CN116323755A - 树脂组合物、固化膜、绝缘膜或保护膜、天线元件、以及电子部件、显示装置或半导体装置和其制造方法 - Google Patents

树脂组合物、固化膜、绝缘膜或保护膜、天线元件、以及电子部件、显示装置或半导体装置和其制造方法 Download PDF

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Publication number
CN116323755A
CN116323755A CN202180068562.8A CN202180068562A CN116323755A CN 116323755 A CN116323755 A CN 116323755A CN 202180068562 A CN202180068562 A CN 202180068562A CN 116323755 A CN116323755 A CN 116323755A
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mol
resin
resin composition
group
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CN202180068562.8A
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Chinese (zh)
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庄司优
荒木齐
富川真佐夫
小笠原央
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Toray Industries Inc
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Toray Industries Inc
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Publication of CN116323755A publication Critical patent/CN116323755A/zh
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/22—Polybenzoxazoles
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/22—Exposing sequentially with the same light pattern different positions of the same surface
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN202180068562.8A 2020-11-10 2021-10-18 树脂组合物、固化膜、绝缘膜或保护膜、天线元件、以及电子部件、显示装置或半导体装置和其制造方法 Pending CN116323755A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020187043 2020-11-10
JP2020-187043 2020-11-10
PCT/JP2021/038380 WO2022102345A1 (ja) 2020-11-10 2021-10-18 樹脂組成物、硬化膜、絶縁膜または保護膜、アンテナ素子、並びに電子部品、表示装置または半導体装置及びその製造方法

Publications (1)

Publication Number Publication Date
CN116323755A true CN116323755A (zh) 2023-06-23

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CN202180068562.8A Pending CN116323755A (zh) 2020-11-10 2021-10-18 树脂组合物、固化膜、绝缘膜或保护膜、天线元件、以及电子部件、显示装置或半导体装置和其制造方法

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JP (1) JPWO2022102345A1 (https=)
KR (1) KR20230104869A (https=)
CN (1) CN116323755A (https=)
WO (1) WO2022102345A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023022123A1 (ja) * 2021-08-17 2023-02-23 ダイキン工業株式会社 含フッ素ポリアミド化合物および含フッ素ポリベンゾオキサゾール
CN121399186A (zh) * 2023-07-19 2026-01-23 东丽株式会社 树脂组合物、硬化物、有机电致发光显示装置、及半导体装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001237241A (ja) * 2000-02-24 2001-08-31 Hitachi Ltd 低誘電率膜とそれを用いた半導体装置
JP2001254014A (ja) * 2000-01-05 2001-09-18 Toray Ind Inc 感光性ポリイミド前駆体組成物および金属箔−ポリイミド複合体
CN107407869A (zh) * 2015-03-04 2017-11-28 东丽株式会社 感光性树脂组合物，树脂固化膜的制造方法及半导体器件
CN108027562A (zh) * 2015-09-30 2018-05-11 东丽株式会社 负型着色感光性树脂组合物、固化膜、元件及显示装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4760126A (en) * 1984-11-13 1988-07-26 Hitachi, Ltd. Fluorine-containing polyamide-acid derivative and polyimide
JPH04306241A (ja) * 1991-01-17 1992-10-29 Sanyo Chem Ind Ltd コーティング材
JPH04288344A (ja) * 1991-03-18 1992-10-13 Sanyo Chem Ind Ltd 保護用フィルム、保護層を有する部材
JP5386781B2 (ja) 2007-03-12 2014-01-15 日立化成デュポンマイクロシステムズ株式会社 感光性樹脂組成物、該樹脂組成物を用いたパターン硬化膜の製造方法及び電子部品
JP5640413B2 (ja) 2010-03-19 2014-12-17 東レ株式会社 ポジ型感光性樹脂組成物
CN112047913A (zh) * 2013-10-02 2020-12-08 大金工业株式会社 含氟络合化合物及使用其的含氟有机化合物的制造方法
JP7210999B2 (ja) * 2018-10-22 2023-01-24 東レ株式会社 樹脂組成物、樹脂シート、硬化膜、硬化膜の製造方法、半導体装置および表示装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001254014A (ja) * 2000-01-05 2001-09-18 Toray Ind Inc 感光性ポリイミド前駆体組成物および金属箔−ポリイミド複合体
JP2001237241A (ja) * 2000-02-24 2001-08-31 Hitachi Ltd 低誘電率膜とそれを用いた半導体装置
CN107407869A (zh) * 2015-03-04 2017-11-28 东丽株式会社 感光性树脂组合物，树脂固化膜的制造方法及半导体器件
CN108027562A (zh) * 2015-09-30 2018-05-11 东丽株式会社 负型着色感光性树脂组合物、固化膜、元件及显示装置

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TW202235486A (zh) 2022-09-16
JPWO2022102345A1 (https=) 2022-05-19
WO2022102345A1 (ja) 2022-05-19

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