KR20230104869A - 수지 조성물, 경화막, 절연막 또는 보호막, 안테나 소자, 그리고 전자 부품, 표시 장치 또는 반도체 장치 및 그의 제조 방법 - Google Patents

수지 조성물, 경화막, 절연막 또는 보호막, 안테나 소자, 그리고 전자 부품, 표시 장치 또는 반도체 장치 및 그의 제조 방법 Download PDF

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KR20230104869A
KR20230104869A KR1020237012118A KR20237012118A KR20230104869A KR 20230104869 A KR20230104869 A KR 20230104869A KR 1020237012118 A KR1020237012118 A KR 1020237012118A KR 20237012118 A KR20237012118 A KR 20237012118A KR 20230104869 A KR20230104869 A KR 20230104869A
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mol
resin
group
resin composition
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Korean (ko)
Inventor
유 쇼지
히토시 아라키
마사오 도미카와
히사시 오가사와라
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도레이 카부시키가이샤
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/22—Polybenzoxazoles
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/22—Exposing sequentially with the same light pattern different positions of the same surface
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020237012118A 2020-11-10 2021-10-18 수지 조성물, 경화막, 절연막 또는 보호막, 안테나 소자, 그리고 전자 부품, 표시 장치 또는 반도체 장치 및 그의 제조 방법 Pending KR20230104869A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020187043 2020-11-10
JPJP-P-2020-187043 2020-11-10
PCT/JP2021/038380 WO2022102345A1 (ja) 2020-11-10 2021-10-18 樹脂組成物、硬化膜、絶縁膜または保護膜、アンテナ素子、並びに電子部品、表示装置または半導体装置及びその製造方法

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KR20230104869A true KR20230104869A (ko) 2023-07-11

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KR1020237012118A Pending KR20230104869A (ko) 2020-11-10 2021-10-18 수지 조성물, 경화막, 절연막 또는 보호막, 안테나 소자, 그리고 전자 부품, 표시 장치 또는 반도체 장치 및 그의 제조 방법

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JP (1) JPWO2022102345A1 (https=)
KR (1) KR20230104869A (https=)
CN (1) CN116323755A (https=)
WO (1) WO2022102345A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023022123A1 (ja) * 2021-08-17 2023-02-23 ダイキン工業株式会社 含フッ素ポリアミド化合物および含フッ素ポリベンゾオキサゾール
CN121399186A (zh) * 2023-07-19 2026-01-23 东丽株式会社 树脂组合物、硬化物、有机电致发光显示装置、及半导体装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008224984A (ja) 2007-03-12 2008-09-25 Hitachi Chemical Dupont Microsystems Ltd 感光性樹脂組成物、該樹脂組成物を用いたパターン硬化膜の製造方法及び電子部品
JP2011197362A (ja) 2010-03-19 2011-10-06 Toray Ind Inc ポジ型感光性樹脂組成物

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4760126A (en) * 1984-11-13 1988-07-26 Hitachi, Ltd. Fluorine-containing polyamide-acid derivative and polyimide
JPH04306241A (ja) * 1991-01-17 1992-10-29 Sanyo Chem Ind Ltd コーティング材
JPH04288344A (ja) * 1991-03-18 1992-10-13 Sanyo Chem Ind Ltd 保護用フィルム、保護層を有する部材
JP2001254014A (ja) * 2000-01-05 2001-09-18 Toray Ind Inc 感光性ポリイミド前駆体組成物および金属箔−ポリイミド複合体
JP2001237241A (ja) * 2000-02-24 2001-08-31 Hitachi Ltd 低誘電率膜とそれを用いた半導体装置
CN112047913A (zh) * 2013-10-02 2020-12-08 大金工业株式会社 含氟络合化合物及使用其的含氟有机化合物的制造方法
SG11201706733UA (en) * 2015-03-04 2017-10-30 Toray Industries Photosensitive resin composition, method for manufacturing cured resin film, and semiconductor device
SG11201802613SA (en) * 2015-09-30 2018-04-27 Toray Industries Negative type coloring photosensitive resin composition, cured film, element, and display device
JP7210999B2 (ja) * 2018-10-22 2023-01-24 東レ株式会社 樹脂組成物、樹脂シート、硬化膜、硬化膜の製造方法、半導体装置および表示装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008224984A (ja) 2007-03-12 2008-09-25 Hitachi Chemical Dupont Microsystems Ltd 感光性樹脂組成物、該樹脂組成物を用いたパターン硬化膜の製造方法及び電子部品
JP2011197362A (ja) 2010-03-19 2011-10-06 Toray Ind Inc ポジ型感光性樹脂組成物

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CN116323755A (zh) 2023-06-23
JPWO2022102345A1 (https=) 2022-05-19
WO2022102345A1 (ja) 2022-05-19

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