 | 2002-05-22 | Ube Ind Ltd | 可溶性、透明なポリイミドおよびその製造法 |
JP2002348374A (ja) | 2001-05-25 | 2002-12-04 | Hitachi Cable Ltd | ポリアミック酸又はポリイミド及び液晶配向剤 |
WO2003024870A1 (fr) | 2001-09-18 | 2003-03-27 | Chisso Corporation | Derives silsesquioxane et procede de fabrication |
JP2004331647A (ja) | 2003-03-13 | 2004-11-25 | Chisso Corp | シルセスキオキサン骨格を有する重合体および化合物 |
JP2006265243A (ja) | 2005-02-28 | 2006-10-05 | Chisso Corp | カゴ型ケイ素骨格を有する有機ケイ素化合物及び高分子化合物 |
JP2007302635A (ja) | 2006-05-15 | 2007-11-22 | Chisso Corp | シルセスキオキサン骨格を有する酸無水物および重合体 |
WO2008146637A1 (ja) | 2007-05-24 | 2008-12-04 | Mitsubishi Gas Chemical Company, Inc. | 無色透明樹脂フィルムの製造方法及び製造装置 |
CN110106508A (zh) | 2019-05-14 | 2019-08-09 | 中国科学院海洋研究所 | 一种用于海洋浪花飞溅区光生阴极保护的Bi2O2CO3/TiO2复合材料及方法 |
Non-Patent Citations (4)
Title |
---|
[비특허문헌 1] Thermochimica Acta 2004, 417, pp. 133-142 |
[비특허문헌 2] European Polymer Journal 2011, 47 (6), pp. 1328-1337 |
[비특허문헌 3] Chemistry Letters, 2014, Vol.43, No. 10, pp.1532-1534 |
[비특허문헌 4] Chemistry Letters, 2018, Vol.47, No. 12, pp.1530-1533 |
Also Published As
Publication number | Publication date |
---|---|
TW202319443A (zh) | 2023-05-16 |
JPWO2023276887A1 (enrdf_load_stackoverflow) | 2023-01-05 |
CN116964131A (zh) | 2023-10-27 |
WO2023276887A1 (ja) | 2023-01-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI641631B (zh) | 聚醯亞胺前驅體組成物、聚醯亞胺之製造方法、聚醯亞胺、聚醯亞胺膜及基板 | |
WO2016063988A1 (ja) | ポリイミド前駆体、ポリイミド、及びポリイミドフィルム | |
JP7069478B2 (ja) | ポリイミド、ポリイミド溶液組成物、ポリイミドフィルム、及び基板 | |
WO2020262450A1 (ja) | 樹脂フィルム、金属張積層体及びその製造方法 | |
WO2023276887A1 (ja) | ポリアミド酸、ポリイミド、及びその用途 | |
JP6798633B1 (ja) | ポリイミド前駆体組成物およびポリイミドフィルム/基材積層体 | |
JP7586281B2 (ja) | ポリイミド前駆体組成物およびポリイミドフィルム | |
WO2023276880A1 (ja) | ポリアミド酸、ポリイミド、及びその用途 | |
TWI775294B (zh) | 聚醯亞胺前驅體組合物及聚醯亞胺膜/基材積層體 | |
WO2023276864A1 (ja) | シルセスキオキサン化合物及びその製造方法 | |
JP7235157B1 (ja) | ポリイミド前駆体組成物、ポリイミドフィルムおよびポリイミドフィルム/基材積層体 | |
JP7722459B2 (ja) | ポリイミド前駆体組成物およびポリイミドフィルム | |
JP6947323B1 (ja) | ポリイミド前駆体組成物およびポリイミドフィルム | |
KR20250128950A (ko) | 폴리이미드 필름, 적층체, 플렉시블 전자 디바이스 및 플렉시블 전자 디바이스의 제조 방법 | |
WO2023013453A1 (ja) | 電子表示装置 | |
WO2021054476A1 (ja) | フレキシブル電子デバイスの製造方法 | |
CN115551949B (zh) | 聚酰亚胺前体组合物和聚酰亚胺膜/基材层积体 | |
TWI854552B (zh) | 聚醯亞胺前驅體組合物、聚醯亞胺膜及聚醯亞胺膜/基材積層體 | |
TW202413488A (zh) | 聚醯亞胺前驅體組合物、聚醯亞胺膜及聚醯亞胺膜/基材積層體 | |
WO2022114136A1 (ja) | ポリイミド前駆体組成物、ポリイミドフィルム、およびポリイミドフィルム/基材積層体 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PA0105 | International application |
Patent event date: 20230726 Patent event code: PA01051R01D Comment text: International Patent Application |
|
PG1501 | Laying open of application | ||
A201 | Request for examination | ||
PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20250519 Comment text: Request for Examination of Application |